ZHCS009J November   2010  – September 2021 TMS320F28062 , TMS320F28062F , TMS320F28063 , TMS320F28064 , TMS320F28065 , TMS320F28066 , TMS320F28067 , TMS320F28068F , TMS320F28068M , TMS320F28069 , TMS320F28069F , TMS320F28069M

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1. 3.1 功能方框图
    2. 3.2 系统器件图
  4. 4 Revision History
  5. 5 Device Comparison
    1. 5.1 Related Products
  6. 6 Terminal Configuration and Functions
    1. 6.1 Pin Diagrams
    2. 6.2 Signal Descriptions
      1. 6.2.1 Signal Descriptions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings – Commercial
    3. 7.3  ESD Ratings – Automotive
    4. 7.4  Recommended Operating Conditions
    5. 7.5  Power Consumption Summary
      1. 7.5.1 TMS320F2806x Current Consumption at 90-MHz SYSCLKOUT
      2. 7.5.2 Reducing Current Consumption
      3. 7.5.3 Current Consumption Graphs (VREG Enabled)
    6. 7.6  Electrical Characteristics
    7. 7.7  Thermal Resistance Characteristics
      1. 7.7.1 PFP PowerPAD Package
      2. 7.7.2 PZP PowerPAD Package
      3. 7.7.3 PN Package
      4. 7.7.4 PZ Package
    8. 7.8  Thermal Design Considerations
    9. 7.9  Debug Probe Connection Without Signal Buffering for the MCU
    10. 7.10 Parameter Information
      1. 7.10.1 Timing Parameter Symbology
      2. 7.10.2 General Notes on Timing Parameters
    11. 7.11 Test Load Circuit
    12. 7.12 Power Sequencing
      1. 7.12.1 Reset ( XRS) Timing Requirements
      2. 7.12.2 Reset ( XRS) Switching Characteristics
    13. 7.13 Clock Specifications
      1. 7.13.1 Device Clock Table
        1. 7.13.1.1 2806x Clock Table and Nomenclature (90-MHz Devices)
        2. 7.13.1.2 Device Clocking Requirements/Characteristics
        3. 7.13.1.3 Internal Zero-Pin Oscillator (INTOSC1/INTOSC2) Characteristics
      2. 7.13.2 Clock Requirements and Characteristics
        1. 7.13.2.1 XCLKIN Timing Requirements – PLL Enabled
        2. 7.13.2.2 XCLKIN Timing Requirements – PLL Disabled
        3. 7.13.2.3 XCLKOUT Switching Characteristics (PLL Bypassed or Enabled)
    14. 7.14 Flash Timing
      1. 7.14.1 Flash/OTP Endurance for T Temperature Material
      2. 7.14.2 Flash/OTP Endurance for S Temperature Material
      3. 7.14.3 Flash/OTP Endurance for Q Temperature Material
      4. 7.14.4 Flash Parameters at 90-MHz SYSCLKOUT
      5. 7.14.5 Flash/OTP Access Timing
      6. 7.14.6 Flash Data Retention Duration
  8. 8 Detailed Description
    1. 8.1 Overview
      1. 8.1.1  CPU
      2. 8.1.2  Control Law Accelerator (CLA)
      3. 8.1.3  Viterbi, Complex Math, CRC Unit (VCU)
      4. 8.1.4  Memory Bus (Harvard Bus Architecture)
      5. 8.1.5  Peripheral Bus
      6. 8.1.6  Real-Time JTAG and Analysis
      7. 8.1.7  Flash
      8. 8.1.8  M0, M1 SARAMs
      9. 8.1.9  L4 SARAM, and L0, L1, L2, L3, L5, L6, L7, and L8 DPSARAMs
      10. 8.1.10 Boot ROM
        1. 8.1.10.1 Debug Boot
        2. 8.1.10.2 GetMode
        3. 8.1.10.3 Peripheral Pins Used by the Bootloader
      11. 8.1.11 Security
      12. 8.1.12 Peripheral Interrupt Expansion (PIE) Block
      13. 8.1.13 External Interrupts (XINT1 to XINT3)
      14. 8.1.14 Internal Zero Pin Oscillators, Oscillator, and PLL
      15. 8.1.15 Watchdog
      16. 8.1.16 Peripheral Clocking
      17. 8.1.17 Low-power Modes
      18. 8.1.18 Peripheral Frames 0, 1, 2, 3 (PFn)
