ZHCSJ03B November   2018  – February 2024 TMUX1108

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics (VDD = 5V ±10 %)
    6. 6.6  Electrical Characteristics (VDD = 3.3V ±10 %)
    7. 6.7  Electrical Characteristics (VDD = 2.5V ±10 %), (VSS = –2.5V ±10 %)
    8. 6.8  Electrical Characteristics (VDD = 1.8V ±10 %)
    9. 6.9  Electrical Characteristics (VDD = 1.2V ±10 %)
    10. 6.10 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
      1. 7.1.1  On-Resistance
      2. 7.1.2  Off-Leakage Current
      3. 7.1.3  On-Leakage Current
      4. 7.1.4  Transition Time
      5. 7.1.5  Break-Before-Make Delay
      6. 7.1.6  Turn-On and Turn-Off Time
      7. 7.1.7  Charge Injection
      8. 7.1.8  Off Isolation
      9. 7.1.9  Crosstalk
      10. 7.1.10 Bandwidth
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Bidirectional Operation
      2. 7.3.2 Rail to Rail Operation
      3. 7.3.3 1.8V Logic Compatible Inputs
      4. 7.3.4 Fail-Safe Logic
      5. 7.3.5 Ultra-low Leakage Current
      6. 7.3.6 Ultra-low Charge Injection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Truth Tables
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 接收文档更新通知
    3. 9.3 支持资源
    4. 9.4 Trademarks
    5. 9.5 静电放电警告
    6. 9.6 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5 Pin Configuration and Functions

GUID-42836BE9-9697-45D7-A97C-1F17879D4386-low.svgFigure 5-1 TMUX1108: PW Package,16-Pin TSSOP(Top View)
GUID-8F196453-CD9D-4AB2-BA38-D561369795DF-low.svgFigure 5-2 TMUX1108: RSV Package,16-Pin QFN(Top View)
Table 5-1 Pin Functions
PIN TYPE(1) DESCRIPTION
NAME TSSOP UQFN
A0 1 15 I Address line 0
EN 2 16 I Active high logic input. When this pin is low, all switches are turned off. When this pin is high, the A[2:0] logic inputs determine which switch is turned on.
VSS 3 1 P Negative power supply. This pin is the most negative power-supply potential. For reliable operation, connect a decoupling capacitor ranging from 0.1µF to 10µF between VSS and GND. VSS can be connected to ground for single supply applications.
S1 4 2 I/O Source pin 1. Can be an input or output.
S2 5 3 I/O Source pin 2. Can be an input or output.
S3 6 4 I/O Source pin 3. Can be an input or output.
S4 7 5 I/O Source pin 4. Can be an input or output.
D 8 6 I/O Drain pin. Can be an input or output.
S8 9 7 I/O Source pin 8. Can be an input or output.
S7 10 8 I/O Source pin 7. Can be an input or output.
S6 11 9 I/O Source pin 6. Can be an input or output.
S5 12 10 I/O Source pin 5. Can be an input or output.
VDD 13 11 P Positive power supply. This pin is the most positive power-supply potential. For reliable operation, connect a decoupling capacitor ranging from 0.1µF to 10µF between VDD and GND.
GND 14 12 P Ground (0V) reference
A2 15 13 I Address line 2
A1 16 14 I Address line 1
(1) I = input, O = output, I/O = input and output, P = power
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