ZHCSIE4A June   2018  – July 2018 TMS320F28035-EP

PRODUCTION DATA.  

  1. 1器件概述
    1. 1.1 特性
    2. 1.2 应用范围
    3. 1.3 说明
    4. 1.4 功能方框图
  2. 2修订历史记录
  3. 3Terminal Configuration and Functions
    1. 3.1 Pin Diagram
    2. 3.2 Signal Descriptions
      1. Table 3-1 Signal Descriptions
  4. 4Specifications
    1. 4.1  Absolute Maximum Ratings
    2. 4.2  ESD Ratings
    3. 4.3  Power-On Hours (POH) Limits
    4. 4.4  Recommended Operating Conditions
    5. 4.5  Power Consumption Summary
      1. Table 4-1 TMS320F2803x Current Consumption at 60-MHz SYSCLKOUT
      2. 4.5.1     Reducing Current Consumption
      3. 4.5.2     Current Consumption Graphs (VREG Enabled)
    6. 4.6  Electrical Characteristics
    7. 4.7  Thermal Resistance Characteristics
    8. 4.8  Thermal Design Considerations
    9. 4.9  Emulator Connection Without Signal Buffering for the MCU
    10. 4.10 Parameter Information
      1. 4.10.1 Timing Parameter Symbology
      2. 4.10.2 General Notes on Timing Parameters
    11. 4.11 Test Load Circuit
    12. 4.12 Power Sequencing
      1. Table 4-4 Reset (XRS) Timing Requirements
      2. Table 4-5 Reset (XRS) Switching Characteristics
    13. 4.13 Clock Specifications
      1. 4.13.1 Device Clock Table
        1. Table 4-6 2803x Clock Table and Nomenclature (60-MHz Devices)
        2. Table 4-7 Device Clocking Requirements/Characteristics
        3. Table 4-8 Internal Zero-Pin Oscillator (INTOSC1/INTOSC2) Characteristics
      2. 4.13.2 Clock Requirements and Characteristics
        1. Table 4-9  XCLKIN Timing Requirements – PLL Enabled
        2. Table 4-10 XCLKIN Timing Requirements – PLL Disabled
        3. Table 4-11 XCLKOUT Switching Characteristics (PLL Bypassed or Enabled)
    14. 4.14 Flash Timing
      1. Table 4-12 Flash/OTP Endurance
      2. Table 4-13 Flash Parameters at 60-MHz SYSCLKOUT
      3. Table 4-14 Flash/OTP Access Timing
      4. Table 4-15 Flash Data Retention Duration
  5. 5Detailed Description
    1. 5.1 Overview
      1. 5.1.1  CPU
      2. 5.1.2  Control Law Accelerator (CLA)
      3. 5.1.3  Memory Bus (Harvard Bus Architecture)
      4. 5.1.4  Peripheral Bus
      5. 5.1.5  Real-Time JTAG and Analysis
      6. 5.1.6  Flash
      7. 5.1.7  M0, M1 SARAMs
      8. 5.1.8  L0 SARAM, and L1, L2, and L3 DPSARAMs
      9. 5.1.9  Boot ROM
        1. 5.1.9.1 Emulation Boot
        2. 5.1.9.2 GetMode
        3. 5.1.9.3 Peripheral Pins Used by the Bootloader
      10. 5.1.10 Security
      11. 5.1.11 Peripheral Interrupt Expansion (PIE) Block
      12. 5.1.12 External Interrupts (XINT1–XINT3)
      13. 5.1.13 Internal Zero Pin Oscillators, Oscillator, and PLL
      14. 5.1.14 Watchdog
      15. 5.1.15 Peripheral Clocking
      16. 5.1.16 Low-power Modes
      17. 5.1.17 Peripheral Frames 0, 1, 2, 3 (PFn)
      18. 5.1.18 General-Purpose Input/Output (GPIO) Multiplexer
      19. 5.1.19 32-Bit CPU-Timers (0, 1, 2)
      20. 5.1.20 Control Peripherals
      21. 5.1.21 Serial Port Peripherals
    2. 5.2 Memory Maps
    3. 5.3 Register Maps
    4. 5.4 Device Emulation Registers
    5. 5.5 VREG/BOR/POR
      1. 5.5.1 On-chip Voltage Regulator (VREG)
        1. 5.5.1.1 Using the On-chip VREG
        2. 5.5.1.2 Disabling the On-chip VREG
      2. 5.5.2 On-chip Power-On Reset (POR) and Brown-Out Reset (BOR) Circuit
    6. 5.6 System Control
      1. 5.6.1 Internal Zero Pin Oscillators
      2. 5.6.2 Crystal Oscillator Option
      3. 5.6.3 PLL-Based Clock Module
      4. 5.6.4 Loss of Input Clock (NMI Watchdog Function)
      5. 5.6.5 CPU-Watchdog Module
    7. 5.7 Low-Power Modes Block
    8. 5.8 Interrupts
      1. 5.8.1 External Interrupts
        1. 5.8.1.1 External Interrupt Electrical Data/Timing
          1. Table 5-20 External Interrupt Timing Requirements
          2. Table 5-21 External Interrupt Switching Characteristics
    9. 5.9 Peripherals
      1. 5.9.1  Control Law Accelerator (CLA) Overview
      2. 5.9.2  Analog Block
        1. 5.9.2.1 Analog-to-Digital Converter (ADC)
          1. 5.9.2.1.1 Features
