ZHCSGV6F June   2009  – January 2017 TMS320C6742

PRODUCTION DATA.  

  1. 1器件概述
    1. 1.1 特性
    2. 1.2 应用
    3. 1.3 说明
    4. 1.4 功能方框图
  2. 2Revision History
  3. 3Device Comparison
    1. 3.1 Device Characteristics
    2. 3.2 Device Compatibility
    3. 3.3 DSP Subsystem
      1. 3.3.1 C674x DSP CPU Description
      2. 3.3.2 DSP Memory Mapping
        1. 3.3.2.1 External Memories
        2. 3.3.2.2 DSP Internal Memories
        3. 3.3.2.3 C674x CPU
    4. 3.4 Memory Map Summary
      1. Table 3-4 C6742 Top Level Memory Map
    5. 3.5 Pin Assignments
      1. 3.5.1 Pin Map (Bottom View)
    6. 3.6 Pin Multiplexing Control
    7. 3.7 Terminal Functions
      1. 3.7.1  Device Reset, NMI and JTAG
      2. 3.7.2  High-Frequency Oscillator and PLL
      3. 3.7.3  Real-Time Clock and 32-kHz Oscillator
      4. 3.7.4  DEEPSLEEP Power Control
      5. 3.7.5  External Memory Interface A (EMIFA)
      6. 3.7.6  DDR2/mDDR Controller
      7. 3.7.7  Serial Peripheral Interface Modules (SPI)
      8. 3.7.8  Enhanced Capture/Auxiliary PWM Modules (eCAP0)
      9. 3.7.9  Enhanced Pulse Width Modulators (eHRPWM)
      10. 3.7.10 Boot
      11. 3.7.11 Universal Asynchronous Receiver/Transmitters (UART0)
      12. 3.7.12 Inter-Integrated Circuit Modules(I2C0)
      13. 3.7.13 Timers
      14. 3.7.14 Multichannel Audio Serial Ports (McASP)
      15. 3.7.15 Multichannel Buffered Serial Ports (McBSP)
      16. 3.7.16 Universal Host-Port Interface (UHPI)
      17. 3.7.17 General Purpose Input Output
      18. 3.7.18 Reserved and No Connect
      19. 3.7.19 Supply and Ground
    8. 3.8 Unused Pin Configurations
  4. 4Device Configuration
    1. 4.1 Boot Modes
    2. 4.2 SYSCFG Module
    3. 4.3 Pullup/Pulldown Resistors
  5. 5Specifications
    1. 5.1 Absolute Maximum Ratings Over Operating Junction Temperature Range (Unless Otherwise Noted)
    2. 5.2 Handling Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Notes on Recommended Power-On Hours (POH)
    5. 5.5 Electrical Characteristics Over Recommended Ranges of Supply Voltage and Operating Junction Temperature (Unless Otherwise Noted)
  6. 6Peripheral Information and Electrical Specifications
    1. 6.1  Parameter Information
      1. 6.1.1 Parameter Information Device-Specific Information
        1. 6.1.1.1 Signal Transition Levels
    2. 6.2  Recommended Clock and Control Signal Transition Behavior
    3. 6.3  Power Supplies
      1. 6.3.1 Power-On Sequence
      2. 6.3.2 Power-Off Sequence
    4. 6.4  Reset
      1. 6.4.1 Power-On Reset (POR)
      2. 6.4.2 Warm Reset
      3. 6.4.3 Reset Electrical Data Timings
    5. 6.5  Crystal Oscillator or External Clock Input
    6. 6.6  Clock PLLs
      1. 6.6.1 PLL Device-Specific Information
      2. 6.6.2 Device Clock Generation
      3. 6.6.3 Dynamic Voltage and Frequency Scaling (DVFS)
    7. 6.7  Interrupts
      1. 6.7.1 DSP Interrupts
    8. 6.8  Power and Sleep Controller (PSC)
      1. 6.8.1 Power Domain and Module Topology
        1. 6.8.1.1 Power Domain States
        2. 6.8.1.2 Module States
    9. 6.9  Enhanced Direct Memory Access Controller (EDMA3)
      1. 6.9.1 EDMA3 Channel Synchronization Events
      2. 6.9.2 EDMA3 Peripheral Register Descriptions
    10. 6.10 External Memory Interface A (EMIFA)
      1. 6.10.1 EMIFA Asynchronous Memory Support
      2. 6.10.2 EMIFA Synchronous DRAM Memory Support
      3. 6.10.3 EMIFA SDRAM Loading Limitations
      4. 6.10.4 EMIFA Connection Examples
      5. 6.10.5 External Memory Interface Register Descriptions
      6. 6.10.6 EMIFA Electrical Data/Timing
        1. Table 6-19 Timing Requirements for EMIFA SDRAM Interface
        2. Table 6-20 Switching Characteristics for EMIFA SDRAM Interface
        3. Table 6-21 Timing Requirements for EMIFA Asynchronous Memory Interface
    11. 6.11 DDR2/mDDR Memory Controller
      1. 6.11.1 DDR2/mDDR Memory Controller Electrical Data/Timing
      2. 6.11.2 DDR2/mDDR Memory Controller Register Description(s)
      3. 6.11.3 DDR2/mDDR Interface
        1. 6.11.3.1  DDR2/mDDR Interface Schematic
        2. 6.11.3.2  Compatible JEDEC DDR2/mDDR Devices
        3. 6.11.3.3  PCB Stackup
        4. 6.11.3.4  Placement
        5. 6.11.3.5  DDR2/mDDR Keep Out Region
        6. 6.11.3.6  Bulk Bypass Capacitors
        7. 6.11.3.7  High-Speed Bypass Capacitors
        8. 6.11.3.8  Net Classes
        9. 6.11.3.9  DDR2/mDDR Signal Termination
        10. 6.11.3.10 VREF Routing
        11. 6.11.3.11 DDR2/mDDR CK and ADDR_CTRL Routing
        12. 6.11.3.12 DDR2/mDDR Boundary Scan Limitations
    12. 6.12 Memory Protection Units
    13. 6.13 Multichannel Audio Serial Port (McASP)
      1. 6.13.1 McASP Peripheral Registers Description(s)
      2. 6.13.2 McASP Electrical Data/Timing
        1. 6.13.2.1 Multichannel Audio Serial Port 0 (McASP0) Timing
          1. Table 6-42 Timing Requirements for McASP0 (1.2V, 1.1V)
          2. Table 6-43 Timing Requirements for McASP0 (1.0V)
