ZHCSCJ1C February   2014  – June 2016 TMS570LC4357

PRODUCTION DATA.  

  1. 1 器件概述
    1. 1.1 特性
    2. 1.2 应用
    3. 1.3 说明
    4. 1.4 功能方框图
  2. 2 修订历史记录
  3. 3 Device Comparison
  4. 4 Terminal Configuration and Functions
    1. 4.1 ZWT BGA Package Ball-Map (337 Terminal Grid Array)
    2. 4.2 Terminal Functions
      1. 4.2.1 ZWT Package
        1. 4.2.1.1  Multibuffered Analog-to-Digital Converters (MibADC)
        2. 4.2.1.2  Enhanced High-End Timer Modules (N2HET)
        3. 4.2.1.3  RAM Trace Port (RTP)
        4. 4.2.1.4  Enhanced Capture Modules (eCAP)
        5. 4.2.1.5  Enhanced Quadrature Encoder Pulse Modules (eQEP)
        6. 4.2.1.6  Enhanced Pulse-Width Modulator Modules (ePWM)
        7. 4.2.1.7  Data Modification Module (DMM)
        8. 4.2.1.8  General-Purpose Input / Output (GIO)
        9. 4.2.1.9  FlexRay Interface Controller (FlexRay)
        10. 4.2.1.10 Controller Area Network Controllers (DCAN)
        11. 4.2.1.11 Local Interconnect Network Interface Module (LIN)
        12. 4.2.1.12 Standard Serial Communication Interface (SCI)
        13. 4.2.1.13 Inter-Integrated Circuit Interface Module (I2C)
        14. 4.2.1.14 Multibuffered Serial Peripheral Interface Modules (MibSPI)
        15. 4.2.1.15 Ethernet Controller
        16. 4.2.1.16 External Memory Interface (EMIF)
        17. 4.2.1.17 Embedded Trace Macrocell Interface for Cortex-R5F (ETM-R5)
        18. 4.2.1.18 System Module Interface
        19. 4.2.1.19 Clock Inputs and Outputs
        20. 4.2.1.20 Test and Debug Modules Interface
        21. 4.2.1.21 Flash Supply and Test Pads
        22. 4.2.1.22 Supply for Core Logic: 1.2-V Nominal
        23. 4.2.1.23 Supply for I/O Cells: 3.3-V Nominal
        24. 4.2.1.24 Ground Reference for All Supplies Except VCCAD
        25. 4.2.1.25 Other Supplies
      2. 4.2.2 Multiplexing
        1. 4.2.2.1 Output Multiplexing
          1. 4.2.2.1.1 Notes on Output Multiplexing
        2. 4.2.2.2 Input Multiplexing
          1. 4.2.2.2.1 Notes on Input Multiplexing
          2. 4.2.2.2.2 General Rules for Multiplexing Control Registers
  5. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Power-On Hours (POH)
    4. 5.4  Device Recommended Operating Conditions
    5. 5.5  Switching Characteristics over Recommended Operating Conditions for Clock Domains
    6. 5.6  Wait States Required - L2 Memories
    7. 5.7  Power Consumption Summary
    8. 5.8  Input/Output Electrical Characteristics Over Recommended Operating Conditions
    9. 5.9  Thermal Resistance Characteristics for the BGA Package (ZWT)
    10. 5.10 Timing and Switching Characteristics
      1. 5.10.1 Input Timings
      2. 5.10.2 Output Timings
  6. 6 System Information and Electrical Specifications
    1. 6.1  Device Power Domains
    2. 6.2  Voltage Monitor Characteristics
      1. 6.2.1 Important Considerations
      2. 6.2.2 Voltage Monitor Operation
      3. 6.2.3 Supply Filtering
    3. 6.3  Power Sequencing and Power-On Reset
      1. 6.3.1 Power-Up Sequence
      2. 6.3.2 Power-Down Sequence
      3. 6.3.3 Power-On Reset: nPORRST
        1. 6.3.3.1 nPORRST Electrical and Timing Requirements
    4. 6.4  Warm Reset (nRST)
      1. 6.4.1 Causes of Warm Reset
      2. 6.4.2 nRST Timing Requirements
