ZHCS898O October   2003  – March 2019 TMS320F2801 , TMS320F28015 , TMS320F28016 , TMS320F2802 , TMS320F2806 , TMS320F2808 , TMS320F2809

PRODUCTION DATA.  

  1. 1器件概述
    1. 1.1 特性
    2. 1.2 应用
    3. 1.3 说明
    4. 1.4 功能方框图
  2. 2修订历史记录
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagrams
    2. 4.2 Signal Descriptions
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings – Automotive
    3. 5.3  ESD Ratings – Commercial
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Power Consumption Summary
      1. Table 5-1 TMS320F2809, TMS320F2808 Current Consumption by Power-Supply Pins at 100-MHz SYSCLKOUT
      2. Table 5-2 TMS320F2806 Current Consumption by Power-Supply Pins at 100-MHz SYSCLKOUT
      3. Table 5-3 TMS320F2802, TMS320F2801 Current Consumption by Power-Supply Pins at 100-MHz SYSCLKOUT
      4. Table 5-4 TMS320C2802, TMS320C2801 Current Consumption by Power-Supply Pins at 100-MHz SYSCLKOUT
      5. 5.5.1     Reducing Current Consumption
      6. 5.5.2     Current Consumption Graphs
    6. 5.6  Electrical Characteristics
    7. 5.7  Thermal Resistance Characteristics for F280x 100-Ball GGM Package
    8. 5.8  Thermal Resistance Characteristics for F280x 100-Pin PZ Package
    9. 5.9  Thermal Resistance Characteristics for C280x 100-Ball GGM Package
    10. 5.10 Thermal Resistance Characteristics for C280x 100-Pin PZ Package
    11. 5.11 Thermal Resistance Characteristics for F2809 100-Ball GGM Package
    12. 5.12 Thermal Resistance Characteristics for F2809 100-Pin PZ Package
    13. 5.13 Thermal Design Considerations
    14. 5.14 Timing and Switching Characteristics
      1. 5.14.1 Timing Parameter Symbology
        1. 5.14.1.1 General Notes on Timing Parameters
        2. 5.14.1.2 Test Load Circuit
        3. 5.14.1.3 Device Clock Table
          1. Table 5-6 TMS320x280x Clock Table and Nomenclature (100-MHz Devices)
          2. Table 5-7 TMS320x280x/2801x Clock Table and Nomenclature (60-MHz Devices)
      2. 5.14.2 Power Sequencing
        1. Table 5-8 Reset (XRS) Timing Requirements
      3. 5.14.3 Clock Requirements and Characteristics
        1. Table 5-9  Input Clock Frequency
        2. Table 5-10 XCLKIN Timing Requirements - PLL Enabled
        3. Table 5-11 XCLKIN Timing Requirements - PLL Disabled
        4. Table 5-12 XCLKOUT Switching Characteristics (PLL Bypassed or Enabled)
      4. 5.14.4 Peripherals
        1. 5.14.4.1 General-Purpose Input/Output (GPIO)
          1. 5.14.4.1.1 GPIO - Output Timing
            1. Table 5-13 General-Purpose Output Switching Characteristics
          2. 5.14.4.1.2 GPIO - Input Timing
            1. Table 5-14 General-Purpose Input Timing Requirements
          3. 5.14.4.1.3 Sampling Window Width for Input Signals
          4. 5.14.4.1.4 Low-Power Mode Wakeup Timing
            1. Table 5-15 IDLE Mode Timing Requirements
            2. Table 5-16 IDLE Mode Switching Characteristics
            3. Table 5-17 STANDBY Mode Timing Requirements
            4. Table 5-18 STANDBY Mode Switching Characteristics
            5. Table 5-19 HALT Mode Timing Requirements
            6. Table 5-20 HALT Mode Switching Characteristics
        2. 5.14.4.2 Enhanced Control Peripherals
          1. 5.14.4.2.1 Enhanced Pulse Width Modulator (ePWM) Timing
            1. Table 5-21 ePWM Timing Requirements
            2. Table 5-22 ePWM Switching Characteristics
          2. 5.14.4.2.2 Trip-Zone Input Timing
            1. Table 5-23 Trip-Zone input Timing Requirements
          3. 5.14.4.2.3 High-Resolution PWM Timing
            1. Table 5-24 High-Resolution PWM Characteristics at SYSCLKOUT = 60–100 MHz
          4. 5.14.4.2.4 Enhanced Capture (eCAP) Timing
            1. Table 5-25 Enhanced Capture (eCAP) Timing Requirement
            2. Table 5-26 eCAP Switching Characteristics
          5. 5.14.4.2.5 Enhanced Quadrature Encoder Pulse (eQEP) Timing
            1. Table 5-27 Enhanced Quadrature Encoder Pulse (eQEP) Timing Requirements
            2. Table 5-28 eQEP Switching Characteristics
          6. 5.14.4.2.6 ADC Start-of-Conversion Timing
            1. Table 5-29 External ADC Start-of-Conversion Switching Characteristics
        3. 5.14.4.3 External Interrupt Timing
