ZHCSN19A
December 2020 – October 2024
TMUXHS4412
PRODUCTION DATA
1
1
特性
2
应用
3
说明
4
Pin Configuration and Functions
5
Specifications
5.1
Absolute Maximum Ratings
5.2
ESD Ratings
5.3
Recommended Operating Conditions
5.4
Thermal Information
5.5
Electrical Characteristics
5.6
High-Speed Performance Parameters
5.7
Switching Characteristics
5.8
Typical Characteristics
6
Detailed Description
6.1
Overview
6.2
Functional Block Diagram
6.3
Feature Description
6.3.1
Output Enable and Power Savings
6.3.2
Data Line Biasing
6.4
Device Functional Modes
7
Application and Implementation
7.1
Application Information
7.2
Typical Applications
7.2.1
PCIe Lane Muxing
7.2.1.1
Design Requirements
7.2.1.2
Detailed Design Procedure
7.2.1.3
Pin-to-Pin Passive Versus Redriver Option
7.2.1.4
Application Curves
7.3
Systems Examples
7.3.1
PCIe Muxing for Hybrid SSD
7.3.2
DisplayPort Main Link
7.3.3
USB 4.0 / TBT 3.0 Demuxing
7.4
Power Supply Recommendations
7.5
Layout
7.5.1
Layout Guidelines
7.5.2
Layout Example
8
Device and Documentation Support
8.1
Related Documentation
8.1.1
Documentation Support
8.2
接收文档更新通知
8.3
支持资源
8.4
Trademarks
8.5
静电放电警告
8.6
术语表
9
Revision History
10
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
RUA|42
MPQF210D
散热焊盘机械数据 (封装 | 引脚)
RUA|42
QFND142D
订购信息
zhcsn19a_oa
zhcsn19a_pm
5.2
ESD Ratings
VALUE
UNIT
V
ESD
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
±2000
V
Charged-device model (CDM), per JEDEC specification JESD22-C101
(2)
±1000
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
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