    5. 6.5  ARM Cortex-R5F CPU Information
      1. 6.5.1 Summary of ARM Cortex-R5F CPU Features
      2. 6.5.2 Dual Core Implementation
      3. 6.5.3 Duplicate Clock Tree After GCLK
      4. 6.5.4 ARM Cortex-R5F CPU Compare Module (CCM) for Safety
        1. 6.5.4.1 Signal Compare Operating Modes
          1. 6.5.4.1.1 Active Compare Lockstep Mode
          2. 6.5.4.1.2 Self-Test Mode
          3. 6.5.4.1.3 Error Forcing Mode
          4. 6.5.4.1.4 Self-Test Error Forcing Mode
        2. 6.5.4.2 Bus Inactivity Monitor
        3. 6.5.4.3 CPU Registers Initialization
      5. 6.5.5 CPU Self-Test
        1. 6.5.5.1 Application Sequence for CPU Self-Test
        2. 6.5.5.2 CPU Self-Test Clock Configuration
        3. 6.5.5.3 CPU Self-Test Coverage
      6. 6.5.6 N2HET STC / LBIST Self-Test Coverage
    6. 6.6  Clocks
      1. 6.6.1 Clock Sources
        1. 6.6.1.1 Main Oscillator
          1. 6.6.1.1.1 Timing Requirements for Main Oscillator
        2. 6.6.1.2 Low-Power Oscillator
          1. 6.6.1.2.1 Features
          2. 6.6.1.2.2 LPO Electrical and Timing Specifications
        3. 6.6.1.3 Phase-Locked Loop (PLL) Clock Modules
          1. 6.6.1.3.1 Block Diagram
          2. 6.6.1.3.2 PLL Timing Specifications
        4. 6.6.1.4 External Clock Inputs
      2. 6.6.2 Clock Domains
        1. 6.6.2.1 Clock Domain Descriptions
        2. 6.6.2.2 Mapping of Clock Domains to Device Modules
      3. 6.6.3 Special Clock Source Selection Scheme for VCLKA4_DIVR_EMAC
      4. 6.6.4 Clock Test Mode
    7. 6.7  Clock Monitoring
      1. 6.7.1 Clock Monitor Timings
      2. 6.7.2 External Clock (ECLK) Output Functionality
      3. 6.7.3 Dual Clock Comparators
        1. 6.7.3.1 Features
        2. 6.7.3.2 Mapping of DCC Clock Source Inputs
    8. 6.8  Glitch Filters
    9. 6.9  Device Memory Map
      1. 6.9.1 Memory Map Diagram
      2. 6.9.2 Memory Map Table
      3. 6.9.3 Special Consideration for CPU Access Errors Resulting in Imprecise Aborts
      4. 6.9.4 Master/Slave Access Privileges
        1. 6.9.4.1 Special Notes on Accesses to Certain Slaves
      5. 6.9.5 MasterID to PCRx
      6. 6.9.6 CPU Interconnect Subsystem SDC MMR Port
      7. 6.9.7 Parameter Overlay Module (POM) Considerations
    10. 6.10 Flash Memory
      1. 6.10.1 Flash Memory Configuration
      2. 6.10.2 Main Features of Flash Module
      3. 6.10.3 ECC Protection for Flash Accesses
      4. 6.10.4 Flash Access Speeds
      5. 6.10.5 Flash Program and Erase Timings
        1. 6.10.5.1 Flash Program and Erase Timings for Program Flash
        2. 6.10.5.2 Flash Program and Erase Timings for Data Flash
    11. 6.11 L2RAMW (Level 2 RAM Interface Module)
      1. 6.11.1 L2 SRAM Initialization
    12. 6.12 ECC / Parity Protection for Accesses to Peripheral RAMs
    13. 6.13 On-Chip SRAM Initialization and Testing
      1. 6.13.1 On-Chip SRAM Self-Test Using PBIST
        1. 6.13.1.1 Features
        2. 6.13.1.2 PBIST RAM Groups
      2. 6.13.2 On-Chip SRAM Auto Initialization
    14. 6.14 External Memory Interface (EMIF)
      1. 6.14.1 Features
      2. 6.14.2 Electrical and Timing Specifications
        1. 6.14.2.1 Read Timing (Asynchronous RAM)
        2. 6.14.2.2 Write Timing (Asynchronous RAM)
