ZHCS898O October   2003  – March 2019 TMS320F2801 , TMS320F28015 , TMS320F28016 , TMS320F2802 , TMS320F2806 , TMS320F2808 , TMS320F2809

PRODUCTION DATA.  

  1. 1器件概述
    1. 1.1 特性
    2. 1.2 应用
    3. 1.3 说明
    4. 1.4 功能方框图
  2. 2修订历史记录
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagrams
    2. 4.2 Signal Descriptions
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings – Automotive
    3. 5.3  ESD Ratings – Commercial
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Power Consumption Summary
      1. Table 5-1 TMS320F2809, TMS320F2808 Current Consumption by Power-Supply Pins at 100-MHz SYSCLKOUT
      2. Table 5-2 TMS320F2806 Current Consumption by Power-Supply Pins at 100-MHz SYSCLKOUT
      3. Table 5-3 TMS320F2802, TMS320F2801 Current Consumption by Power-Supply Pins at 100-MHz SYSCLKOUT
      4. Table 5-4 TMS320C2802, TMS320C2801 Current Consumption by Power-Supply Pins at 100-MHz SYSCLKOUT
      5. 5.5.1     Reducing Current Consumption
      6. 5.5.2     Current Consumption Graphs
    6. 5.6  Electrical Characteristics
    7. 5.7  Thermal Resistance Characteristics for F280x 100-Ball GGM Package
    8. 5.8  Thermal Resistance Characteristics for F280x 100-Pin PZ Package
    9. 5.9  Thermal Resistance Characteristics for C280x 100-Ball GGM Package
    10. 5.10 Thermal Resistance Characteristics for C280x 100-Pin PZ Package
    11. 5.11 Thermal Resistance Characteristics for F2809 100-Ball GGM Package
    12. 5.12 Thermal Resistance Characteristics for F2809 100-Pin PZ Package
    13. 5.13 Thermal Design Considerations
    14. 5.14 Timing and Switching Characteristics
      1. 5.14.1 Timing Parameter Symbology
        1. 5.14.1.1 General Notes on Timing Parameters
        2. 5.14.1.2 Test Load Circuit
        3. 5.14.1.3 Device Clock Table
          1. Table 5-6 TMS320x280x Clock Table and Nomenclature (100-MHz Devices)
          2. Table 5-7 TMS320x280x/2801x Clock Table and Nomenclature (60-MHz Devices)
      2. 5.14.2 Power Sequencing
        1. Table 5-8 Reset (XRS) Timing Requirements
      3. 5.14.3 Clock Requirements and Characteristics
        1. Table 5-9  Input Clock Frequency
        2. Table 5-10 XCLKIN Timing Requirements - PLL Enabled
        3. Table 5-11 XCLKIN Timing Requirements - PLL Disabled
        4. Table 5-12 XCLKOUT Switching Characteristics (PLL Bypassed or Enabled)
      4. 5.14.4 Peripherals
        1. 5.14.4.1 General-Purpose Input/Output (GPIO)
          1. 5.14.4.1.1 GPIO - Output Timing
            1. Table 5-13 General-Purpose Output Switching Characteristics
          2. 5.14.4.1.2 GPIO - Input Timing
            1. Table 5-14 General-Purpose Input Timing Requirements
          3. 5.14.4.1.3 Sampling Window Width for Input Signals
          4. 5.14.4.1.4 Low-Power Mode Wakeup Timing
            1. Table 5-15 IDLE Mode Timing Requirements
            2. Table 5-16 IDLE Mode Switching Characteristics
            3. Table 5-17 STANDBY Mode Timing Requirements
            4. Table 5-18 STANDBY Mode Switching Characteristics
            5. Table 5-19 HALT Mode Timing Requirements
            6. Table 5-20 HALT Mode Switching Characteristics
