ZHCS009J November   2010  – September 2021 TMS320F28062 , TMS320F28062F , TMS320F28063 , TMS320F28064 , TMS320F28065 , TMS320F28066 , TMS320F28067 , TMS320F28068F , TMS320F28068M , TMS320F28069 , TMS320F28069F , TMS320F28069M

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1. 3.1 功能方框图
    2. 3.2 系统器件图
  4. 4 Revision History
  5. 5 Device Comparison
    1. 5.1 Related Products
  6. 6 Terminal Configuration and Functions
    1. 6.1 Pin Diagrams
    2. 6.2 Signal Descriptions
      1. 6.2.1 Signal Descriptions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings – Commercial
    3. 7.3  ESD Ratings – Automotive
    4. 7.4  Recommended Operating Conditions
    5. 7.5  Power Consumption Summary
      1. 7.5.1 TMS320F2806x Current Consumption at 90-MHz SYSCLKOUT
      2. 7.5.2 Reducing Current Consumption
      3. 7.5.3 Current Consumption Graphs (VREG Enabled)
    6. 7.6  Electrical Characteristics
    7. 7.7  Thermal Resistance Characteristics
      1. 7.7.1 PFP PowerPAD Package
      2. 7.7.2 PZP PowerPAD Package
      3. 7.7.3 PN Package
      4. 7.7.4 PZ Package
    8. 7.8  Thermal Design Considerations
    9. 7.9  Debug Probe Connection Without Signal Buffering for the MCU
    10. 7.10 Parameter Information
      1. 7.10.1 Timing Parameter Symbology
      2. 7.10.2 General Notes on Timing Parameters
    11. 7.11 Test Load Circuit
    12. 7.12 Power Sequencing
      1. 7.12.1 Reset ( XRS) Timing Requirements
      2. 7.12.2 Reset ( XRS) Switching Characteristics
    13. 7.13 Clock Specifications
      1. 7.13.1 Device Clock Table
        1. 7.13.1.1 2806x Clock Table and Nomenclature (90-MHz Devices)
        2. 7.13.1.2 Device Clocking Requirements/Characteristics
        3. 7.13.1.3 Internal Zero-Pin Oscillator (INTOSC1/INTOSC2) Characteristics
      2. 7.13.2 Clock Requirements and Characteristics
        1. 7.13.2.1 XCLKIN Timing Requirements – PLL Enabled
        2. 7.13.2.2 XCLKIN Timing Requirements – PLL Disabled
        3. 7.13.2.3 XCLKOUT Switching Characteristics (PLL Bypassed or Enabled)
    14. 7.14 Flash Timing
      1. 7.14.1 Flash/OTP Endurance for T Temperature Material
      2. 7.14.2 Flash/OTP Endurance for S Temperature Material
      3. 7.14.3 Flash/OTP Endurance for Q Temperature Material
      4. 7.14.4 Flash Parameters at 90-MHz SYSCLKOUT
      5. 7.14.5 Flash/OTP Access Timing
      6. 7.14.6 Flash Data Retention Duration
  8. 8 Detailed Description
    1. 8.1 Overview
      1. 8.1.1  CPU
      2. 8.1.2  Control Law Accelerator (CLA)
      3. 8.1.3  Viterbi, Complex Math, CRC Unit (VCU)
      4. 8.1.4  Memory Bus (Harvard Bus Architecture)
      5. 8.1.5  Peripheral Bus
      6. 8.1.6  Real-Time JTAG and Analysis
      7. 8.1.7  Flash
      8. 8.1.8  M0, M1 SARAMs
      9. 8.1.9  L4 SARAM, and L0, L1, L2, L3, L5, L6, L7, and L8 DPSARAMs
      10. 8.1.10 Boot ROM
        1. 8.1.10.1 Debug Boot
        2. 8.1.10.2 GetMode
        3. 8.1.10.3 Peripheral Pins Used by the Bootloader
      11. 8.1.11 Security
      12. 8.1.12 Peripheral Interrupt Expansion (PIE) Block
      13. 8.1.13 External Interrupts (XINT1 to XINT3)
      14. 8.1.14 Internal Zero Pin Oscillators, Oscillator, and PLL
      15. 8.1.15 Watchdog
      16. 8.1.16 Peripheral Clocking
      17. 8.1.17 Low-power Modes
      18. 8.1.18 Peripheral Frames 0, 1, 2, 3 (PFn)
      19. 8.1.19 General-Purpose Input/Output (GPIO) Multiplexer
      20. 8.1.20 32-Bit CPU-Timers (0, 1, 2)