        3. 6.14.2.3 EMIF Asynchronous Memory Timing
        4. 6.14.2.4 Read Timing (Synchronous RAM)
        5. 6.14.2.5 Write Timing (Synchronous RAM)
        6. 6.14.2.6 EMIF Synchronous Memory Timing
    15. 6.15 Vectored Interrupt Manager
      1. 6.15.1 VIM Features
      2. 6.15.2 Interrupt Generation
      3. 6.15.3 Interrupt Request Assignments
    16. 6.16 ECC Error Event Monitoring and Profiling
      1. 6.16.1 EPC Module Operation
        1. 6.16.1.1 Correctable Error Handling
        2. 6.16.1.2 Uncorrectable Error Handling
    17. 6.17 DMA Controller
      1. 6.17.1 DMA Features
      2. 6.17.2 DMA Transfer Port Assignment
      3. 6.17.3 Default DMA Request Map
      4. 6.17.4 Using a GIO terminal as a DMA Request Input
    18. 6.18 Real-Time Interrupt Module
      1. 6.18.1 Features
      2. 6.18.2 Block Diagrams
      3. 6.18.3 Clock Source Options
      4. 6.18.4 Network Time Synchronization Inputs
    19. 6.19 Error Signaling Module
      1. 6.19.1 ESM Features
      2. 6.19.2 ESM Channel Assignments
    20. 6.20 Reset / Abort / Error Sources
    21. 6.21 Digital Windowed Watchdog
    22. 6.22 Debug Subsystem
      1. 6.22.1  Block Diagram
      2. 6.22.2  Debug Components Memory Map
      3. 6.22.3  Embedded Cross Trigger
      4. 6.22.4  JTAG Identification Code
      5. 6.22.5  Debug ROM
      6. 6.22.6  JTAG Scan Interface Timings
      7. 6.22.7  Advanced JTAG Security Module
      8. 6.22.8  Embedded Trace Macrocell (ETM-R5)
        1. 6.22.8.1 ETM TRACECLKIN Selection
        2. 6.22.8.2 Timing Specifications
      9. 6.22.9  RAM Trace Port (RTP)
        1. 6.22.9.1 RTP Features
        2. 6.22.9.2 Timing Specifications
      10. 6.22.10 Data Modification Module (DMM)
        1. 6.22.10.1 DMM Features
        2. 6.22.10.2 Timing Specifications
      11. 6.22.11 Boundary Scan Chain
  7. 7 Peripheral Information and Electrical Specifications
    1. 7.1  Enhanced Translator PWM Modules (ePWM)
      1. 7.1.1 ePWM Clocking and Reset
      2. 7.1.2 Synchronization of ePWMx Time-Base Counters
      3. 7.1.3 Synchronizing all ePWM Modules to the N2HET1 Module Time Base
      4. 7.1.4 Phase-Locking the Time-Base Clocks of Multiple ePWM Modules
      5. 7.1.5 ePWM Synchronization with External Devices
      6. 7.1.6 ePWM Trip Zones
        1. 7.1.6.1 Trip Zones TZ1n, TZ2n, TZ3n
        2. 7.1.6.2 Trip Zone TZ4n
        3. 7.1.6.3 Trip Zone TZ5n
        4. 7.1.6.4 Trip Zone TZ6n
      7. 7.1.7 Triggering of ADC Start of Conversion Using ePWMx SOCA and SOCB Outputs
      8. 7.1.8 Enhanced Translator-Pulse Width Modulator (ePWMx) Electrical Data/Timing
    2. 7.2  Enhanced Capture Modules (eCAP)
      1. 7.2.1 Clock Enable Control for eCAPx Modules
      2. 7.2.2 PWM Output Capability of eCAPx
      3. 7.2.3 Input Connection to eCAPx Modules
      4. 7.2.4 Enhanced Capture Module (eCAP) Electrical Data/Timing
    3. 7.3  Enhanced Quadrature Encoder (eQEP)
      1. 7.3.1 Clock Enable Control for eQEPx Modules
      2. 7.3.2 Using eQEPx Phase Error to Trip ePWMx Outputs
      3. 7.3.3 Input Connection to eQEPx Modules
      4. 7.3.4 Enhanced Quadrature Encoder Pulse (eQEPx) Timing
    4. 7.4  12-bit Multibuffered Analog-to-Digital Converter (MibADC)
      1. 7.4.1 MibADC Features
