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ZHCSGX3E august 2017 – june 2023 TMUX136

PRODUCTION DATA

请参考 PDF 数据表获取器件具体的封装图。

6.4 Thermal Information

THERMAL METRIC ⁽¹⁾		TMUX136	UNIT
		RSE (UQFN)
		10 PINS
R_θJA	Junction-to-ambient thermal resistance	191.6	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	94.3	°C/W
R_θJB	Junction-to-board thermal resistance	117.5	°C/W
ψ_JT	Junction-to-top characterization parameter	7.4	°C/W
ψ_JB	Junction-to-board characterization parameter	117.4	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.