      21. 8.1.21 Control Peripherals
      22. 8.1.22 Serial Port Peripherals
    2. 8.2 Memory Maps
    3. 8.3 Register Maps
    4. 8.4 Device Debug Registers
    5. 8.5 VREG, BOR, POR
      1. 8.5.1 On-chip VREG
        1. 8.5.1.1 Using the On-chip VREG
        2. 8.5.1.2 Disabling the On-chip VREG
      2. 8.5.2 On-chip Power-On Reset (POR) and Brownout Reset (BOR) Circuit
    6. 8.6 System Control
      1. 8.6.1 Internal Zero Pin Oscillators
      2. 8.6.2 Crystal Oscillator Option
      3. 8.6.3 PLL-Based Clock Module
      4. 8.6.4 USB and HRCAP PLL Module (PLL2)
      5. 8.6.5 Loss of Input Clock (NMI Watchdog Function)
      6. 8.6.6 CPU Watchdog Module
    7. 8.7 Low-power Modes Block
    8. 8.8 Interrupts
      1. 8.8.1 External Interrupts
        1. 8.8.1.1 External Interrupt Electrical Data/Timing
          1. 8.8.1.1.1 External Interrupt Timing Requirements
          2. 8.8.1.1.2 External Interrupt Switching Characteristics
    9. 8.9 Peripherals
      1. 8.9.1  CLA Overview
      2. 8.9.2  Analog Block
        1. 8.9.2.1 Analog-to-Digital Converter (ADC)
          1. 8.9.2.1.1 Features
          2. 8.9.2.1.2 ADC Start-of-Conversion Electrical Data/Timing
            1. 8.9.2.1.2.1 External ADC Start-of-Conversion Switching Characteristics
          3. 8.9.2.1.3 On-Chip Analog-to-Digital Converter (ADC) Electrical Data/Timing
            1. 8.9.2.1.3.1 ADC Electrical Characteristics
            2. 8.9.2.1.3.2 ADC Power Modes
            3. 8.9.2.1.3.3 Internal Temperature Sensor
              1. 8.9.2.1.3.3.1 Temperature Sensor Coefficient
            4. 8.9.2.1.3.4 ADC Power-Up Control Bit Timing
              1. 8.9.2.1.3.4.1 ADC Power-Up Delays
            5. 8.9.2.1.3.5 ADC Sequential and Simultaneous Timings
        2. 8.9.2.2 ADC MUX
        3. 8.9.2.3 Comparator Block
          1. 8.9.2.3.1 On-Chip Comparator/DAC Electrical Data/Timing
            1. 8.9.2.3.1.1 Electrical Characteristics of the Comparator/DAC
      3. 8.9.3  Detailed Descriptions
      4. 8.9.4  Serial Peripheral Interface (SPI) Module
        1. 8.9.4.1 SPI Master Mode Electrical Data/Timing
          1. 8.9.4.1.1 SPI Master Mode External Timing (Clock Phase = 0)
          2. 8.9.4.1.2 SPI Master Mode External Timing (Clock Phase = 1)
        2. 8.9.4.2 SPI Slave Mode Electrical Data/Timing
          1. 8.9.4.2.1 SPI Slave Mode External Timing (Clock Phase = 0)
          2. 8.9.4.2.2 SPI Slave Mode External Timing (Clock Phase = 1)
      5. 8.9.5  Serial Communications Interface (SCI) Module
      6. 8.9.6  Multichannel Buffered Serial Port (McBSP) Module
        1. 8.9.6.1 McBSP Electrical Data/Timing
          1. 8.9.6.1.1 McBSP Transmit and Receive Timing
            1. 8.9.6.1.1.1 McBSP Timing Requirements
            2. 8.9.6.1.1.2 McBSP Switching Characteristics
          2. 8.9.6.1.2 McBSP as SPI Master or Slave Timing
            1. 8.9.6.1.2.1 McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 10b, CLKXP = 0)
            2. 8.9.6.1.2.2 McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 10b, CLKXP = 0)
            3. 8.9.6.1.2.3 McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 11b, CLKXP = 0)
            4. 8.9.6.1.2.4 McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 11b, CLKXP = 0)
            5. 8.9.6.1.2.5 McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 10b, CLKXP = 1)