      2. 7.4.2 Event Trigger Options
        1. 7.4.2.1 MibADC1 Event Trigger Hookup
        2. 7.4.2.2 MibADC2 Event Trigger Hookup
        3. 7.4.2.3 Controlling ADC1 and ADC2 Event Trigger Options Using SOC Output from ePWM Modules
      3. 7.4.3 ADC Electrical and Timing Specifications
      4. 7.4.4 Performance (Accuracy) Specifications
        1. 7.4.4.1 MibADC Nonlinearity Errors
        2. 7.4.4.2 MibADC Total Error
    5. 7.5  General-Purpose Input/Output
      1. 7.5.1 Features
    6. 7.6  Enhanced High-End Timer (N2HET)
      1. 7.6.1 Features
      2. 7.6.2 N2HET RAM Organization
      3. 7.6.3 Input Timing Specifications
      4. 7.6.4 N2HET1-N2HET2 Interconnections
      5. 7.6.5 N2HET Checking
        1. 7.6.5.1 Internal Monitoring
        2. 7.6.5.2 Output Monitoring using Dual Clock Comparator (DCC)
      6. 7.6.6 Disabling N2HET Outputs
      7. 7.6.7 High-End Timer Transfer Unit (HET-TU)
        1. 7.6.7.1 Features
        2. 7.6.7.2 Trigger Connections
    7. 7.7  FlexRay Interface
      1. 7.7.1 Features
      2. 7.7.2 Electrical and Timing Specifications
      3. 7.7.3 FlexRay Transfer Unit
    8. 7.8  Controller Area Network (DCAN)
      1. 7.8.1 Features
      2. 7.8.2 Electrical and Timing Specifications
    9. 7.9  Local Interconnect Network Interface (LIN)
      1. 7.9.1 LIN Features
    10. 7.10 Serial Communication Interface (SCI)
      1. 7.10.1 Features
    11. 7.11 Inter-Integrated Circuit (I2C)
      1. 7.11.1 Features
      2. 7.11.2 I2C I/O Timing Specifications
    12. 7.12 Multibuffered / Standard Serial Peripheral Interface
      1. 7.12.1 Features
      2. 7.12.2 MibSPI Transmit and Receive RAM Organization
      3. 7.12.3 MibSPI Transmit Trigger Events
        1. 7.12.3.1 MIBSPI1 Event Trigger Hookup
        2. 7.12.3.2 MIBSPI2 Event Trigger Hookup
        3. 7.12.3.3 MIBSPI3 Event Trigger Hookup
        4. 7.12.3.4 MIBSPI4 Event Trigger Hookup
        5. 7.12.3.5 MIBSPI5 Event Trigger Hookup
      4. 7.12.4 MibSPI/SPI Master Mode I/O Timing Specifications
      5. 7.12.5 SPI Slave Mode I/O Timings
    13. 7.13 Ethernet Media Access Controller
      1. 7.13.1 Ethernet MII Electrical and Timing Specifications
      2. 7.13.2 Ethernet RMII Timing
      3. 7.13.3 Management Data Input/Output (MDIO)
  8. 8 Applications, Implementation, and Layout
    1. 8.1 TI Design or Reference Design
  9. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
      2. 9.1.2 Device and Development-Support Tool Nomenclature
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation from Texas Instruments
      2. 9.2.2 Receiving Notification of Documentation Updates
      3. 9.2.3 社区资源
    3. 9.3 商标
    4. 9.4 静电放电警告
    5. 9.5 Glossary
    6. 9.6 Device Identification
      1. 9.6.1 Device Identification Code Register
      2. 9.6.2 Die Identification Registers
    7. 9.7 Module Certifications
      1. 9.7.1 FlexRay Certifications
      2. 9.7.2 DCAN Certification
      3. 9.7.3 LIN Certification
        1. 9.7.3.1 LIN Master Mode
        2. 9.7.3.2 LIN Slave Mode - Fixed Baud Rate
        3. 9.7.3.3 LIN Slave Mode - Adaptive Baud Rate
  10. 10Mechanical Data
    1. 10.1 Packaging Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • ZWT|337
散热焊盘机械数据 (封装 | 引脚)
订购信息