      19. 8.1.19 General-Purpose Input/Output (GPIO) Multiplexer
      20. 8.1.20 32-Bit CPU-Timers (0, 1, 2)
      21. 8.1.21 Control Peripherals
      22. 8.1.22 Serial Port Peripherals
    2. 8.2 Memory Maps
    3. 8.3 Register Maps
    4. 8.4 Device Debug Registers
    5. 8.5 VREG, BOR, POR
      1. 8.5.1 On-chip VREG
        1. 8.5.1.1 Using the On-chip VREG
        2. 8.5.1.2 Disabling the On-chip VREG
      2. 8.5.2 On-chip Power-On Reset (POR) and Brownout Reset (BOR) Circuit
    6. 8.6 System Control
      1. 8.6.1 Internal Zero Pin Oscillators
      2. 8.6.2 Crystal Oscillator Option
      3. 8.6.3 PLL-Based Clock Module
      4. 8.6.4 USB and HRCAP PLL Module (PLL2)
      5. 8.6.5 Loss of Input Clock (NMI Watchdog Function)
      6. 8.6.6 CPU Watchdog Module
    7. 8.7 Low-power Modes Block
    8. 8.8 Interrupts
      1. 8.8.1 External Interrupts
        1. 8.8.1.1 External Interrupt Electrical Data/Timing
          1. 8.8.1.1.1 External Interrupt Timing Requirements
          2. 8.8.1.1.2 External Interrupt Switching Characteristics
    9. 8.9 Peripherals
      1. 8.9.1  CLA Overview
      2. 8.9.2  Analog Block
        1. 8.9.2.1 Analog-to-Digital Converter (ADC)
          1. 8.9.2.1.1 Features
          2. 8.9.2.1.2 ADC Start-of-Conversion Electrical Data/Timing
            1. 8.9.2.1.2.1 External ADC Start-of-Conversion Switching Characteristics
          3. 8.9.2.1.3 On-Chip Analog-to-Digital Converter (ADC) Electrical Data/Timing
            1. 8.9.2.1.3.1 ADC Electrical Characteristics
            2. 8.9.2.1.3.2 ADC Power Modes
            3. 8.9.2.1.3.3 Internal Temperature Sensor
              1. 8.9.2.1.3.3.1 Temperature Sensor Coefficient
            4. 8.9.2.1.3.4 ADC Power-Up Control Bit Timing
              1. 8.9.2.1.3.4.1 ADC Power-Up Delays
            5. 8.9.2.1.3.5 ADC Sequential and Simultaneous Timings
        2. 8.9.2.2 ADC MUX
        3. 8.9.2.3 Comparator Block
          1. 8.9.2.3.1 On-Chip Comparator/DAC Electrical Data/Timing
            1. 8.9.2.3.1.1 Electrical Characteristics of the Comparator/DAC
      3. 8.9.3  Detailed Descriptions
      4. 8.9.4  Serial Peripheral Interface (SPI) Module
        1. 8.9.4.1 SPI Master Mode Electrical Data/Timing
          1. 8.9.4.1.1 SPI Master Mode External Timing (Clock Phase = 0)
          2. 8.9.4.1.2 SPI Master Mode External Timing (Clock Phase = 1)
        2. 8.9.4.2 SPI Slave Mode Electrical Data/Timing
          1. 8.9.4.2.1 SPI Slave Mode External Timing (Clock Phase = 0)
          2. 8.9.4.2.2 SPI Slave Mode External Timing (Clock Phase = 1)
      5. 8.9.5  Serial Communications Interface (SCI) Module
      6. 8.9.6  Multichannel Buffered Serial Port (McBSP) Module
        1. 8.9.6.1 McBSP Electrical Data/Timing
          1. 8.9.6.1.1 McBSP Transmit and Receive Timing
            1. 8.9.6.1.1.1 McBSP Timing Requirements
            2. 8.9.6.1.1.2 McBSP Switching Characteristics
          2. 8.9.6.1.2 McBSP as SPI Master or Slave Timing
            1. 8.9.6.1.2.1 McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 10b, CLKXP = 0)
            2. 8.9.6.1.2.2 McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 10b, CLKXP = 0)
            3. 8.9.6.1.2.3 McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 11b, CLKXP = 0)
            4. 8.9.6.1.2.4 McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 11b, CLKXP = 0)