        2. 5.14.4.2 Enhanced Control Peripherals
          1. 5.14.4.2.1 Enhanced Pulse Width Modulator (ePWM) Timing
            1. Table 5-21 ePWM Timing Requirements
            2. Table 5-22 ePWM Switching Characteristics
          2. 5.14.4.2.2 Trip-Zone Input Timing
            1. Table 5-23 Trip-Zone input Timing Requirements
          3. 5.14.4.2.3 High-Resolution PWM Timing
            1. Table 5-24 High-Resolution PWM Characteristics at SYSCLKOUT = 60–100 MHz
          4. 5.14.4.2.4 Enhanced Capture (eCAP) Timing
            1. Table 5-25 Enhanced Capture (eCAP) Timing Requirement
            2. Table 5-26 eCAP Switching Characteristics
          5. 5.14.4.2.5 Enhanced Quadrature Encoder Pulse (eQEP) Timing
            1. Table 5-27 Enhanced Quadrature Encoder Pulse (eQEP) Timing Requirements
            2. Table 5-28 eQEP Switching Characteristics
          6. 5.14.4.2.6 ADC Start-of-Conversion Timing
            1. Table 5-29 External ADC Start-of-Conversion Switching Characteristics
        3. 5.14.4.3 External Interrupt Timing
          1. Table 5-30 External Interrupt Timing Requirements
          2. Table 5-31 External Interrupt Switching Characteristics
        4. 5.14.4.4 I2C Electrical Specification and Timing
          1. Table 5-32 I2C Timing
        5. 5.14.4.5 Serial Peripheral Interface (SPI) Timing
          1. 5.14.4.5.1 SPI Master Mode Timing
            1. Table 5-33 SPI Master Mode External Timing (Clock Phase = 0)
            2. Table 5-34 SPI Master Mode External Timing (Clock Phase = 1)
          2. 5.14.4.5.2 SPI Slave Mode Timing
            1. Table 5-35 SPI Slave Mode External Timing (Clock Phase = 0)
            2. Table 5-36 SPI Slave Mode External Timing (Clock Phase = 1)
      5. 5.14.5 Emulator Connection Without Signal Buffering for the DSP
      6. 5.14.6 Flash Timing
        1. Table 5-37 Flash Endurance for A and S Temperature Material
        2. Table 5-38 Flash Endurance for Q Temperature Material
        3. Table 5-39 Flash Parameters at 100-MHz SYSCLKOUT
        4. Table 5-40 Flash/OTP Access Timing
        5. Table 5-41 Flash Data Retention Duration
    15. 5.15 On-Chip Analog-to-Digital Converter
      1. Table 5-43 ADC Electrical Characteristics
      2. 5.15.1     ADC Power-Up Control Bit Timing
        1. Table 5-44 ADC Power-Up Delays
        2. Table 5-45 Current Consumption for Different ADC Configurations (at 12.5-MHz ADCCLK)
      3. 5.15.2     Definitions
      4. 5.15.3     Sequential Sampling Mode (Single-Channel) (SMODE = 0)
        1. Table 5-46 Sequential Sampling Mode Timing
      5. 5.15.4     Simultaneous Sampling Mode (Dual-Channel) (SMODE = 1)
        1. Table 5-47 Simultaneous Sampling Mode Timing
      6. 5.15.5     Detailed Descriptions
    16. 5.16 Migrating From F280x Devices to C280x Devices
      1. 5.16.1 Migration Issues
    17. 5.17 ROM Timing (C280x only)
      1. Table 5-48 ROM/OTP Access Timing
  6. 6Detailed Description
    1. 6.1 Brief Descriptions
      1. 6.1.1  C28x CPU
      2. 6.1.2  Memory Bus (Harvard Bus Architecture)
      3. 6.1.3  Peripheral Bus