            6. 8.9.6.1.2.6 McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 10b, CLKXP = 1)
            7. 8.9.6.1.2.7 McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 11b, CLKXP = 1)
            8. 8.9.6.1.2.8 McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 11b, CLKXP = 1)
      7. 8.9.7  Enhanced Controller Area Network (eCAN) Module
      8. 8.9.8  Inter-Integrated Circuit (I2C)
        1. 8.9.8.1 I2C Electrical Data/Timing
          1. 8.9.8.1.1 I2C Timing Requirements
          2. 8.9.8.1.2 I2C Switching Characteristics
      9. 8.9.9  Enhanced Pulse Width Modulator (ePWM) Modules (ePWM1 to ePWM8)
        1. 8.9.9.1 ePWM Electrical Data/Timing
          1. 8.9.9.1.1 ePWM Timing Requirements
          2. 8.9.9.1.2 ePWM Switching Characteristics
        2. 8.9.9.2 Trip-Zone Input Timing
          1. 8.9.9.2.1 Trip-Zone Input Timing Requirements
      10. 8.9.10 High-Resolution PWM (HRPWM)
        1. 8.9.10.1 HRPWM Electrical Data/Timing
          1. 8.9.10.1.1 High-Resolution PWM Characteristics
      11. 8.9.11 Enhanced Capture Module (eCAP1)
        1. 8.9.11.1 eCAP Electrical Data/Timing
          1. 8.9.11.1.1 Enhanced Capture (eCAP) Timing Requirement
          2. 8.9.11.1.2 eCAP Switching Characteristics
      12. 8.9.12 High-Resolution Capture Modules (HRCAP1 to HRCAP4)
        1. 8.9.12.1 HRCAP Electrical Data/Timing
          1. 8.9.12.1.1 High-Resolution Capture (HRCAP) Timing Requirements
      13. 8.9.13 Enhanced Quadrature Encoder Modules (eQEP1, eQEP2)
        1. 8.9.13.1 eQEP Electrical Data/Timing
          1. 8.9.13.1.1 Enhanced Quadrature Encoder Pulse (eQEP) Timing Requirements
          2. 8.9.13.1.2 eQEP Switching Characteristics
      14. 8.9.14 JTAG Port
      15. 8.9.15 General-Purpose Input/Output (GPIO) MUX
        1. 8.9.15.1 GPIO Electrical Data/Timing
          1. 8.9.15.1.1 GPIO Output Timing
            1. 8.9.15.1.1.1 General-Purpose Output Switching Characteristics
          2. 8.9.15.1.2 GPIO Input Timing
            1. 8.9.15.1.2.1 General-Purpose Input Timing Requirements
          3. 8.9.15.1.3 Sampling Window Width for Input Signals
          4. 8.9.15.1.4 Low-Power Mode Wakeup Timing
            1. 8.9.15.1.4.1 IDLE Mode Timing Requirements
            2. 8.9.15.1.4.2 IDLE Mode Switching Characteristics
            3. 8.9.15.1.4.3 STANDBY Mode Timing Requirements
            4. 8.9.15.1.4.4 STANDBY Mode Switching Characteristics
            5. 8.9.15.1.4.5 HALT Mode Timing Requirements
            6. 8.9.15.1.4.6 HALT Mode Switching Characteristics
      16. 8.9.16 Universal Serial Bus (USB)
        1. 8.9.16.1 USB Electrical Data/Timing
          1. 8.9.16.1.1 USB Input Ports DP and DM Timing Requirements
          2. 8.9.16.1.2 USB Output Ports DP and DM Switching Characteristics
  9. 9 Applications, Implementation, and Layout
    1. 9.1 TI Reference Design
  10. 10Device and Documentation Support
    1. 10.1 Device and Development Support Tool Nomenclature
    2. 10.2 Tools and Software
    3. 10.3 Documentation Support
    4. 10.4 支持资源
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 术语表
  11. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Packaging Information

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8.9.15 General-Purpose Input/Output (GPIO) MUX

The GPIO MUX can multiplex up to three independent peripheral signals on a single GPIO pin in addition to providing individual pin bit-banging I/O capability.