9 Device and Documentation Support

9.1 Device Support

9.1.1 Development Support

Texas Instruments (TI) offers an extensive line of development tools for the Hercules™ Safety generation of MCUs, including tools to evaluate the performance of the processors, generate code, develop algorithm implementations, and fully integrate and debug software and hardware modules.

The following products support development of Hercules™-based applications:

Software Development Tools

  • Code Composer Studio™ Integrated Development Environment (IDE)
    • C/C++ Compiler
    • Code generation tools
    • Assembler/Linker
    • Cycle Accurate Simulator
  • Application algorithms
  • Sample applications code

Hardware Development Tools

  • Development and evaluation boards
  • JTAG-based emulators - XDS100 v2, XDS200, XDS560™ v2 emulator
  • Flash programming tools
  • Power supply
  • Documentation and cables

9.1.2 Device and Development-Support Tool Nomenclature

To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all devices. Each commercial family member has one of three prefixes: TMX, TMP, or TMS. These prefixes represent evolutionary stages of product development from engineering prototypes (TMX) through fully qualified production devices (TMS).

Device development evolutionary flow:

    TMX Experimental device that is not necessarily representative of the final device's electrical specifications.
    TMP Final silicon die that conforms to the device's electrical specifications but has not completed quality and reliability verification.
    TMS Fully-qualified production device.

TMX and TMP devices are shipped against the following disclaimer:

"Developmental product is intended for internal evaluation purposes."

TMS devices have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies.

Predictions show that prototype devices (TMX or TMP) have a greater failure rate than the standard production devices. Texas Instruments recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used.

Figure 9-1 shows the numbering and symbol nomenclature for the TMS570LC4357.

TMS570LC4357 device_numbering_conv_f3_spns195.gif Figure 9-1 TMS570LC4357 Device Numbering Conventions

9.2 Documentation Support

The following documents describe the TMS570LC4357 microcontroller..

    SPNU563TMS570LC43x 16/32-Bit RISC Flash Microcontroller Technical Reference Manual details the integration, the environment, the functional description, and the programming models for each peripheral and subsystem in the device.
    SPNZ180TMS570LC4357 Microcontroller, Silicon Revision A, Silicon Errata describes the usage notes and known exceptions to the functional specifications for the device silicon revision(s).
    SPNZ232TMS570LC4x Microcontroller, Silicon Revision B, Silicon Errata describes the usage notes and known exceptions to the functional specifications for the device silicon revision(s).

9.2.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

9.2.3 社区资源

下列链接提供到 TI 社区资源的连接。 链接的内容由各个分销商“按照原样”提供。 这些内容并不构成 TI 技术规范和标准且不一定反映 TI 的观点；请见 TI 的使用条款。

    TI E2E™ 在线社区 TI 工程师对工程师 (E2E) 社区。 此社区的创建目的是为了促进工程师之间协作。 在 e2e.ti.com 中，您可以咨询问题、共享知识、探索思路，在同领域工程师的帮助下解决问题。
    米6体育平台手机版_好二三四 (TI) 嵌入式处理器维基网站 米6体育平台手机版_好二三四 (TI) 嵌入式处理器维基网站。 此网站的建立是为了帮助开发人员从米6体育平台手机版_好二三四 (TI) 的嵌入式处理器入门并且也为了促进与这些器件相关的硬件和软件的总体知识的创新和增长。

9.3 商标

Hercules, Code Composer Studio, XDS560, E2E are trademarks of Texas Instruments.

