ZHCSGX3E august   2017  – june 2023 TMUX136

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Dynamic Characteristics
    7. 6.7 Timing Requirements
    8. 6.8 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Low Power Mode
    4. 8.4 Device Functional Modes
      1. 8.4.1 High Impedance Mode
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 接收文档更新通知
    3. 10.3 支持资源
    4. 10.4 Trademarks
    5. 10.5 静电放电警告
    6. 10.6 术语表
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • RSE|10
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from Revision D (August 2020) to Revision E (June 2023)

  • 向数据表添加了 I3C (SenseWire) 应用信息Go
  • 添加了封装信息 表Go

Changes from Revision C (July 2018) to Revision D (August 2020)

  • Added new specification limits to support added temperature range TA = -40°C to +125°C Go

Changes from Revision B (November 2017) to Revision C (July 2018)

  • Changed pin 6 To: EN, pin 7 To: COM2, and pin 8 To: COM1 in Figure 9-19 Go

Changes from Revision A (October 2017) to Revision B (November 2017)

  • Changed Pin 7 From: COM1 To: COM2Go
  • Changed Pin 8 From: COM2 To: COM1Go
  • Deleted SPRAAR7D link From Related Documentation. Go

Changes from Revision * (August 2017) to Revision A (October 2017)

  • Changed the HBM value From: ±3500 To: ±5000 in the ESD Ratings tableGo
  • Changed D+/- To: COM, USB+/- To: A, and MHL+/- To: B in fig 5 (don't show in history per LBE and Cheri Davis (CMS)Go
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