The device supports 45 GPIO pins. The GPIO control and data registers are mapped to Peripheral Frame 1 to enable 32-bit operations on the registers (along with 16-bit operations). Table 8-38 shows the GPIO register mapping.

Table 8-38 GPIO Registers
NAMEADDRESSSIZE (×16)DESCRIPTION
GPIO CONTROL REGISTERS (EALLOW PROTECTED)
GPACTRL0x6F802GPIO A Control Register (GPIO0 to 31)
GPAQSEL10x6F822GPIO A Qualifier Select 1 Register (GPIO0 to 15)
GPAQSEL20x6F842GPIO A Qualifier Select 2 Register (GPIO16 to 31)
GPAMUX10x6F862GPIO A MUX 1 Register (GPIO0 to 15)
GPAMUX20x6F882GPIO A MUX 2 Register (GPIO16 to 31)
GPADIR0x6F8A2GPIO A Direction Register (GPIO0 to 31)
GPAPUD0x6F8C2GPIO A Pullup Disable Register (GPIO0 to 31)
GPBCTRL0x6F902GPIO B Control Register (GPIO32 to 44)
GPBQSEL10x6F922GPIO B Qualifier Select 1 Register (GPIO32 to 44)
GPBQSEL20x6F942GPIO B Qualifier Select 2 Register
GPBMUX10x6F962GPIO B MUX 1 Register (GPIO32 to 44)
GPBMUX20x6F982GPIO B MUX 2 Register (GPIO50 to 58)
GPBDIR0x6F9A2GPIO B Direction Register (GPIO32 to 44)
GPBPUD0x6F9C2GPIO B Pullup Disable Register (GPIO32 to 44)
AIOMUX10x6FB62Analog, I/O mux 1 register (AIO0 to AIO15)
AIODIR0x6FBA2Analog, I/O Direction Register (AIO0 to AIO15)
GPIO DATA REGISTERS (NOT EALLOW PROTECTED)
GPADAT0x6FC02GPIO A Data Register (GPIO0 to 31)
GPASET0x6FC22GPIO A Data Set Register (GPIO0 to 31)
GPACLEAR0x6FC42GPIO A Data Clear Register (GPIO0 to 31)
GPATOGGLE0x6FC62GPIO A Data Toggle Register (GPIO0 to 31)
GPBDAT0x6FC82GPIO B Data Register (GPIO32 to 44)
GPBSET0x6FCA2GPIO B Data Set Register (GPIO32 to 44)
GPBCLEAR0x6FCC2GPIO B Data Clear Register (GPIO32 to 44)
GPBTOGGLE0x6FCE2GPIO B Data Toggle Register (GPIO32 to 44)
AIODAT0x6FD82Analog I/O Data Register (AIO0 to AIO15)
AIOSET0x6FDA2Analog I/O Data Set Register (AIO0 to AIO15)
AIOCLEAR0x6FDC2Analog I/O Data Clear Register (AIO0 to AIO15)
AIOTOGGLE0x6FDE2Analog I/O Data Toggle Register (AIO0 to AIO15)
GPIO INTERRUPT AND LOW-POWER MODES SELECT REGISTERS (EALLOW PROTECTED)
GPIOXINT1SEL0x6FE01XINT1 GPIO Input Select Register (GPIO0 to 31)
GPIOXINT2SEL0x6FE11XINT2 GPIO Input Select Register (GPIO0 to 31)
GPIOXINT3SEL0x6FE21XINT3 GPIO Input Select Register (GPIO0 to 31)
GPIOLPMSEL0x6FE82LPM GPIO Select Register (GPIO0 to 31)
Note:

There is a two-SYSCLKOUT cycle delay from when the write to the GPxMUXn/AIOMUXn and GPxQSELn registers occurs to when the action is valid.

