ZHCSP22B october   2021  – march 2023 TMUX8211 , TMUX8212 , TMUX8213

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings: TMUX821x Devices
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions: TMUX821x Devices
    4. 7.4  漏极持续电流源
    5. 7.5  漏极脉冲电流源
    6. 7.6  Thermal Information
    7. 7.7  Electrical Characteristics (Global): TMUX821x Devices
    8. 7.8  Electrical Characteristics (±15-V Dual Supply)
    9. 7.9  Electrical Characteristics (±36-V Dual Supply)
    10. 7.10 Electrical Characteristics (±50-V Dual Supply)
    11. 7.11 Electrical Characteristics (72-V Single Supply)
    12. 7.12 Electrical Characteristics (100-V Single Supply)
    13. 7.13 Switching Characteristics: TMUX821x Devices
    14. 7.14 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 On-Resistance
    2. 8.2 Off-Leakage Current
    3. 8.3 On-Leakage Current
    4. 8.4 Device Turn-On and Turn-Off Time
    5. 8.5 Charge Injection
    6. 8.6 Off Isolation
    7. 8.7 Crosstalk
    8. 8.8 Bandwidth
    9. 8.9 THD + Noise
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Bidirectional Operation
      2. 9.3.2 Flat On-Resistance
      3. 9.3.3 Protection Features
        1. 9.3.3.1 Fail-Safe Logic
        2. 9.3.3.2 ESD Protection
        3. 9.3.3.3 Latch-Up Immunity
      4. 9.3.4 1.8 V Logic Compatible Inputs
      5. 9.3.5 Integrated Pull-Down Resistor on Logic Pins
    4. 9.4 Device Functional Modes
      1. 9.4.1 Normal Mode
      2. 9.4.2 Truth Tables
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 接收文档更新通知
    3. 13.3 支持资源
    4. 13.4 Trademarks
    5. 13.5 静电放电警告
    6. 13.6 术语表
  14. 14Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.6 Thermal Information

THERMAL METRIC(1) TMUX821x TMUX821x UNIT
PW (TSSOP) RUM (WQFN)
16 PINS 16 PINS
RθJA Junction-to-ambient thermal resistance 96.0 41.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 26.8 25.3 °C/W
RθJB Junction-to-board thermal resistance 42.7 16.0 °C/W
ΨJT Junction-to-top characterization parameter 1.2 0.3 °C/W
ΨJB Junction-to-board characterization parameter 42.0 16.0 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A 3.1 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
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