ZHCS898O October   2003  – March 2019 TMS320F2801 , TMS320F28015 , TMS320F28016 , TMS320F2802 , TMS320F2806 , TMS320F2808 , TMS320F2809

PRODUCTION DATA.  

  1. 1器件概述
    1. 1.1 特性
    2. 1.2 应用
    3. 1.3 说明
    4. 1.4 功能方框图
  2. 2修订历史记录
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagrams
    2. 4.2 Signal Descriptions
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings – Automotive
    3. 5.3  ESD Ratings – Commercial
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Power Consumption Summary
      1. Table 5-1 TMS320F2809, TMS320F2808 Current Consumption by Power-Supply Pins at 100-MHz SYSCLKOUT
      2. Table 5-2 TMS320F2806 Current Consumption by Power-Supply Pins at 100-MHz SYSCLKOUT
      3. Table 5-3 TMS320F2802, TMS320F2801 Current Consumption by Power-Supply Pins at 100-MHz SYSCLKOUT
      4. Table 5-4 TMS320C2802, TMS320C2801 Current Consumption by Power-Supply Pins at 100-MHz SYSCLKOUT
      5. 5.5.1     Reducing Current Consumption
      6. 5.5.2     Current Consumption Graphs
    6. 5.6  Electrical Characteristics
    7. 5.7  Thermal Resistance Characteristics for F280x 100-Ball GGM Package
    8. 5.8  Thermal Resistance Characteristics for F280x 100-Pin PZ Package
    9. 5.9  Thermal Resistance Characteristics for C280x 100-Ball GGM Package
    10. 5.10 Thermal Resistance Characteristics for C280x 100-Pin PZ Package
    11. 5.11 Thermal Resistance Characteristics for F2809 100-Ball GGM Package
    12. 5.12 Thermal Resistance Characteristics for F2809 100-Pin PZ Package
    13. 5.13 Thermal Design Considerations
    14. 5.14 Timing and Switching Characteristics
      1. 5.14.1 Timing Parameter Symbology
        1. 5.14.1.1 General Notes on Timing Parameters
        2. 5.14.1.2 Test Load Circuit
        3. 5.14.1.3 Device Clock Table
          1. Table 5-6 TMS320x280x Clock Table and Nomenclature (100-MHz Devices)
          2. Table 5-7 TMS320x280x/2801x Clock Table and Nomenclature (60-MHz Devices)
      2. 5.14.2 Power Sequencing
        1. Table 5-8 Reset (XRS) Timing Requirements
      3. 5.14.3 Clock Requirements and Characteristics
        1. Table 5-9  Input Clock Frequency
        2. Table 5-10 XCLKIN Timing Requirements - PLL Enabled
        3. Table 5-11 XCLKIN Timing Requirements - PLL Disabled
        4. Table 5-12 XCLKOUT Switching Characteristics (PLL Bypassed or Enabled)
      4. 5.14.4 Peripherals
        1. 5.14.4.1 General-Purpose Input/Output (GPIO)
          1. 5.14.4.1.1 GPIO - Output Timing
            1. Table 5-13 General-Purpose Output Switching Characteristics
          2. 5.14.4.1.2 GPIO - Input Timing
            1. Table 5-14 General-Purpose Input Timing Requirements
          3. 5.14.4.1.3 Sampling Window Width for Input Signals
          4. 5.14.4.1.4 Low-Power Mode Wakeup Timing
