米6体育平台手机版

ZHCSNM9B march 2021 – june 2023 TMUX7462F

PRODUCTION DATA

封装选项

机械数据 (封装 | 引脚)

RRP|16
- MPQF545
PW|16
- MPDS361A

散热焊盘机械数据 (封装 | 引脚)

订购信息

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)⁽¹⁾

		MIN	MAX	UNIT
V_DD to V_SS	Supply voltage		48	V
V_DD to GND		–0.3	48	V
V_SS to GND		–48	0.3	V
V_FP to GND	Fault clamping voltage	–0.3	V_DD + 0.3	V
V_FN to GND	Fault clamping voltage	VSS – 0.3	0.3	V
V_S to GND	Source input pin (Sx) voltage to GND	–65	65	V
V_S to V_DD	Source input pin (Sx) voltage to V_DDor V_D	–90		V
V_S to V_SS	Source input pin (Sx) voltage to V_SSor V_D		90	V
V_D	Drain pin (Dx) voltage	V_FN–0.7	V_FP+0.7	V
V_DR	Logic input pin (DR) voltage⁽²⁾	GND –0.7	48	V
V_FF	Logic output pin (FF) voltage⁽²⁾	GND –0.7	6	V
I_DR	Logic input pin (DR) current⁽²⁾	–30	30	mA
I_FF	Logic output pin (FF) current⁽²⁾	–10	10	mA
I_S or I_D _(CONT)	Source or drain continuous current (Sx or Dx)	I_DC ± 10 %⁽³⁾	I_DC ± 10 %⁽³⁾	mA
T_stg	Storage temperature	–65	150	°C
T_A	Ambient temperature	–55	150	°C
T_J	Junction temperature		150	°C
P_tot⁽⁴⁾	Total power dissipation (QFN)		1600	mW

(1) Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) Stresses have to be kept at or below both voltage and current ratings at all time.

(3) Refer to Recommended Operating Conditions for I_DC ratings.

(4) For QFN package: P_tot derates linearly above T_A = 70°C by 23.5 mW/°C