米6体育平台手机版

ZHCSSW6 august 2023 TMUX121

PRODUCTION DATA

6.4 Thermal Information

THERMAL METRIC⁽¹⁾		TMUX121	UNIT
		NKG (UQFN)
		10 PINS
R_θJA	Junction-to-ambient thermal resistance - High K	225.9	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	93.5	°C/W
R_θJB	Junction-to-board thermal resistance	147.5	°C/W
ψ_JT	Junction-to-top characterization parameter	3.4	°C/W
ψ_JB	Junction-to-board characterization parameter	147.1	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.