          2. 5.9.2.1.2 ADC Start-of-Conversion Electrical Data/Timing
            1. Table 5-26 External ADC Start-of-Conversion Switching Characteristics
          3. 5.9.2.1.3 On-Chip Analog-to-Digital Converter (ADC) Electrical Data/Timing
            1. Table 5-27  ADC Electrical Characteristics
            2. Table 5-28  ADC Power Modes
            3. 5.9.2.1.3.1 Internal Temperature Sensor
              1. Table 5-29 Temperature Sensor Coefficient
            4. 5.9.2.1.3.2 ADC Power-Up Control Bit Timing
              1. Table 5-30 ADC Power-Up Delays
            5. 5.9.2.1.3.3 ADC Sequential and Simultaneous Timings
        2. 5.9.2.2 ADC MUX
        3. 5.9.2.3 Comparator Block
          1. 5.9.2.3.1 On-Chip Comparator/DAC Electrical Data/Timing
            1. Table 5-32 Electrical Characteristics of the Comparator/DAC
      3. 5.9.3  Detailed Descriptions
      4. 5.9.4  Serial Peripheral Interface (SPI) Module
        1. 5.9.4.1 SPI Master Mode Electrical Data/Timing
          1. Table 5-35 SPI Master Mode External Timing (Clock Phase = 0)
          2. Table 5-36 SPI Master Mode External Timing (Clock Phase = 1)
        2. 5.9.4.2 SPI Slave Mode Electrical Data/Timing
          1. Table 5-37 SPI Slave Mode External Timing (Clock Phase = 0)
          2. Table 5-38 SPI Slave Mode External Timing (Clock Phase = 1)
      5. 5.9.5  Serial Communications Interface (SCI) Module
      6. 5.9.6  Local Interconnect Network (LIN)
      7. 5.9.7  Enhanced Controller Area Network (eCAN) Module
      8. 5.9.8  Inter-Integrated Circuit (I2C)
        1. 5.9.8.1 I2C Electrical Data/Timing
          1. Table 5-44 I2C Timing Requirements
          2. Table 5-45 I2C Switching Characteristics
      9. 5.9.9  Enhanced PWM Modules (ePWM1/2/3/4/5/6/7)
        1. 5.9.9.1 ePWM Electrical Data/Timing
          1. Table 5-48 ePWM Timing Requirements
          2. Table 5-49 ePWM Switching Characteristics
        2. 5.9.9.2 Trip-Zone Input Timing
          1. Table 5-50 Trip-Zone Input Timing Requirements
      10. 5.9.10 High-Resolution PWM (HRPWM)
        1. 5.9.10.1 HRPWM Electrical Data/Timing
          1. Table 5-51 High-Resolution PWM Characteristics
      11. 5.9.11 Enhanced Capture Module (eCAP1)
        1. 5.9.11.1 eCAP Electrical Data/Timing
          1. Table 5-53 Enhanced Capture (eCAP) Timing Requirement
          2. Table 5-54 eCAP Switching Characteristics
      12. 5.9.12 High-Resolution Capture (HRCAP) Module
        1. 5.9.12.1 HRCAP Electrical Data/Timing
          1. Table 5-56 High-Resolution Capture (HRCAP) Timing Requirements
      13. 5.9.13 Enhanced Quadrature Encoder Pulse (eQEP)
        1. 5.9.13.1 eQEP Electrical Data/Timing
          1. Table 5-58 Enhanced Quadrature Encoder Pulse (eQEP) Timing Requirements
          2. Table 5-59 eQEP Switching Characteristics
      14. 5.9.14 JTAG Port
      15. 5.9.15 General-Purpose Input/Output (GPIO) MUX
        1. 5.9.15.1 GPIO Electrical Data/Timing
          1. 5.9.15.1.1 GPIO - Output Timing
            1. Table 5-63 General-Purpose Output Switching Characteristics
          2. 5.9.15.1.2 GPIO - Input Timing
            1. Table 5-64 General-Purpose Input Timing Requirements
          3. 5.9.15.1.3 Sampling Window Width for Input Signals
          4. 5.9.15.1.4 Low-Power Mode Wakeup Timing
            1. Table 5-65 IDLE Mode Timing Requirements
            2. Table 5-66 IDLE Mode Switching Characteristics
            3. Table 5-67 STANDBY Mode Timing Requirements
            4. Table 5-68 STANDBY Mode Switching Characteristics
            5. Table 5-69 HALT Mode Timing Requirements
            6. Table 5-70 HALT Mode Switching Characteristics
  6. 6Applications, Implementation, and Layout
    1. 6.1 TI Design or Reference Design
  7. 7器件和文档支持
    1. 7.1 使用入门
    2. 7.2 器件和开发支持工具命名规则
    3. 7.3 工具和软件
    4. 7.4 文档支持
    5. 7.5 Community Resources
    6. 7.6 商标
    7. 7.7 静电放电警告
    8. 7.8 术语表
  8. 8机械、封装和可订购信息
    1. 8.1 封装信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.6.5 CPU-Watchdog Module