            5. 8.9.6.1.2.5 McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 10b, CLKXP = 1)
            6. 8.9.6.1.2.6 McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 10b, CLKXP = 1)
            7. 8.9.6.1.2.7 McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 11b, CLKXP = 1)
            8. 8.9.6.1.2.8 McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 11b, CLKXP = 1)
      7. 8.9.7  Enhanced Controller Area Network (eCAN) Module
      8. 8.9.8  Inter-Integrated Circuit (I2C)
        1. 8.9.8.1 I2C Electrical Data/Timing
          1. 8.9.8.1.1 I2C Timing Requirements
          2. 8.9.8.1.2 I2C Switching Characteristics
      9. 8.9.9  Enhanced Pulse Width Modulator (ePWM) Modules (ePWM1 to ePWM8)
        1. 8.9.9.1 ePWM Electrical Data/Timing
          1. 8.9.9.1.1 ePWM Timing Requirements
          2. 8.9.9.1.2 ePWM Switching Characteristics
        2. 8.9.9.2 Trip-Zone Input Timing
          1. 8.9.9.2.1 Trip-Zone Input Timing Requirements
      10. 8.9.10 High-Resolution PWM (HRPWM)
        1. 8.9.10.1 HRPWM Electrical Data/Timing
          1. 8.9.10.1.1 High-Resolution PWM Characteristics
      11. 8.9.11 Enhanced Capture Module (eCAP1)
        1. 8.9.11.1 eCAP Electrical Data/Timing
          1. 8.9.11.1.1 Enhanced Capture (eCAP) Timing Requirement
          2. 8.9.11.1.2 eCAP Switching Characteristics
      12. 8.9.12 High-Resolution Capture Modules (HRCAP1 to HRCAP4)
        1. 8.9.12.1 HRCAP Electrical Data/Timing
          1. 8.9.12.1.1 High-Resolution Capture (HRCAP) Timing Requirements
      13. 8.9.13 Enhanced Quadrature Encoder Modules (eQEP1, eQEP2)
        1. 8.9.13.1 eQEP Electrical Data/Timing
          1. 8.9.13.1.1 Enhanced Quadrature Encoder Pulse (eQEP) Timing Requirements
          2. 8.9.13.1.2 eQEP Switching Characteristics
      14. 8.9.14 JTAG Port
      15. 8.9.15 General-Purpose Input/Output (GPIO) MUX
        1. 8.9.15.1 GPIO Electrical Data/Timing
          1. 8.9.15.1.1 GPIO Output Timing
            1. 8.9.15.1.1.1 General-Purpose Output Switching Characteristics
          2. 8.9.15.1.2 GPIO Input Timing
            1. 8.9.15.1.2.1 General-Purpose Input Timing Requirements
          3. 8.9.15.1.3 Sampling Window Width for Input Signals
          4. 8.9.15.1.4 Low-Power Mode Wakeup Timing
            1. 8.9.15.1.4.1 IDLE Mode Timing Requirements
            2. 8.9.15.1.4.2 IDLE Mode Switching Characteristics
            3. 8.9.15.1.4.3 STANDBY Mode Timing Requirements
            4. 8.9.15.1.4.4 STANDBY Mode Switching Characteristics
            5. 8.9.15.1.4.5 HALT Mode Timing Requirements
            6. 8.9.15.1.4.6 HALT Mode Switching Characteristics
      16. 8.9.16 Universal Serial Bus (USB)
        1. 8.9.16.1 USB Electrical Data/Timing
          1. 8.9.16.1.1 USB Input Ports DP and DM Timing Requirements
          2. 8.9.16.1.2 USB Output Ports DP and DM Switching Characteristics
  9. 9 Applications, Implementation, and Layout
    1. 9.1 TI Reference Design
  10. 10Device and Documentation Support
    1. 10.1 Device and Development Support Tool Nomenclature
    2. 10.2 Tools and Software
    3. 10.3 Documentation Support
    4. 10.4 支持资源
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 术语表
  11. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Packaging Information