Table 8-39 GPIOA MUX
DEFAULT AT RESET
PRIMARY I/O FUNCTION(1)(2)		PERIPHERAL
SELECTION 1		PERIPHERAL
SELECTION 2		PERIPHERAL
SELECTION 3
GPAMUX1 REGISTER BITS(GPAMUX1 BITS = 00)(GPAMUX1 BITS = 01)(GPAMUX1 BITS = 10)(GPAMUX1 BITS = 11)
1-0GPIO0EPWM1A (O)ReservedReserved
3-2GPIO1EPWM1B (O)ReservedCOMP1OUT (O)
5-4GPIO2EPWM2A (O)ReservedReserved
7-6GPIO3EPWM2B (O)SPISOMIA (I/O)COMP2OUT (O)
9-8GPIO4EPWM3A (O)ReservedReserved
11-10GPIO5EPWM3B (O)SPISIMOA (I/O)ECAP1 (I/O)
13-12GPIO6EPWM4A (O)EPWMSYNCI (I)EPWMSYNCO (O)
15-14GPIO7EPWM4B (O)SCIRXDA (I)ECAP2 (I/O)
17-16GPIO8EPWM5A (O)ReservedADCSOCAO (O)
19-18GPIO9EPWM5B (O)SCITXDB (O)ECAP3 (I/O)
21-20GPIO10EPWM6A (O)ReservedADCSOCBO (O)
23-22GPIO11EPWM6B (O)SCIRXDB (I)ECAP1 (I/O)
25-24GPIO12TZ1 (I)SCITXDA (O)SPISIMOB (I/O)
27-26GPIO13TZ2 (I)ReservedSPISOMIB (I/O)
29-28GPIO14TZ3 (I)SCITXDB (O)SPICLKB (I/O)
31-30GPIO15ECAP2 (I/O)SCIRXDB (I)SPISTEB (I/O)
GPAMUX2 REGISTER BITS(GPAMUX2 BITS = 00)(GPAMUX2 BITS = 01)(GPAMUX2 BITS = 10)(GPAMUX2 BITS = 11)
1-0GPIO16SPISIMOA (I/O)ReservedTZ2 (I)
3-2GPIO17SPISOMIA (I/O)ReservedTZ3 (I)
5-4GPIO18SPICLKA (I/O)SCITXDB (O)XCLKOUT (O)
7-6GPIO19/XCLKINSPISTEA (I/O)SCIRXDB (I)ECAP1 (I/O)
9-8GPIO20EQEP1A (I)MDXA (O)COMP1OUT (O)
11-10GPIO21EQEP1B (I)MDRA (I)COMP2OUT (O)
13-12GPIO22EQEP1S (I/O)MCLKXA (I/O)SCITXDB (O)
15-14GPIO23EQEP1I (I/O)MFSXA (I/O)SCIRXDB (I)
17-16GPIO24ECAP1 (I/O)EQEP2A(3) (I)SPISIMOB (I/O)
19-18GPIO25ECAP2 (I/O)EQEP2B(3) (I)SPISOMIB (I/O)
21-20GPIO26(4)ECAP3 (I/O)EQEP2I(3) (I/O)SPICLKB (I/O)
23-22GPIO27(4)HRCAP2 (I)EQEP2S(3) (I/O)SPISTEB (I/O)
25-24GPIO28SCIRXDA (I)SDAA (I/OD)TZ2 (I)
27-26GPIO29SCITXDA (O)SCLA (I/OD)TZ3 (I)
29-28GPIO30CANRXA (I)EQEP2I(3) (I/O)EPWM7A (O)
31-30GPIO31CANTXA (O)EQEP2S(3) (I/O)EPWM8A (O)
(1) The word "Reserved" means that there is no peripheral assigned to this GPxMUX1/2 register setting. Should it be selected, the state of the pin will be undefined and the pin may be driven. This selection is a reserved configuration for future expansion.
(2) I = Input, O = Output, OD = Open Drain
(3) The eQEP2 peripheral is not available on the 80-pin PN or PFP package.
(4) To enable the USB functionality on GPIO26 (USB0DP, positive differential half of the USB signal) and GPIO27 (USB0DM, negative differential half of the USB signal), set the USBIOEN bit in the GPAC
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