ZHCS898O October   2003  – March 2019 TMS320F2801 , TMS320F28015 , TMS320F28016 , TMS320F2802 , TMS320F2806 , TMS320F2808 , TMS320F2809

PRODUCTION DATA.  

  1. 1器件概述
    1. 1.1 特性
    2. 1.2 应用
    3. 1.3 说明
    4. 1.4 功能方框图
  2. 2修订历史记录
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagrams
    2. 4.2 Signal Descriptions
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings – Automotive
    3. 5.3  ESD Ratings – Commercial
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Power Consumption Summary
      1. Table 5-1 TMS320F2809, TMS320F2808 Current Consumption by Power-Supply Pins at 100-MHz SYSCLKOUT
      2. Table 5-2 TMS320F2806 Current Consumption by Power-Supply Pins at 100-MHz SYSCLKOUT
      3. Table 5-3 TMS320F2802, TMS320F2801 Current Consumption by Power-Supply Pins at 100-MHz SYSCLKOUT
      4. Table 5-4 TMS320C2802, TMS320C2801 Current Consumption by Power-Supply Pins at 100-MHz SYSCLKOUT
      5. 5.5.1     Reducing Current Consumption
      6. 5.5.2     Current Consumption Graphs
    6. 5.6  Electrical Characteristics
    7. 5.7  Thermal Resistance Characteristics for F280x 100-Ball GGM Package
    8. 5.8  Thermal Resistance Characteristics for F280x 100-Pin PZ Package
    9. 5.9  Thermal Resistance Characteristics for C280x 100-Ball GGM Package
    10. 5.10 Thermal Resistance Characteristics for C280x 100-Pin PZ Package
    11. 5.11 Thermal Resistance Characteristics for F2809 100-Ball GGM Package
    12. 5.12 Thermal Resistance Characteristics for F2809 100-Pin PZ Package
    13. 5.13 Thermal Design Considerations
    14. 5.14 Timing and Switching Characteristics
      1. 5.14.1 Timing Parameter Symbology
        1. 5.14.1.1 General Notes on Timing Parameters
        2. 5.14.1.2 Test Load Circuit
        3. 5.14.1.3 Device Clock Table
          1. Table 5-6 TMS320x280x Clock Table and Nomenclature (100-MHz Devices)
          2. Table 5-7 TMS320x280x/2801x Clock Table and Nomenclature (60-MHz Devices)
      2. 5.14.2 Power Sequencing
        1. Table 5-8 Reset (XRS) Timing Requirements
      3. 5.14.3 Clock Requirements and Characteristics
        1. Table 5-9  Input Clock Frequency
        2. Table 5-10 XCLKIN Timing Requirements - PLL Enabled
        3. Table 5-11 XCLKIN Timing Requirements - PLL Disabled
        4. Table 5-12 XCLKOUT Switching Characteristics (PLL Bypassed or Enabled)
      4. 5.14.4 Peripherals
        1. 5.14.4.1 General-Purpose Input/Output (GPIO)
          1. 5.14.4.1.1 GPIO - Output Timing
            1. Table 5-13 General-Purpose Output Switching Characteristics
          2. 5.14.4.1.2 GPIO - Input Timing
            1. Table 5-14 General-Purpose Input Timing Requirements
          3. 5.14.4.1.3 Sampling Window Width for Input Signals
          4. 5.14.4.1.4 Low-Power Mode Wakeup Timing
            1. Table 5-15 IDLE Mode Timing Requirements
            2. Table 5-16 IDLE Mode Switching Characteristics
            3. Table 5-17 STANDBY Mode Timing Requirements
            4. Table 5-18 STANDBY Mode Switching Characteristics
            5. Table 5-19 HALT Mode Timing Requirements
            6. Table 5-20 HALT Mode Switching Characteristics
        2. 5.14.4.2 Enhanced Control Peripherals
          1. 5.14.4.2.1 Enhanced Pulse Width Modulator (ePWM) Timing
            1. Table 5-21 ePWM Timing Requirements
            2. Table 5-22 ePWM Switching Characteristics
          2. 5.14.4.2.2 Trip-Zone Input Timing
            1. Table 5-23 Trip-Zone input Timing Requirements
          3. 5.14.4.2.3 High-Resolution PWM Timing
            1. Table 5-24 High-Resolution PWM Characteristics at SYSCLKOUT = 60–100 MHz
          4. 5.14.4.2.4 Enhanced Capture (eCAP) Timing
            1. Table 5-25 Enhanced Capture (eCAP) Timing Requirement
            2. Table 5-26 eCAP Switching Characteristics
          5. 5.14.4.2.5 Enhanced Quadrature Encoder Pulse (eQEP) Timing
            1. Table 5-27 Enhanced Quadrature Encoder Pulse (eQEP) Timing Requirements
            2. Table 5-28 eQEP Switching Characteristics
          6. 5.14.4.2.6 ADC Start-of-Conversion Timing
            1. Table 5-29 External ADC Start-of-Conversion Switching Characteristics
        3. 5.14.4.3 External Interrupt Timing