          3. Table 6-44 Switching Characteristics for McASP0 (1.2V, 1.1V)
          4. Table 6-45 Switching Characteristics for McASP0 (1.0V)
    14. 6.14 Multichannel Buffered Serial Port (McBSP)
      1. 6.14.1 McBSP Peripheral Register Description(s)
      2. 6.14.2 McBSP Electrical Data/Timing
        1. 6.14.2.1 Multichannel Buffered Serial Port (McBSP) Timing
          1. Table 6-47 Timing Requirements for McBSP1 [1.2V, 1.1V] (see )
          2. Table 6-48 Timing Requirements for McBSP1 [1.0V] (see )
          3. Table 6-49 Switching Characteristics for McBSP1 [1.2V, 1.1V] (see )
          4. Table 6-50 Switching Characteristics for McBSP1 [1.0V] (see )
          5. Table 6-51 Timing Requirements for McBSP1 FSR When GSYNC = 1 (see )
    15. 6.15 Serial Peripheral Interface Ports (SPI1)
      1. 6.15.1 SPI Peripheral Registers Description(s)
      2. 6.15.2 SPI Electrical Data/Timing
        1. 6.15.2.1 Serial Peripheral Interface (SPI) Timing
          1. Table 6-53 General Timing Requirements for SPI1 Master Modes
          2. Table 6-54 General Timing Requirements for SPI1 Slave Modes
          3. Table 6-55 Additional SPI1 Master Timings, 4-Pin Enable Option
          4. Table 6-56 Additional SPI1 Master Timings, 4-Pin Chip Select Option
    16. 6.16 Inter-Integrated Circuit Serial Ports (I2C)
      1. 6.16.1 I2C Device-Specific Information
      2. 6.16.2 I2C Peripheral Registers Description(s)
      3. 6.16.3 I2C Electrical Data/Timing
        1. 6.16.3.1 Inter-Integrated Circuit (I2C) Timing
          1. Table 6-62 Timing Requirements for I2C Input
          2. Table 6-63 Switching Characteristics for I2C
    17. 6.17 Universal Asynchronous Receiver/Transmitter (UART)
      1. 6.17.1 UART Peripheral Registers Description(s)
      2. 6.17.2 UART Electrical Data/Timing
        1. Table 6-65 Timing Requirements for UART Receive (see )
        2. Table 6-66 Switching Characteristics Over Recommended Operating Conditions for UARTx Transmit (see )
    18. 6.18 Host-Port Interface (UHPI)
      1. 6.18.1 HPI Device-Specific Information
      2. 6.18.2 HPI Peripheral Register Description(s)
      3. 6.18.3 HPI Electrical Data/Timing
        1. Table 6-68 Timing Requirements for Host-Port Interface [1.2V, 1.1V]
        2. Table 6-69 Switching Characteristics Over Recommended Operating Conditions for Host-Port Interface [1.2V, 1.1V]
        3. Table 6-70 Switching Characteristics Over Recommended Operating Conditions for Host-Port Interface [1.0V]
    19. 6.19 Enhanced Capture (eCAP) Peripheral
      1. Table 6-72 Timing Requirements for Enhanced Capture (eCAP)
      2. Table 6-73 Switching Characteristics Over Recommended Operating Conditions for eCAP
    20. 6.20 Enhanced High-Resolution Pulse-Width Modulator (eHRPWM)
      1. 6.20.1 Enhanced Pulse Width Modulator (eHRPWM) Timing
        1. Table 6-75 Timing Requirements for eHRPWM
        2. Table 6-76 Switching Characteristics Over Recommended Operating Conditions for eHRPWM
      2. 6.20.2 Trip-Zone Input Timing
    21. 6.21 Timers
      1. 6.21.1 Timer Electrical Data/Timing
        1. Table 6-79 Timing Requirements for Timer Input (see )
        2. Table 6-80 Switching Characteristics Over Recommended Operating Conditions for Timer Output
    22. 6.22 Real Time Clock (RTC)
      1. 6.22.1 Clock Source
      2. 6.22.2 Real-Time Clock Register Descriptions
    23. 6.23 General-Purpose Input/Output (GPIO)
      1. 6.23.1 GPIO Register Description(s)
      2. 6.23.2 GPIO Peripheral Input/Output Electrical Data/Timing
        1. Table 6-83 Timing Requirements for GPIO Inputs (see )
        2. Table 6-84 Switching Characteristics Over Recommended Operating Conditions for GPIO Outputs (see )
      3. 6.23.3 GPIO Peripheral External Interrupts Electrical Data/Timing
        1. Table 6-85 Timing Requirements for External Interrupts (see )
    24. 6.24 Emulation Logic
      1. 6.24.1 JTAG Port Description
      2. 6.24.2 Scan Chain Configuration Parameters
      3. 6.24.3 Initial Scan Chain Configuration
      4. 6.24.4 IEEE 1149.1 JTAG
        1. 6.24.4.1 JTAG Peripheral Register Description(s) – JTAG ID Register (DEVIDR0)
        2. 6.24.4.2 JTAG Test-Port Electrical Data/Timing
          1. Table 6-91 Timing Requirements for JTAG Test Port (see )
          2. Table 6-92 Switching Characteristics Over Recommended Operating Conditions for JTAG Test Port (see )
      5. 6.24.5 JTAG 1149.1 Boundary Scan Considerations
  7. 7Device and Documentation Support
    1. 7.1 Device Nomenclature
    2. 7.2 Tools and Software
    3. 7.3 Documentation Support
    4. 7.4 社区资源
    5. 7.5 商标
    6. 7.6 静电放电警告
    7. 7.7 出口管制提示
    8. 7.8 术语表
  8. 8Mechanical Packaging and Orderable Information
    1. 8.1 Thermal Data for ZCE Package
    2. 8.2 Thermal Data for ZWT Package
    3. 8.3 Packaging Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • ZWT|361
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.11.3.7 High-Speed Bypass Capacitors

