ZHCSKD5A October   2019  – August 2020 TPA3139D2

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics,
      1. 6.7.1 Bridge -Tied Load (BTL)
      2. 6.7.2 Paralleled Bridge -Tied Load (PBTL)
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Analog Gain
      2. 7.3.2  SD/ FAULT and MUTE Operation
      3. 7.3.3  PLIMIT
      4. 7.3.4  Spread Spectrum and De-Phase Control
      5. 7.3.5  GVDD Supply
      6. 7.3.6  DC Detect
      7. 7.3.7  PBTL Select
      8. 7.3.8  Short-Circuit Protection and Automatic Recovery Feature
      9. 7.3.9  Over-Temperature Protection (OTP)
      10. 7.3.10 Over-Voltage Protection (OVP)
      11. 7.3.11 Under-Voltage Protection (UVP)
    4. 7.4 Device Functional Modes
      1. 7.4.1 MODE_SEL = LOW: BD Modulation
      2. 7.4.2 MODE_SEL = HIGH: Low-Idle-Current 1SPW Modulation
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 PCB Material Recommendation
        2. 8.2.1.2 PVCC Capacitor Recommendation
        3. 8.2.1.3 Decoupling Capacitor Recommendations
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Ferrite Bead Filter Considerations
        2. 8.2.2.2 Efficiency: LC Filter Required with the Traditional Class-D Modulation Scheme
        3. 8.2.2.3 When to Use an Output Filter for EMI Suppression
        4. 8.2.2.4 Input Resistance
        5. 8.2.2.5 Input Capacitor, Ci
        6. 8.2.2.6 BSN and BSP Capacitors
        7. 8.2.2.7 Differential Inputs
        8. 8.2.2.8 Using Low-ESR Capacitors
      3. 8.2.3 Application Performance Curves
        1. 8.2.3.1 EN55013 Radiated Emissions Results
        2. 8.2.3.2 EN55022 Conducted Emissions Results
  9. 9 Power Supply Recommendations
    1. 9.1 Power Supply Decoupling, CS
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 第三方米6体育平台手机版_好二三四免责声明
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 接收文档更新通知
    4. 11.4 支持资源
    5. 11.5 Trademarks
    6. 11.6 静电放电警告
    7. 11.7 术语表

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

8.2.1.1 PCB Material Recommendation

FR-4 Glass Epoxy material with 1 oz. (35 µm) is recommended for use with the TPA3139D2. The use of this material can provide higher power output, improved thermal performance, and better EMI margin (due to lower PCB trace inductance). It is recommended to use several GND underneath the device thermal pad for thermal coupling to a bottom-side copper GND plane for best thermal performance.
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