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8.2 Memory Maps

In Figure 8-1 through Figure 8-8, the following apply:

  • Memory blocks are not to scale.
  • Peripheral Frame 0, Peripheral Frame 1, Peripheral Frame 2, and Peripheral Frame 3 memory maps are restricted to data memory only. A user program cannot access these memory maps in program space.
  • Protected means the order of Write-followed-by-Read operations is preserved rather than the pipeline order.
  • Certain memory ranges are EALLOW protected against spurious writes after configuration.
  • Locations 0x3D 7C80–0x3D 7CC0 contain the internal oscillator and ADC calibration routines. These locations are not programmable by the user.
  • All devices with USB have the USB control registers mapped from 0x4000 to 0x4FFF and 2K ×16 RAM from 0x40000 to 0x40800. When the clock to the USB module is enabled, this RAM is connected to the USB controller and acts as the FIFO RAM. When the clock to the USB module is disabled, this RAM is remapped to the CPU-accessible address space and can be used as general-purpose RAM.

GUID-A9A97B97-3B6D-4E53-AEE1-51F85CB1B165-low.gif
On non-USB devices, 0x00 4000–0x00 4FFF is Reserved.
FAST™ and SpinTAC™ libraries exist only on F2806xM and F2806xF devices.
The ROM contents from 0x3F 8000–0x3F F3AF differ between F2806x parts and F2806xM/F2806xF parts. See the respective memory map figures in the Boot ROM chapter of the TMS320x2806x Technical Reference Manual .
Figure 8-1 28069, 28069F, 28069M Memory Map
GUID-588432FD-25C2-425C-9711-4AF3D84255A7-low.gif
On non-USB devices, 0x00 4000–0x00 4FFF is Reserved.
FAST™ and SpinTAC™ libraries exist only on F2806xM and F2806xF devices.
The ROM contents from 0x3F 8000–0x3F F3AF differ between F2806x parts and F2806xM/F2806xF parts. See the respective memory map figures in the Boot ROM chapter of the TMS320x2806x Technical Reference Manual .
Figure 8-2 28068F, 28068M Memory Map
GUID-7645E509-8AD3-4CCC-8A55-8EF33CBD934B-low.gif
On non-USB devices, 0x00 4000–0x00 4FFF is Reserved.
Figure 8-3 28067 Memory Map
GUID-E24E195F-796F-439E-A6EC-610E4D4C2DBE-low.gif
On non-USB devices, 0x00 4000–0x00 4FFF is Reserved.
Figure 8-4 28066 Memory Map
GUID-2CFB6DF6-53E9-4896-A375-BBBF5790B3D1-low.gif
On non-USB devices, 0x00 4000–0x00 4FFF is Reserved.
Figure 8-5 28065 Memory Map
GUID-7E8DB7E0-AE37-4451-B573-2A49C73BD228-low.gif
On non-USB devices, 0x00 4000–0x00 4FFF is Reserved.
Figure 8-6 28064 Memory Map
GUID-FB4C3FDC-8C37-4125-99F0-D2140FFA597D-low.gif
On non-USB devices, 0x00 4000–0x00 4FFF is Reserved.
Figure 8-7 28063 Memory Map
GUID-6464199A-7389-49A0-8658-7525AAADCDC7-low.gif
On non-USB devices, 0x00 4000–0x00 4FFF is Reserved.
FAST™ and SpinTAC™ libraries exist only on F2806xM and F2806xF devices.
The ROM contents from 0x3F 8000–0x3F F3AF differ between F2806x parts and F2806xM/F2806xF parts. See the respective memory map figures in the Boot ROM chapter of the TMS320x2806x Technical Reference Manual .
Figure 8-8 28062, 28062F Memory Map
Table 8-3 Addresses of Flash Sectors in 28069, 28069F, 28069M,
28068F, 28068M, F28067, F28066
ADDRESS RANGEPROGRAM AND DATA SPACE
0x3D 8000 to 0x3D BFFFSector H (16K × 16)
0x3D C000 to 0x3D FFFFSector G (16K × 16)
0x3E 0000 to 0x3E 3FFFSector F (16K × 16)
0x3E 4000 to 0x3E 7FFFSector E (16K × 16)
0x3E 8000 to 0x3E BFFFSector D (16K × 16)
0x3E C000 to 0x3E FFFFSector C (16K × 16)
0x3F 0000 to 0x3F 3FFFSector B (16K × 16)
0x3F 4000 to 0x3F 7FF5Sector A (16K × 16)
0x3F 7FF6 to 0x3F 7FF7Boot-to-Flash Entry Point
(program branch instruction here)
0x3F 7FF8 to 0x3F 7FFFSecurity Password (128-Bit)
(Do not program to all zeros)
Table 8-4 Addresses of Flash Sectors in F28065, F28064, F28063, 28062, 28062F
ADDRESS RANGEPROGRAM AND DATA SPACE
0x3E 8000 to 0x3E 9FFFSector H (8K × 16)
0x3E A000 to 0x3E BFFFSector G (8K × 16)
0x3E C000 to 0x3E DFFFSector F (8K × 16)
0x3E E000 to 0x3E FFFFSector E (8K × 16)
0x3F 0000 to 0x3F 1FFFSector D (8K × 16)
0x3F 2000 to 0x3F 3FFFSector C (8K × 16)
0x3F 4000 to 0x3F 5FFFSector B (8K × 16)
0x3F 6000 to 0x3F 7FF5Sector A (8K × 16)
0x3F 7FF6 to 0x3F 7FF7Boot-to-Flash Entry Point
(program branch instruction here)
0x3F 7FF8 to 0x3F 7FFFSecurity Password (128-Bit)
(Do not program to all zeros)
Note:

