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ZHCSNI4C July 2020 – July 2024 TMUX6234

PRODUCTION DATA

封装选项

机械数据 (封装 | 引脚)

PW|20
- MPDS362A
RRQ|20
- MPQF551

散热焊盘机械数据 (封装 | 引脚)

订购信息

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)⁽¹⁾⁽²⁾

		MIN	MAX	UNIT
V_DD–V_SS	Supply voltage		38	V
V_DD		–0.5	38	V
V_SS		–38	0.5	V
V_SEL or V_EN	Logic control input pin voltage (SELx, EN)	–0.5	38	V
I_SEL or I_EN	Logic control input pin current (SELx, EN)	–30	30	mA
V_S or V_D	Source or drain voltage (SxA, SxB, Dx)	V_SS–0.5	V_DD+0.5	V
I_IK	Diode clamp current⁽³⁾	–30	30	mA
I_S or I_{D (CONT)}	Source or drain continuous current (SxA, SxB, Dx)		I_DC ± 10 %⁽⁴⁾	mA
T_A	Ambient temperature	–55	150	°C
T_stg	Storage temperature	–65	150	°C
T_J	Junction temperature		150	°C
P_tot	Total power dissipation (QFN package)⁽⁵⁾		1680	mW

(1) Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) All voltages are with respect to ground, unless otherwise specified.

(3) Pins are diode-clamped to the power-supply rails. Over voltage signals must be voltage and current limited to maximum ratings.

(4) Refer to Source or Drain Continuous Current table for I_DC specifications.

(5) For QFN package: P_tot derates linearily above T_A = 70°C by 24.8mW/°C.