High-speed (HS) bypass capacitors are critical for proper DDR2/mDDR interface operation. It is particularly important to minimize the parasitic series inductance of the HS bypass cap, DSP/DDR2/mDDR power, and DSP/DDR2/mDDR ground connections. Table 6-30 contains the specification for the HS bypass capacitors as well as for the power connections on the PCB.

Table 6-30 High-Speed Bypass Capacitors

NO. PARAMETER MIN MAX UNIT
1 HS Bypass Capacitor Package Size(1) 0402 10 Mils
2 Distance from HS bypass capacitor to device being bypassed 250 Mils
3 Number of connection vias for each HS bypass capacitor 2(4) Vias
4 Trace length from bypass capacitor contact to connection via 1 30 Mils
5 Number of connection vias for each DDR2/mDDR device power or ground balls 1 Vias
6 Trace length from DDR2/mDDR device power ball to connection via 35 Mils
7 DDR_DVDD18 Supply HS Bypass Capacitor Count(2) 10 Devices
8 DDR_DVDD18 Supply HS Bypass Capacitor Total Capacitance 0.6 μF
9 DDR#1 HS Bypass Capacitor Count(2) 8 Devices
10 DDR#1 HS Bypass Capacitor Total Capacitance 0.4 μF
11 DDR#2 HS Bypass Capacitor Count(2)(3) 8 Devices
12 DDR#2 HS Bypass Capacitor Total Capacitance(3) 0.4 μF
(1) LxW, 10 mil units, i.e., a 0402 is a 40x20 mil surface mount capacitor
(2) These devices should be placed as close as possible to the device being bypassed.
(3) Only used on dual-memory systems.
(4) An additional HS bypass capacitor can share the connection vias only if it is mounted on the opposite side of the board.
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