          1. Table 5-30 External Interrupt Timing Requirements
          2. Table 5-31 External Interrupt Switching Characteristics
        4. 5.14.4.4 I2C Electrical Specification and Timing
          1. Table 5-32 I2C Timing
        5. 5.14.4.5 Serial Peripheral Interface (SPI) Timing
          1. 5.14.4.5.1 SPI Master Mode Timing
            1. Table 5-33 SPI Master Mode External Timing (Clock Phase = 0)
            2. Table 5-34 SPI Master Mode External Timing (Clock Phase = 1)
          2. 5.14.4.5.2 SPI Slave Mode Timing
            1. Table 5-35 SPI Slave Mode External Timing (Clock Phase = 0)
            2. Table 5-36 SPI Slave Mode External Timing (Clock Phase = 1)
      5. 5.14.5 Emulator Connection Without Signal Buffering for the DSP
      6. 5.14.6 Flash Timing
        1. Table 5-37 Flash Endurance for A and S Temperature Material
        2. Table 5-38 Flash Endurance for Q Temperature Material
        3. Table 5-39 Flash Parameters at 100-MHz SYSCLKOUT
        4. Table 5-40 Flash/OTP Access Timing
        5. Table 5-41 Flash Data Retention Duration
    15. 5.15 On-Chip Analog-to-Digital Converter
      1. Table 5-43 ADC Electrical Characteristics
      2. 5.15.1     ADC Power-Up Control Bit Timing
        1. Table 5-44 ADC Power-Up Delays
        2. Table 5-45 Current Consumption for Different ADC Configurations (at 12.5-MHz ADCCLK)
      3. 5.15.2     Definitions
      4. 5.15.3     Sequential Sampling Mode (Single-Channel) (SMODE = 0)
        1. Table 5-46 Sequential Sampling Mode Timing
      5. 5.15.4     Simultaneous Sampling Mode (Dual-Channel) (SMODE = 1)
        1. Table 5-47 Simultaneous Sampling Mode Timing
      6. 5.15.5     Detailed Descriptions
    16. 5.16 Migrating From F280x Devices to C280x Devices
      1. 5.16.1 Migration Issues
    17. 5.17 ROM Timing (C280x only)
      1. Table 5-48 ROM/OTP Access Timing
  6. 6Detailed Description
    1. 6.1 Brief Descriptions
      1. 6.1.1  C28x CPU
      2. 6.1.2  Memory Bus (Harvard Bus Architecture)
      3. 6.1.3  Peripheral Bus
      4. 6.1.4  Real-Time JTAG and Analysis
      5. 6.1.5  Flash
      6. 6.1.6  ROM
      7. 6.1.7  M0, M1 SARAMs
      8. 6.1.8  L0, L1, H0 SARAMs
      9. 6.1.9  Boot ROM
      10. 6.1.10 Security
      11. 6.1.11 Peripheral Interrupt Expansion (PIE) Block
      12. 6.1.12 External Interrupts (XINT1, XINT2, XNMI)
      13. 6.1.13 Oscillator and PLL
      14. 6.1.14 Watchdog
      15. 6.1.15 Peripheral Clocking
      16. 6.1.16 Low-Power Modes
      17. 6.1.17 Peripheral Frames 0, 1, 2 (PFn)
      18. 6.1.18 General-Purpose Input/Output (GPIO) Multiplexer
      19. 6.1.19 32-Bit CPU-Timers (0, 1, 2)
      20. 6.1.20 Control Peripherals
      21. 6.1.21 Serial Port Peripherals
    2. 6.2 Peripherals
      1. 6.2.1  32-Bit CPU-Timers 0/1/2
      2. 6.2.2  Enhanced PWM Modules (ePWM1/2/3/4/5/6)
      3. 6.2.3  Hi-Resolution PWM (HRPWM)
      4. 6.2.4  Enhanced CAP Modules (eCAP1/2/3/4)
      5. 6.2.5  Enhanced QEP Modules (eQEP1/2)
      6. 6.2.6  Enhanced Analog-to-Digital Converter (ADC) Module
        1. 6.2.6.1 ADC Connections if the ADC Is Not Used
        2. 6.2.6.2 ADC Registers
      7. 6.2.7  Enhanced Controller Area Network (eCAN) Modules (eCAN-A and eCAN-B)
      8. 6.2.8  Serial Communications Interface (SCI) Modules (SCI-A, SCI-B)
      9. 6.2.9  Serial Peripheral Interface (SPI) Modules (SPI-A, SPI-B, SPI-C, SPI-D)
      10. 6.2.10 Inter-Integrated Circuit (I2C)
      11. 6.2.11 GPIO MUX
    3. 6.3 Memory Maps
    4. 6.4 Register Map
      1. 6.4.1 Device Emulation Registers
    5. 6.5 Interrupts
      1. 6.5.1 External Interrupts
    6. 6.6 System Control
      1. 6.6.1 OSC and PLL Block
        1. 6.6.1.1 External Reference Oscillator Clock Option
        2. 6.6.1.2 PLL-Based Clock Module
        3. 6.6.1.3 Loss of Input Clock
      2. 6.6.2 Watchdog Block
    7. 6.7 Low-Power Modes Block
  7. 7Applications, Implementation, and Layout
    1. 7.1 TI Design or Reference Design
  8. 8器件和文档支持
    1. 8.1 开始使用
    2. 8.2 器件和开发支持工具命名规则
    3. 8.3 工具与软件
    4. 8.4 文档支持
    5. 8.5 相关链接
    6. 8.6 Community Resources
    7. 8.7 商标
    8. 8.8 静电放电警告
    9. 8.9 Glossary
  9. 9机械、封装和可订购信息
    1. 9.1 封装信息