CoreSight is a registered trademark of ARM Limited (or its subsidiaries) in the EU and.

ARM, Cortex are registered trademarks of ARM Limited (or its subsidiaries) in the EU and.

ETM is a trademark of ARM Limited.

All other trademarks are the property of their respective owners.

9.4 静电放电警告

esds-image

ESD 可能会损坏该集成电路。米6体育平台手机版_好二三四 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序 , 可能会损坏集成电路。

ESD 的损坏小至导致微小的性能降级 , 大至整个器件故障。 精密的集成电路可能更容易受到损坏 , 这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。

9.5 Glossary

    TI Glossary This glossary lists and explains terms, acronyms, and definitions.

9.6 Device Identification

9.6.1 Device Identification Code Register

The device identification code register is memory mapped to address FFFF FFF0h and identifies several aspects of the device including the silicon version. The details of the device identification code register are provided in Table 9-1. The device identification code register value for this device is:

  • Rev A = 0x8044AD05
  • Rev B = 0x8044AD0D

31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16
CP-15 UNIQUE ID TECH
R-1 R-00000000100010 R-0
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
TECH I/O VOLTAGE PERIPH PARITY FLASH ECC RAM ECC VERSION 1 0 1
R-101 R-0 R-1 R-10 R-1 R-00000 R-1 R-0 R-1
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Figure 9-2 Device ID Bit Allocation Register

Table 9-1 Device ID Bit Allocation Register Field Descriptions

Bit Field Value Description
31 CP15 Indicates the presence of coprocessor 15
1 CP15 present
30-17 UNIQUE ID 100011

Silicon version (revision) bits.

This bitfield holds a unique number for a dedicated device configuration (die).
16-13 TECH Process technology on which the device is manufactured.
0101 F021
12 I/O VOLTAGE I/O voltage of the device.
0 I/O are 3.3v
11 PERIPHERAL PARITY Peripheral Parity
1 Parity on peripheral memories
10-9 FLASH ECC Flash ECC
10 Program memory with ECC
8 RAM ECC Indicates if RAM ECC is present.
1 ECC implemented
7-3 REVISION Revision of the Device.
2-0 101 The platform family ID is always 0b101

9.6.2 Die Identification Registers

The two die ID registers at addresses 0xFFFFFF7C and 0xFFFFFF80 form a 64-bit die id with the information as listed in Table 9-2.

Table 9-2 Die-ID Registers

Item # of Bits Bit Location
X Coord. on Wafer 12 0xFFFFFF7C[11:0]
Y Coord. on Wafer 12 0xFFFFFF7C[23:12]
Wafer # 8 0xFFFFFF7C[31:24]
Lot # 24 0xFFFFFF80[23:0]
Reserved 8 0xFFFFFF80[31:24]

9.7 Module Certifications

The following communications modules have received certification of adherence to a standard.

9.7.1 FlexRay Certifications

TMS570LC4357 FlexRay_Cert_REVB.png Figure 9-3 FlexRay Certification for ZWT Package

9.7.2 DCAN Certification

TMS570LC4357 CAN_Certification_2011_02_08.png Figure 9-4 DCAN Certification

9.7.3 LIN Certification

9.7.3.1 LIN Master Mode

TMS570LC4357 LIN_Certification_DLL21_Master_20121130_130513_TMS570LS_V1 0.png Figure 9-5 LIN Certification - Master Mode

9.7.3.2 LIN Slave Mode - Fixed Baud Rate

TMS570LC4357 LIN_Certification_DLL21_Slave_Fixed_20121130_130513_TMS570LS_V1 0.png Figure 9-6 LIN Certification - Slave Mode - Fixed Baud Rate

9.7.3.3 LIN Slave Mode - Adaptive Baud Rate

TMS570LC4357 new_LIN_Certification_Slave_Adapt.png Figure 9-7 LIN Certification - Slave Mode - Adaptive Baud Rate
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