ZHCSKD5A October   2019  – August 2020 TPA3139D2

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics,
      1. 6.7.1 Bridge -Tied Load (BTL)
      2. 6.7.2 Paralleled Bridge -Tied Load (PBTL)
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Analog Gain
      2. 7.3.2  SD/ FAULT and MUTE Operation
      3. 7.3.3  PLIMIT
      4. 7.3.4  Spread Spectrum and De-Phase Control
      5. 7.3.5  GVDD Supply
      6. 7.3.6  DC Detect
      7. 7.3.7  PBTL Select
      8. 7.3.8  Short-Circuit Protection and Automatic Recovery Feature
      9. 7.3.9  Over-Temperature Protection (OTP)
      10. 7.3.10 Over-Voltage Protection (OVP)
      11. 7.3.11 Under-Voltage Protection (UVP)
    4. 7.4 Device Functional Modes
      1. 7.4.1 MODE_SEL = LOW: BD Modulation
      2. 7.4.2 MODE_SEL = HIGH: Low-Idle-Current 1SPW Modulation
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 PCB Material Recommendation
        2. 8.2.1.2 PVCC Capacitor Recommendation
        3. 8.2.1.3 Decoupling Capacitor Recommendations
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Ferrite Bead Filter Considerations
        2. 8.2.2.2 Efficiency: LC Filter Required with the Traditional Class-D Modulation Scheme
        3. 8.2.2.3 When to Use an Output Filter for EMI Suppression
        4. 8.2.2.4 Input Resistance
        5. 8.2.2.5 Input Capacitor, Ci
        6. 8.2.2.6 BSN and BSP Capacitors
        7. 8.2.2.7 Differential Inputs
        8. 8.2.2.8 Using Low-ESR Capacitors
      3. 8.2.3 Application Performance Curves
        1. 8.2.3.1 EN55013 Radiated Emissions Results
        2. 8.2.3.2 EN55022 Conducted Emissions Results
  9. 9 Power Supply Recommendations
    1. 9.1 Power Supply Decoupling, CS
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 第三方米6体育平台手机版_好二三四免责声明
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 接收文档更新通知
    4. 11.4 支持资源
    5. 11.5 Trademarks
    6. 11.6 静电放电警告
    7. 11.7 术语表

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information

THERMAL METRIC(1)TPA3139D2UNIT
RGE (QFN)
24 PINS
RθJAJunction-to-ambient thermal resistance37.4°C/W
RθJC(top)Junction-to-case (top) thermal resistance35.1°C/W
RθJBJunction-to-board thermal resistance16.8°C/W
ψJTJunction-to-top characterization parameter0.9°C/W
ψJBJunction-to-board characterization parameter16.7°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance7.3°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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