            1. Table 5-15 IDLE Mode Timing Requirements
            2. Table 5-16 IDLE Mode Switching Characteristics
            3. Table 5-17 STANDBY Mode Timing Requirements
            4. Table 5-18 STANDBY Mode Switching Characteristics
            5. Table 5-19 HALT Mode Timing Requirements
            6. Table 5-20 HALT Mode Switching Characteristics
        2. 5.14.4.2 Enhanced Control Peripherals
          1. 5.14.4.2.1 Enhanced Pulse Width Modulator (ePWM) Timing
            1. Table 5-21 ePWM Timing Requirements
            2. Table 5-22 ePWM Switching Characteristics
          2. 5.14.4.2.2 Trip-Zone Input Timing
            1. Table 5-23 Trip-Zone input Timing Requirements
          3. 5.14.4.2.3 High-Resolution PWM Timing
            1. Table 5-24 High-Resolution PWM Characteristics at SYSCLKOUT = 60–100 MHz
          4. 5.14.4.2.4 Enhanced Capture (eCAP) Timing
            1. Table 5-25 Enhanced Capture (eCAP) Timing Requirement
            2. Table 5-26 eCAP Switching Characteristics
          5. 5.14.4.2.5 Enhanced Quadrature Encoder Pulse (eQEP) Timing
            1. Table 5-27 Enhanced Quadrature Encoder Pulse (eQEP) Timing Requirements
            2. Table 5-28 eQEP Switching Characteristics
          6. 5.14.4.2.6 ADC Start-of-Conversion Timing
            1. Table 5-29 External ADC Start-of-Conversion Switching Characteristics
        3. 5.14.4.3 External Interrupt Timing
          1. Table 5-30 External Interrupt Timing Requirements
          2. Table 5-31 External Interrupt Switching Characteristics
        4. 5.14.4.4 I2C Electrical Specification and Timing
          1. Table 5-32 I2C Timing
        5. 5.14.4.5 Serial Peripheral Interface (SPI) Timing
          1. 5.14.4.5.1 SPI Master Mode Timing
            1. Table 5-33 SPI Master Mode External Timing (Clock Phase = 0)
            2. Table 5-34 SPI Master Mode External Timing (Clock Phase = 1)
          2. 5.14.4.5.2 SPI Slave Mode Timing
            1. Table 5-35 SPI Slave Mode External Timing (Clock Phase = 0)
            2. Table 5-36 SPI Slave Mode External Timing (Clock Phase = 1)
      5. 5.14.5 Emulator Connection Without Signal Buffering for the DSP
      6. 5.14.6 Flash Timing
        1. Table 5-37 Flash Endurance for A and S Temperature Material
        2. Table 5-38 Flash Endurance for Q Temperature Material
        3. Table 5-39 Flash Parameters at 100-MHz SYSCLKOUT
        4. Table 5-40 Flash/OTP Access Timing
        5. Table 5-41 Flash Data Retention Duration
    15. 5.15 On-Chip Analog-to-Digital Converter
      1. Table 5-43 ADC Electrical Characteristics
      2. 5.15.1     ADC Power-Up Control Bit Timing
        1. Table 5-44 ADC Power-Up Delays
        2. Table 5-45 Current Consumption for Different ADC Configurations (at 12.5-MHz ADCCLK)
      3. 5.15.2     Definitions
