米6体育平台手机版

ZHCSJ87A December 2018 – July 2022 TMUX6121 , TMUX6122 , TMUX6123

PRODUCTION DATA

6.3 Thermal Information

THERMAL METRIC⁽¹⁾		TMUX6121/ TMUX6122/ TMUX6123	UNIT
		DGS (VSSOP)
		10 PINS
R_θJA	Junction-to-ambient thermal resistance	180.7	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	66.2	°C/W
R_θJB	Junction-to-board thermal resistance	103.2	°C/W
Ψ_JT	Junction-to-top characterization parameter	11.2	°C/W
Ψ_JB	Junction-to-board characterization parameter	101.3	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.