          1. Table 5-30 External Interrupt Timing Requirements
          2. Table 5-31 External Interrupt Switching Characteristics
        4. 5.14.4.4 I2C Electrical Specification and Timing
          1. Table 5-32 I2C Timing
        5. 5.14.4.5 Serial Peripheral Interface (SPI) Timing
          1. 5.14.4.5.1 SPI Master Mode Timing
            1. Table 5-33 SPI Master Mode External Timing (Clock Phase = 0)
            2. Table 5-34 SPI Master Mode External Timing (Clock Phase = 1)
          2. 5.14.4.5.2 SPI Slave Mode Timing
            1. Table 5-35 SPI Slave Mode External Timing (Clock Phase = 0)
            2. Table 5-36 SPI Slave Mode External Timing (Clock Phase = 1)
      5. 5.14.5 Emulator Connection Without Signal Buffering for the DSP
      6. 5.14.6 Flash Timing
        1. Table 5-37 Flash Endurance for A and S Temperature Material
        2. Table 5-38 Flash Endurance for Q Temperature Material
        3. Table 5-39 Flash Parameters at 100-MHz SYSCLKOUT
        4. Table 5-40 Flash/OTP Access Timing
        5. Table 5-41 Flash Data Retention Duration
    15. 5.15 On-Chip Analog-to-Digital Converter
      1. Table 5-43 ADC Electrical Characteristics
      2. 5.15.1     ADC Power-Up Control Bit Timing
        1. Table 5-44 ADC Power-Up Delays
        2. Table 5-45 Current Consumption for Different ADC Configurations (at 12.5-MHz ADCCLK)
      3. 5.15.2     Definitions
      4. 5.15.3     Sequential Sampling Mode (Single-Channel) (SMODE = 0)
        1. Table 5-46 Sequential Sampling Mode Timing
      5. 5.15.4     Simultaneous Sampling Mode (Dual-Channel) (SMODE = 1)
        1. Table 5-47 Simultaneous Sampling Mode Timing
      6. 5.15.5     Detailed Descriptions
    16. 5.16 Migrating From F280x Devices to C280x Devices
      1. 5.16.1 Migration Issues
    17. 5.17 ROM Timing (C280x only)
      1. Table 5-48 ROM/OTP Access Timing
  6. 6Detailed Description
    1. 6.1 Brief Descriptions
      1. 6.1.1  C28x CPU
      2. 6.1.2  Memory Bus (Harvard Bus Architecture)
      3. 6.1.3  Peripheral Bus
      4. 6.1.4  Real-Time JTAG and Analysis
      5. 6.1.5  Flash
      6. 6.1.6  ROM
      7. 6.1.7  M0, M1 SARAMs
      8. 6.1.8  L0, L1, H0 SARAMs
      9. 6.1.9  Boot ROM
      10. 6.1.10 Security
      11. 6.1.11 Peripheral Interrupt Expansion (PIE) Block
      12. 6.1.12 External Interrupts (XINT1, XINT2, XNMI)
      13. 6.1.13 Oscillator and PLL
      14. 6.1.14 Watchdog
      15. 6.1.15 Peripheral Clocking
      16. 6.1.16 Low-Power Modes
      17. 6.1.17 Peripheral Frames 0, 1, 2 (PFn)
      18. 6.1.18 General-Purpose Input/Output (GPIO) Multiplexer
      19. 6.1.19 32-Bit CPU-Timers (0, 1, 2)
      20. 6.1.20 Control Peripherals
      21. 6.1.21 Serial Port Peripherals
    2. 6.2 Peripherals
      1. 6.2.1  32-Bit CPU-Timers 0/1/2
      2. 6.2.2  Enhanced PWM Modules (ePWM1/2/3/4/5/6)
      3. 6.2.3  Hi-Resolution PWM (HRPWM)
      4. 6.2.4  Enhanced CAP Modules (eCAP1/2/3/4)
      5. 6.2.5  Enhanced QEP Modules (eQEP1/2)
      6. 6.2.6  Enhanced Analog-to-Digital Converter (ADC) Module
        1. 6.2.6.1 ADC Connections if the ADC Is Not Used
        2. 6.2.6.2 ADC Registers
      7. 6.2.7  Enhanced Controller Area Network (eCAN) Modules (eCAN-A and eCAN-B)
      8. 6.2.8  Serial Communications Interface (SCI) Modules (SCI-A, SCI-B)
      9. 6.2.9  Serial Peripheral Interface (SPI) Modules (SPI-A, SPI-B, SPI-C, SPI-D)
      10. 6.2.10 Inter-Integrated Circuit (I2C)
      11. 6.2.11 GPIO MUX
    3. 6.3 Memory Maps
    4. 6.4 Register Map
      1. 6.4.1 Device Emulation Registers
    5. 6.5 Interrupts
      1. 6.5.1 External Interrupts
    6. 6.6 System Control
      1. 6.6.1 OSC and PLL Block
        1. 6.6.1.1 External Reference Oscillator Clock Option
        2. 6.6.1.2 PLL-Based Clock Module
        3. 6.6.1.3 Loss of Input Clock
      2. 6.6.2 Watchdog Block
    7. 6.7 Low-Power Modes Block
  7. 7Applications, Implementation, and Layout
    1. 7.1 TI Design or Reference Design
  8. 8器件和文档支持
    1. 8.1 开始使用
    2. 8.2 器件和开发支持工具命名规则
    3. 8.3 工具与软件
    4. 8.4 文档支持
    5. 8.5 相关链接
    6. 8.6 Community Resources
    7. 8.7 商标
    8. 8.8 静电放电警告
    9. 8.9 Glossary
  9. 9机械、封装和可订购信息
    1. 9.1 封装信息