      4. 5.15.3     Sequential Sampling Mode (Single-Channel) (SMODE = 0)
        1. Table 5-46 Sequential Sampling Mode Timing
      5. 5.15.4     Simultaneous Sampling Mode (Dual-Channel) (SMODE = 1)
        1. Table 5-47 Simultaneous Sampling Mode Timing
      6. 5.15.5     Detailed Descriptions
    16. 5.16 Migrating From F280x Devices to C280x Devices
      1. 5.16.1 Migration Issues
    17. 5.17 ROM Timing (C280x only)
      1. Table 5-48 ROM/OTP Access Timing
  6. 6Detailed Description
    1. 6.1 Brief Descriptions
      1. 6.1.1  C28x CPU
      2. 6.1.2  Memory Bus (Harvard Bus Architecture)
      3. 6.1.3  Peripheral Bus
      4. 6.1.4  Real-Time JTAG and Analysis
      5. 6.1.5  Flash
      6. 6.1.6  ROM
      7. 6.1.7  M0, M1 SARAMs
      8. 6.1.8  L0, L1, H0 SARAMs
      9. 6.1.9  Boot ROM
      10. 6.1.10 Security
      11. 6.1.11 Peripheral Interrupt Expansion (PIE) Block
      12. 6.1.12 External Interrupts (XINT1, XINT2, XNMI)
      13. 6.1.13 Oscillator and PLL
      14. 6.1.14 Watchdog
      15. 6.1.15 Peripheral Clocking
      16. 6.1.16 Low-Power Modes
      17. 6.1.17 Peripheral Frames 0, 1, 2 (PFn)
      18. 6.1.18 General-Purpose Input/Output (GPIO) Multiplexer
      19. 6.1.19 32-Bit CPU-Timers (0, 1, 2)
      20. 6.1.20 Control Peripherals
      21. 6.1.21 Serial Port Peripherals
    2. 6.2 Peripherals
      1. 6.2.1  32-Bit CPU-Timers 0/1/2
      2. 6.2.2  Enhanced PWM Modules (ePWM1/2/3/4/5/6)
      3. 6.2.3  Hi-Resolution PWM (HRPWM)
      4. 6.2.4  Enhanced CAP Modules (eCAP1/2/3/4)
      5. 6.2.5  Enhanced QEP Modules (eQEP1/2)
      6. 6.2.6  Enhanced Analog-to-Digital Converter (ADC) Module
        1. 6.2.6.1 ADC Connections if the ADC Is Not Used
        2. 6.2.6.2 ADC Registers
      7. 6.2.7  Enhanced Controller Area Network (eCAN) Modules (eCAN-A and eCAN-B)
      8. 6.2.8  Serial Communications Interface (SCI) Modules (SCI-A, SCI-B)
      9. 6.2.9  Serial Peripheral Interface (SPI) Modules (SPI-A, SPI-B, SPI-C, SPI-D)
      10. 6.2.10 Inter-Integrated Circuit (I2C)
      11. 6.2.11 GPIO MUX
    3. 6.3 Memory Maps
    4. 6.4 Register Map
      1. 6.4.1 Device Emulation Registers
    5. 6.5 Interrupts
      1. 6.5.1 External Interrupts
    6. 6.6 System Control
      1. 6.6.1 OSC and PLL Block
        1. 6.6.1.1 External Reference Oscillator Clock Option
        2. 6.6.1.2 PLL-Based Clock Module
        3. 6.6.1.3 Loss of Input Clock
      2. 6.6.2 Watchdog Block
    7. 6.7 Low-Power Modes Block
  7. 7Applications, Implementation, and Layout
    1. 7.1 TI Design or Reference Design
  8. 8器件和文档支持
    1. 8.1 开始使用
    2. 8.2 器件和开发支持工具命名规则
    3. 8.3 工具与软件
    4. 8.4 文档支持
    5. 8.5 相关链接
    6. 8.6 Community Resources
    7. 8.7 商标
    8. 8.8 静电放电警告
    9. 8.9 Glossary
  9. 9机械、封装和可订购信息
    1. 9.1 封装信息

