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ZHCSIT7A September 2018 – December 2018 TMUX6119

PRODUCTION DATA.

THERMAL METRIC⁽¹⁾		TMUX6119	UNIT
		DCN (SOT-23)
		8 PINS
R_θJA	Junction-to-ambient thermal resistance	180.5	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	138.8	°C/W
R_θJB	Junction-to-board thermal resistance	90.4	°C/W
Ψ_JT	Junction-to-top characterization parameter	73.7	°C/W
Ψ_JB	Junction-to-board characterization parameter	90.5	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.