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • PZ|100
  • NMF|100
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.2.8 Serial Communications Interface (SCI) Modules (SCI-A, SCI-B)

The 280x devicesinclude two serial communications interface (SCI) modules. The SCI modules support digital communications between the CPU and other asynchronous peripherals that use the standard non-return-to-zero (NRZ) format. The SCI receiver and transmitter are double-buffered, and each has its own separate enable and interrupt bits. Both can be operated independently or simultaneously in the full-duplex mode. To ensure data integrity, the SCI checks received data for break detection, parity, overrun, and framing errors. The bit rate is programmable to over 65000 different speeds through a 16-bit baud-select register.

Features of each SCI module include:

  • Two external pins:
    • SCITXD: SCI transmit-output pin
    • SCIRXD: SCI receive-input pin

      • NOTE: Both pins can be used as GPIO if not used for SCI.

    • Baud rate programmable to 64K different rates:
    • TMS320F2809 TMS320F2808 TMS320F2806 TMS320F2802 TMS320F2801 TMS320C2802 TMS320C2801 TMS320F28016 TMS320F28015 q_lspclk_des_prs230.gif
  • Data-word format
    • One start bit
    • Data-word length programmable from one to eight bits
    • Optional even/odd/no parity bit
    • One or two stop bits
  • Four error-detection flags: parity, overrun, framing, and break detection
  • Two wake-up multiprocessor modes: idle-line and address bit
  • Half- or full-duplex operation
  • Double-buffered receive and transmit functions
  • Transmitter and receiver operations can be accomplished through interrupt-driven or polled algorithms with status flags.
    • Transmitter: TXRDY flag (transmitter-buffer register is ready to receive another character) and TX EMPTY flag (transmitter-shift register is empty)
    • Receiver: RXRDY flag (receiver-buffer register is ready to receive another character), BRKDT flag (break condition occurred), and RX ERROR flag (monitoring four interrupt conditions)
  • Separate enable bits for transmitter and receiver interrupts (except BRKDT)
  • TMS320F2809 TMS320F2808 TMS320F2806 TMS320F2802 TMS320F2801 TMS320C2802 TMS320C2801 TMS320F28016 TMS320F28015 q_100mhz_des_prs230.gif
  • NRZ (non-return-to-zero) format
  • Ten SCI module control registers located in the control register frame beginning at address 7050h