      4. 6.1.4  Real-Time JTAG and Analysis
      5. 6.1.5  Flash
      6. 6.1.6  ROM
      7. 6.1.7  M0, M1 SARAMs
      8. 6.1.8  L0, L1, H0 SARAMs
      9. 6.1.9  Boot ROM
      10. 6.1.10 Security
      11. 6.1.11 Peripheral Interrupt Expansion (PIE) Block
      12. 6.1.12 External Interrupts (XINT1, XINT2, XNMI)
      13. 6.1.13 Oscillator and PLL
      14. 6.1.14 Watchdog
      15. 6.1.15 Peripheral Clocking
      16. 6.1.16 Low-Power Modes
      17. 6.1.17 Peripheral Frames 0, 1, 2 (PFn)
      18. 6.1.18 General-Purpose Input/Output (GPIO) Multiplexer
      19. 6.1.19 32-Bit CPU-Timers (0, 1, 2)
      20. 6.1.20 Control Peripherals
      21. 6.1.21 Serial Port Peripherals
    2. 6.2 Peripherals
      1. 6.2.1  32-Bit CPU-Timers 0/1/2
      2. 6.2.2  Enhanced PWM Modules (ePWM1/2/3/4/5/6)
      3. 6.2.3  Hi-Resolution PWM (HRPWM)
      4. 6.2.4  Enhanced CAP Modules (eCAP1/2/3/4)
      5. 6.2.5  Enhanced QEP Modules (eQEP1/2)
      6. 6.2.6  Enhanced Analog-to-Digital Converter (ADC) Module
        1. 6.2.6.1 ADC Connections if the ADC Is Not Used
        2. 6.2.6.2 ADC Registers
      7. 6.2.7  Enhanced Controller Area Network (eCAN) Modules (eCAN-A and eCAN-B)
      8. 6.2.8  Serial Communications Interface (SCI) Modules (SCI-A, SCI-B)
      9. 6.2.9  Serial Peripheral Interface (SPI) Modules (SPI-A, SPI-B, SPI-C, SPI-D)
      10. 6.2.10 Inter-Integrated Circuit (I2C)
      11. 6.2.11 GPIO MUX
    3. 6.3 Memory Maps
    4. 6.4 Register Map
      1. 6.4.1 Device Emulation Registers
    5. 6.5 Interrupts
      1. 6.5.1 External Interrupts
    6. 6.6 System Control
      1. 6.6.1 OSC and PLL Block
        1. 6.6.1.1 External Reference Oscillator Clock Option
        2. 6.6.1.2 PLL-Based Clock Module
        3. 6.6.1.3 Loss of Input Clock
      2. 6.6.2 Watchdog Block
    7. 6.7 Low-Power Modes Block
  7. 7Applications, Implementation, and Layout
    1. 7.1 TI Design or Reference Design
  8. 8器件和文档支持
    1. 8.1 开始使用
    2. 8.2 器件和开发支持工具命名规则
    3. 8.3 工具与软件
    4. 8.4 文档支持
    5. 8.5 相关链接
    6. 8.6 Community Resources
    7. 8.7 商标
    8. 8.8 静电放电警告
    9. 8.9 Glossary
  9. 9机械、封装和可订购信息
    1. 9.1 封装信息

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • PZ|100
  • GBA|100
  • NMF|100
散热焊盘机械数据 (封装 | 引脚)
订购信息

2 修订历史记录

Changes from May 31, 2012 to March 11, 2019 (from N Revision (May 2012) to O Revision)

  • 全局：文档结构已经过重新编排。Go
  • 全局：将“DSP/BIOS”替换为“SYS/BIOS”Go
  • 全局：将“CAN 2.0B”更改为“ISO11898-1 (CAN 2.0B)”Go
  • 全局：删除了对应用报告《TMS320LF24xx 和 TMS320F28xx 器件的可靠性数据》 (SPRA963) 的引用Go
  • Section 1（器件概述）：将章节标题从“F280x、F2801x、C280x DSP”更改为“器件概述”Go
  • Section 1.1（特性）：删除了“支持动态 PLL 比率变化”特性Go
  • Section 1.1：向 Q 温度选项添加了“（通过针对汽车 应用的 AEC-Q100 认证）”Go
  • Section 1.2 （应用：添加了此部分Go
  • Section 1.3 （说明：添加了此部分Go
  • Section 1.4 （功能方框图）：添加了此部分Go
  • Section 3 (Device Comparison): Added section. Go
  • Table 3-1 (Device Comparison (100-MHz Devices)): Changed title from "Hardware Features (100-MHz Devices)" to "Device Comparison (100-MHz Devices)". Go
  • Table 3-1: Changed "PWM outputs" to "PWM channels". Go
  • Table 3-1: Added "(AEC-Q100 Qualification)" after Q temperature range. Go
  • Table 3-1: Removed "Product status" row. Go
