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ZHCSJ53A December 2018 – February 2024 TMUX1109

PRODUCTION DATA

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)

PW|16
RSV|16

散热焊盘机械数据 (封装 | 引脚)

订购信息

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)⁽¹⁾⁽²⁾⁽³⁾

		MIN	MAX	UNIT
V_DD–V_SS	Supply voltage	–0.5	6	V
V_DD		–0.5	6	V
V_SS		–3.0	0.3	V
V_SEL or V_EN	Logic control input pin voltage (EN, A0, A1)	–0.5	6	V
I_SEL or I_EN	Logic control input pin current (EN, A0, A1)	–30	30	mA
V_S or V_D	Source or drain voltage (Sx, Dx)	–0.5	V_DD+0.5	V
I_S or I_{D (CONT)}	Source or drain continuous current (Sx, Dx)	IDC ± 10 %⁽⁴⁾	IDC ± 10 %⁽⁴⁾	mA
I_S or I_{D (PEAK)}	Source and drain peak current: (1 ms period max, 10% duty cycle maximum) (Sx, SxA, SxB, D, DA, DB)	Ipeak ± 10 %⁽⁴⁾	Ipeak ± 10 %⁽⁴⁾	mA
T_stg	Storage temperature	–65	150	°C
P_tot	Total power dissipation⁽⁵⁾⁽⁶⁾		500	mW
T_J	Junction temperature		150	°C

(1) Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum.

(3) All voltages are with respect to ground, unless otherwise specified.

(4) Refer to Recommended Operating Conditions for I_DC and I_Peak ratings.

(5) For TSSOP package: P_tot derates linearly above TA=90°C by 8.41mW/°C

(6) For QFN package: P_totderates linearly above TA=82°C by 7.43mW/°C