The CPU-watchdog module on the 28035 device is similar to the one used on the 281x/280x/283xx devices. This module generates an output pulse, 512 oscillator clocks wide (OSCCLK), whenever the 8-bit watchdog up counter has reached its maximum value. To prevent this, the user must disable the counter or the software must periodically write a 0x55 + 0xAA sequence into the watchdog key register that resets the watchdog counter. Figure 5-8 shows the various functional blocks within the watchdog module.

Normally, when the input clocks are present, the CPU-watchdog counter decrements to initiate a CPU-watchdog reset or WDINT interrupt. However, when the external input clock fails, the CPU-watchdog counter stops decrementing (that is, the watchdog counter does not change with the limp-mode clock).

NOTE

The CPU-watchdog is different from the NMI watchdog. It is the legacy watchdog that is present in all 28x devices.

NOTE

Applications in which the correct CPU operating frequency is absolutely critical should implement a mechanism by which the MCU will be held in reset, should the input clocks ever fail. For example, an R-C circuit may be used to trigger the XRS pin of the MCU, should the capacitor ever get fully charged. An I/O pin may be used to discharge the capacitor on a periodic basis to prevent it from getting fully charged. Such a circuit would also help in detecting failure of the flash memory.
TMS320F28035-EP fbd_wdmod_prs523.gif
A. The WDRST signal is driven low for 512 OSCCLK cycles.
Figure 5-8 CPU-watchdog Module

The WDINT signal enables the watchdog to be used as a wakeup from IDLE/STANDBY mode.

In STANDBY mode, all peripherals are turned off on the device. The only peripheral that remains functional is the CPU-watchdog. This module will run off OSCCLK. The WDINT signal is fed to the LPM block so that it can wake the device from STANDBY (if enabled). See Section 5.7, Low-power Modes Block, for more details.

In IDLE mode, the WDINT signal can generate an interrupt to the CPU, through the PIE, to take the CPU out of IDLE mode.

In HALT mode, the CPU-watchdog can be used to wake up the device through a device reset.
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