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ZHCSO52 June 2021 TMUX646

PRODUCTION DATA

6.4 Thermal Information

THERMAL METRIC⁽¹⁾		TMUX646	UNIT
		ZEC (nFBGA)
		36 PINS
R_θJA	Junction-to-ambient thermal resistance	111.7	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	49.2	°C/W
R_θJB	Junction-to-board thermal resistance	54.9	°C/W
Ψ_JT	Junction-to-top characterization parameter	2.0	°C/W
Ψ_JB	Junction-to-board characterization parameter	54.7	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.