On a high-K board, TI always recommends to solder the PowerPAD™ integrated circuit package onto the thermal land. A thermal land is the area of solder-tinned-copper underneath the PowerPAD integrated circuit package. On a high-K board, the TMUXHS4412 can operate over the full temperature range by soldering the Power-pad onto the thermal land without vias.

For high speed layout guidelines refer to the High-Speed Layout Guidelines for Signal Conditioners and USB Hubs application note.

On a low-K board, for the device to operate across the temperature range, the designer must use a 1oz Cu trace connecting the GND pins to the thermal land. A general PCB design guide for PowerPAD integrated circuit packages is provided in PowerPAD™ Thermally Enhanced Package application note.