    • NOTE

    All registers in this module are 8-bit registers that are connected to Peripheral Frame 2. When a register is accessed, the register data is in the lower byte (7–0), and the upper byte (15–8) is read as zeros. Writing to the upper byte has no effect.

Enhanced features:

  • Auto baud-detect hardware logic
  • 16-level transmit/receive FIFO

The SCI port operation is configured and controlled by the registers listed in Table 6-9 and Table 6-10.

Table 6-9 SCI-A Registers(1)

NAME ADDRESS SIZE (x16) DESCRIPTION
SCICCRA 0x7050 1 SCI-A Communications Control Register
SCICTL1A 0x7051 1 SCI-A Control Register 1
SCIHBAUDA 0x7052 1 SCI-A Baud Register, High Bits
SCILBAUDA 0x7053 1 SCI-A Baud Register, Low Bits
SCICTL2A 0x7054 1 SCI-A Control Register 2
SCIRXSTA 0x7055 1 SCI-A Receive Status Register
SCIRXEMUA 0x7056 1 SCI-A Receive Emulation Data Buffer Register
SCIRXBUFA 0x7057 1 SCI-A Receive Data Buffer Register
SCITXBUFA 0x7059 1 SCI-A Transmit Data Buffer Register
SCIFFTXA(2) 0x705A 1 SCI-A FIFO Transmit Register
SCIFFRXA(2) 0x705B 1 SCI-A FIFO Receive Register
SCIFFCTA(2) 0x705C 1 SCI-A FIFO Control Register
SCIPRIA 0x705F 1 SCI-A Priority Control Register
(1) Registers in this table are mapped to Peripheral Frame 2 space. This space only allows 16-bit accesses. 32-bit accesses produce undefined results.
(2) These registers are new registers for the FIFO mode.

Table 6-10 SCI-B Registers(1)(2)

NAME ADDRESS SIZE (x16) DESCRIPTION
SCICCRB 0x7750 1 SCI-B Communications Control Register
SCICTL1B 0x7751 1 SCI-B Control Register 1
SCIHBAUDB 0x7752 1 SCI-B Baud Register, High Bits
SCILBAUDB 0x7753 1 SCI-B Baud Register, Low Bits
SCICTL2B 0x7754 1 SCI-B Control Register 2
SCIRXSTB 0x7755 1 SCI-B Receive Status Register
SCIRXEMUB 0x7756 1 SCI-B Receive Emulation Data Buffer Register
SCIRXBUFB 0x7757 1 SCI-B Receive Data Buffer Register
SCITXBUFB 0x7759 1 SCI-B Transmit Data Buffer Register
SCIFFTXB(2) 0x775A 1 SCI-B FIFO Transmit Register
SCIFFRXB(2) 0x775B 1 SCI-B FIFO Receive Register
SCIFFCTB(2) 0x775C 1 SCI-B FIFO Control Register
SCIPRIB 0x775F 1 SCI-B Priority Control Register
(1) Registers in this table are mapped to peripheral bus 16 space. This space only allows 16-bit accesses. 32-bit accesses produce undefined results.
(2) These registers are new registers for the FIFO mode.

Figure 6-13 shows the SCI module block diagram.

TMS320F2809 TMS320F2808 TMS320F2806 TMS320F2802 TMS320F2801 TMS320C2802 TMS320C2801 TMS320F28016 TMS320F28015 scimod_prs230.gifFigure 6-13 Serial Communications Interface (SCI) Module Block Diagram
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