Addresses 0x3F 7FF0 to 0x3F 7FF5 are reserved for data and should not contain program code.

Peripheral Frame 1 and Peripheral Frame 2 are grouped together to enable these blocks to be write/read peripheral block protected. The protected mode makes sure that all accesses to these blocks happen as written. Because of the pipeline, a write immediately followed by a read to different memory locations, will appear in reverse order on the memory bus of the CPU. This can cause problems in certain peripheral applications where the user expected the write to occur first (as written). The CPU supports a block protection mode where a region of memory can be protected so that operations occur as written (the penalty is extra cycles are added to align the operations). This mode is programmable and by default, it protects the selected zones.

The wait states for the various spaces in the memory map area are listed in Table 8-5.

Table 8-5 Wait States
AREAWAIT STATES (CPU)COMMENTS
M0 and M1 SARAMs0-waitFixed
Peripheral Frame 00-wait
Peripheral Frame 10-wait (writes)Cycles can be extended by peripheral-generated ready.
2-wait (reads)Back-to-back write operations to Peripheral Frame 1 registers will incur a 1-cycle stall (1-cycle delay).
Peripheral Frame 20-wait (writes)Fixed. Cycles cannot be extended by the peripheral.
2-wait (reads)
Peripheral Frame 30-wait (writes)Assumes no conflict between CPU and CLA/DMA cycles. The wait states can be extended by peripheral-generated ready.
2-wait (reads)
L0–L8 SARAM0-wait data and programAssumes no CPU conflicts
OTPProgrammableProgrammed through the Flash registers.
1-wait minimum1-wait is minimum number of wait states allowed.
FLASHProgrammableProgrammed through the Flash registers.
0-wait Paged min
1-wait Random min
Random ≥ Paged
FLASH Password16-wait fixedWait states of password locations are fixed.
Boot-ROM0-wait
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