6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
|
MIN |
MAX |
UNIT |
| VCC
|
Supply voltage |
AVCC, PVCC |
–0.3 |
30 |
V |
| VI
|
Interface pin voltage |
SD, GAIN0, GAIN1, PBTL, FAULT(2)
|
–0.3 |
VCC + 0.3 |
V |
|
< 10 |
V/ms |
| PLIMIT |
–0.3 |
GVDD + 0.3 |
V |
| RINN, RINP, LINN, LINP |
–0.3 |
6.3 |
V |
| RL
|
Minimum load resistance |
BTL: PVCC > 15 V |
|
4.8 |
|
| BTL: PVCC ≤ 15 V |
|
3.2 |
|
| PBTL |
|
3.2 |
|
|
Continuous total power dissipation |
See the Thermal Information Table |
|
| TA
|
Operating free-air temperature |
–40 |
125 |
°C |
| TJ
|
Operating junction temperature(3)
|
–40 |
150 |
°C |
| Tstg
|
Storage temperature |
–65 |
150 |
°C |
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operations of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The voltage slew rate of these pins must be restricted to no more than 10 V/ms. For higher slew rates, use a 100-kΩ resistor in series with the pins, per application note
SLUA626.
(3) The TPA3110D2-Q1 incorporates an exposed thermal pad on the underside of the chip. This acts as a heatsink, and it must be connected to a thermally dissipating plane for proper power dissipation. Failure to do so may result in the device going into thermal protection shutdown. See TI Technical Brief
SLMA002 for more information about using the TSSOP thermal pad.