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • PZ|100
  • GBA|100
  • NMF|100
散热焊盘机械数据 (封装 | 引脚)
订购信息

Table 5-43 ADC Electrical Characteristics(1)(2)

over recommended operating conditions
PARAMETER MIN TYP MAX UNIT
DC SPECIFICATIONS
Resolution 12 Bits
ADC clock 60-MHz device 0.001 7.5 MHz
100-MHz device 0.001 12.5
100-MHz device (F2809 only) 0.001 25
ACCURACY
INL (Integral nonlinearity) 1–12.5 MHz ADC clock (6.25 MSPS) ±1.5 LSB
12.5–25 MHz ADC clock (12.5 MSPS) ±2
DNL (Differential nonlinearity)(3) ±1 LSB
Offset error(4) –60 +60 LSB
Offset error with hardware trimming ±4 LSB
Overall gain error with internal reference(5) –60 +60 LSB
Overall gain error with external reference –60 +60 LSB
Channel-to-channel offset variation ±4 LSB
Channel-to-channel gain variation ±4 LSB
ANALOG INPUT
Analog input voltage (ADCINx to ADCLO)(6) 0 3 V
ADCLO –5 0 5 mV
Input capacitance 10 pF
Input leakage current ±5 μA
INTERNAL VOLTAGE REFERENCE(5)
VADCREFP - ADCREFP output voltage at the pin based on internal reference 1.275 V
VADCREFM - ADCREFM output voltage at the pin based on internal reference 0.525 V
Voltage difference, ADCREFP - ADCREFM 0.75 V
Temperature coefficient 50 PPM/°C
EXTERNAL VOLTAGE REFERENCE(5)(7)
VADCREFIN - External reference voltage input on ADCREFIN pin 0.2% or better accurate reference recommended ADCREFSEL[15:14] = 11b 1.024 V
ADCREFSEL[15:14] = 10b 1.500 V
ADCREFSEL[15:14] = 01b 2.048 V
AC SPECIFICATIONS
SINAD (100 kHz) Signal-to-noise ratio + distortion 67.5 dB
SNR (100 kHz) Signal-to-noise ratio 68 dB
THD (100 kHz) Total harmonic distortion –79 dB
ENOB (100 kHz) Effective number of bits 10.9 Bits
SFDR (100 kHz) Spurious free dynamic range 83 dB
(1) Tested at 12.5 MHz ADCCLK.
(2) All voltages listed in this table are with respect to VSSA2.
(3) TI specifies that the ADC will have no missing codes.
(4) 1 LSB has the weighted value of 3.0/4096 = 0.732 mV.
(5) A single internal/external band gap reference sources both ADCREFP and ADCREFM signals, and hence, these voltages track together. The ADC converter uses the difference between these two as its reference. The total gain error listed for the internal reference is inclusive of the movement of the internal bandgap over temperature. Gain error over temperature for the external reference option will depend on the temperature profile of the source used.
(6) Voltages above VDDA + 0.3 V or below VSS - 0.3 V applied to an analog input pin may temporarily affect the conversion of another pin. To avoid this, the analog inputs should be kept within these limits.
(7) TI recommends using high precision external reference TI part REF3020/3120 or equivalent for 2.048-V reference.
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