SLOS369G July   2002  – October 2015 TPA2005D1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Operating Characteristics
    7. 7.7 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Fully Differential Amplifier
        1. 9.3.1.1 Advantages of Fully Differential Amplifiers
      2. 9.3.2 Efficiency and Thermal Information
      3. 9.3.3 Eliminating the Output Filter with the TPA2005D1
        1. 9.3.3.1 Effect on Audio
        2. 9.3.3.2 Traditional Class-D Modulation Scheme
        3. 9.3.3.3 TPA2005D1 Modulation Scheme
        4. 9.3.3.4 Efficiency: Why You Must Use a Filter With the Traditional Class-D Modulation Scheme
        5. 9.3.3.5 Effects of Applying a Square Wave Into a Speaker
        6. 9.3.3.6 When to Use an Output Filter
      4. 9.3.4 Thermal and Short-Circuit Protection
    4. 9.4 Device Functional Modes
      1. 9.4.1 Summing Input Signals with the TPA2005D1
        1. 9.4.1.1 Summing Two Differential Input Signals
        2. 9.4.1.2 Summing a Differential Input Signal and a Single-Ended Input Signal
        3. 9.4.1.3 Summing Two Single-Ended Input Signals
      2. 9.4.2 Shutdown Mode
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 TPA2005D1 with Differential Input
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1 Component Selection
          2. 10.2.1.2.2 Input Resistors (RI)
          3. 10.2.1.2.3 Decoupling Capacitor (CS)
        3. 10.2.1.3 Application Curves
      2. 10.2.2 TPA2005D1 with Differential Input and Input Capacitors
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedure
          1. 10.2.2.2.1 Input Capacitors (CI)
      3. 10.2.3 TPA2005D1 with Single-Ended Input
        1. 10.2.3.1 Design Requirements
        2. 10.2.3.2 Detailed Design Procedure
  11. 11Power Supply Recommendations
    1. 11.1 Power Supply Decoupling Capacitors
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 Component Location
      2. 12.1.2 Trace Width
      3. 12.1.3 MicroStar Junior™ BGA Specifications
    2. 12.2 Layout Examples
  13. 13Device and Documentation Support
    1. 13.1 Community Resources
    2. 13.2 Trademarks
    3. 13.3 Electrostatic Discharge Caution
    4. 13.4 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DGN|8
  • DRB|8
散热焊盘机械数据 (封装 | 引脚)
订购信息

14 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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