  • Table 3-2 (Device Comparison (60-MHz Devices)): Changed title from "Hardware Features (60-MHz Devices)" to "Device Comparison (60-MHz Devices)". Go
  • Table 3-2: Changed "PWM outputs" to "PWM channels". Go
  • Table 3-2: Added "(AEC-Q100 Qualification)" after Q temperature range. Go
  • Table 3-2: Removed "Product status" row. Go
  • Section 3.1 (Related Products): Added section. Go
  • Section 4 (Terminal Configuration and Functions): Added section. Go
  • Section 4.1 (Pin Diagrams): Changed section title from "Pin Assignments" to "Pin Diagrams". Go
  • Table 4-1 (Signal Descriptions): Updated DESCRIPTION of XRS. Go
  • Section 5.2 (ESD Ratings – Automotive): Added section.Go
  • Section 5.3 (ESD Ratings – Commercial): Added section. Go
  • Section 5.4 (Recommended Operating Conditions): Changed "Q version (Q100 Qualification)" to "Q version (AEC-Q100 Qualification)". Go
  • Section 5.5 (Power Consumption Summary): Changed section title from "Current Consumption" to "Power Consumption Summary". Go
  • Section 5.13 (Thermal Design Considerations): Added section. Go
  • Section 5.14 (Timing and Switching Characteristics): Added section. Go
  • Section 5.14.2 (Power Sequencing): Updated "No voltage larger than a diode drop ..." paragraph. Go
  • Section 5.14.2: Removed "Power Management and Supervisory Circuit Solutions" section. Go
  • Figure 5-12 (General-Purpose Input Timing): Changed XCLKOUT to SYSCLK. Go
  • Figure 5-16 (PWM Hi-Z Characteristics): Changed XCLKOUT to SYSCLK. Go
  • Table 5-24 (High-Resolution PWM Characteristics at SYSCLKOUT = 60–100 MHz): Updated footnote. Go
  • Section 5.14.4.5.1 (SPI Master Mode Timing): Updated section. Go
  • Section 5.14.4.5.2 (SPI Slave Mode Timing): Updated section. Go
  • Table 5-39 (Flash Parameters at 100-MHz SYSCLKOUT): Added MAX Program Time values and MAX Erase Time values. Updated and added footnotes.Go
  • Table 5-41 (Flash Data Retention Duration): Added table. Go
  • Section 5.16.1 (Migration Issues): Added NOTE about ROM versions of F280x device not being accepted by TI anymore. Go
  • Section 6 (Detailed Description): Changed section title from "Functional Overview" to "Detailed Description". Go
  • Section 6.1.6 (ROM): Added NOTE. Go
  • Section 6.2.6 (Enhanced Analog-to-Digital Converter (ADC) Module): Updated equations by which the digital value of the input analog voltage is derived. Go
  • Section 6.2.9 (Serial Peripheral Interface (SPI) Modules (SPI-A, SPI-B, SPI-C, SPI-D)): Updated "Rising edge with phase delay" clockng scheme Go
  • Table 6-27 (Device Emulation Registers): Updated REVID: Added Silicon rev. A for F2809 only. Go
  • Table 6-28 (PIE Peripheral Interrupts): Added footnote about ADCINT. Go
  • Figure 6-30 (Watchdog Module): Updated figure. Go
  • Section 7 (Applications, Implementation, and Layout): Added section.Go
  • Section 8 （器件和文档支持）：添加了此部分Go
  • Figure 8-1 （TMS320x280x/2801x 器件命名规则示例）：将“（Q100 认证）”更改为“（AEC-Q100 认证）”Go
  • Section 8.3 （工具和软件）：添加了此部分Go
  • Section 8.4 （文档支持）：更新了该部分。Go
  • Section 8.5 （相关链接）：添加了此部分Go
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