On a high-K board, TI always recommends to solder the Power-pad™ onto the thermal land. A thermal land is the area of solder-tinned-copper underneath the Power-pad package. On a high-K board, the TMUXHS4212 can operate over the full temperature range by soldering the Power-pad onto the thermal land without vias.

For high speed layout guidelines, refer to High-Speed Layout Guidelines for Signal Conditioners and USB Hubs.

The designer must use a 1-oz Cu trace connecting the GND pins to the thermal land for the device to operate across the temperature range on a low-K board. A general PCB design guide for Power-pad packages is provided in Power-pad Thermally-Enhanced Package.