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • PZ|100
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.2.2 Enhanced PWM Modules (ePWM1/2/3/4/5/6)

The 280x device contains up to six enhanced PWM modules (ePWM). Figure 6-3 shows a block diagram of multiple ePWM modules. Figure 6-4 shows the signal interconnections with the ePWM. See the TMS320x280x, 2801x, 2804x Enhanced Pulse Width Modulator (ePWM) module reference guide for more details.

TMS320F2809 TMS320F2808 TMS320F2806 TMS320F2802 TMS320F2801 TMS320C2802 TMS320C2801 TMS320F28016 TMS320F28015 pwm_prs230.gifFigure 6-3 Multiple PWM Modules in a 280x System

Table 6-3 shows the complete ePWM register set per module.

Table 6-3 ePWM Control and Status Registers

NAME ePWM1 ePWM2 ePWM3 ePWM4 ePWM5 ePWM6 SIZE (x16) / #SHADOW DESCRIPTION
TBCTL 0x6800 0x6840 0x6880 0x68C0 0x6900 0x6940 1 / 0 Time Base Control Register
TBSTS 0x6801 0x6841 0x6881 0x68C1 0x6901 0x6941 1 / 0 Time Base Status Register
TBPHSHR 0x6802 0x6842 0x6882 0x68C2 N/A N/A 1 / 0 Time Base Phase HRPWM Register
TBPHS 0x6803 0x6843 0x6883 0x68C3 0x6903 0x6943 1 / 0 Time Base Phase Register
TBCTR 0x6804 0x6844 0x6884 0x68C4 0x6904 0x6944 1 / 0 Time Base Counter Register
TBPRD 0x6805 0x6845 0x6885 0x68C5 0x6905 0x6945 1 / 1 Time Base Period Register Set
CMPCTL 0x6807 0x6847 0x6887 0x68C7 0x6907 0x6947 1 / 0 Counter Compare Control Register
CMPAHR 0x6808 0x6848 0x6888 0x68C8 N/A N/A 1 / 1 Time Base Compare A HRPWM Register
CMPA 0x6809 0x6849 0x6889 0x68C9 0x6909 0x6949 1 / 1 Counter Compare A Register Set
CMPB 0x680A 0x684A 0x688A 0x68CA 0x690A 0x694A 1 / 1 Counter Compare B Register Set
AQCTLA 0x680B 0x684B 0x688B 0x68CB 0x690B 0x694B 1 / 0 Action Qualifier Control Register For Output A
AQCTLB 0x680C 0x684C 0x688C 0x68CC 0x690C 0x694C 1 / 0 Action Qualifier Control Register For Output B
AQSFRC 0x680D 0x684D 0x688D 0x68CD 0x690D 0x694D 1 / 0 Action Qualifier Software Force Register
AQCSFRC 0x680E 0x684E 0x688E 0x68CE 0x690E 0x694E 1 / 1 Action Qualifier Continuous S/W Force Register Set
DBCTL 0x680F 0x684F 0x688F 0x68CF 0x690F 0x694F 1 / 1 Dead-Band Generator Control Register
DBRED 0x6810 0x6850 0x6890 0x68D0 0x6910 0x6950 1 / 0 Dead-Band Generator Rising Edge Delay Count Register
DBFED 0x6811 0x6851 0x6891 0x68D1 0x6911 0x6951 1 / 0 Dead-Band Generator Falling Edge Delay Count Register
TZSEL 0x6812 0x6852 0x6892 0x68D2 0x6912 0x6952 1 / 0 Trip Zone Select Register(1)
TZCTL 0x6814 0x6854 0x6894 0x68D4 0x6914 0x6954 1 / 0 Trip Zone Control Register(1)
TZEINT 0x6815 0x6855 0x6895 0x68D5 0x6915 0x6955 1 / 0 Trip Zone Enable Interrupt Register(1)
TZFLG 0x6816 0x6856 0x6896 0x68D6 0x6916 0x6956 1 / 0 Trip Zone Flag Register
TZCLR 0x6817 0x6857 0x6897 0x68D7 0x6917 0x6957 1 / 0 Trip Zone Clear Register(1)
TZFRC 0x6818 0x6858 0x6898 0x68D8 0x6918 0x6958 1 / 0 Trip Zone Force Register(1)
ETSEL 0x6819 0x6859 0x6899 0x68D9 0x6919 0x6959 1 / 0 Event Trigger Selection Register
ETPS 0x681A 0x685A 0x689A 0x68DA 0x691A 0x695A 1 / 0 Event Trigger Prescale Register
ETFLG 0x681B 0x685B 0x689B 0x68DB 0x691B 0x695B 1 / 0 Event Trigger Flag Register
ETCLR 0x681C 0x685C 0x689C 0x68DC 0x691C 0x695C 1 / 0 Event Trigger Clear Register
ETFRC 0x681D 0x685D 0x689D 0x68DD 0x691D 0x695D 1 / 0 Event Trigger Force Register
PCCTL 0x681E 0x685E 0x689E 0x68DE 0x691E 0x695E 1 / 0 PWM Chopper Control Register
HRCNFG 0x6820 0x6860 0x68A0 0x68E0 0x6920(2) 0x6960(2) 1 / 0 HRPWM Configuration Register(1)
(1) Registers that are EALLOW protected.
(2) Applicable to F2809 only
TMS320F2809 TMS320F2808 TMS320F2806 TMS320F2802 TMS320F2801 TMS320C2802 TMS320C2801 TMS320F28016 TMS320F28015 hires_prs230.gifFigure 6-4 ePWM Sub-Modules Showing Critical Internal Signal Interconnections
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