ZHCSQ35 November   2022 TPA3223

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
    1. 6.1 Pin Functions
  7. 7 Specifications
    1. 7.1 绝对最大额定值
    2. 7.2 ESD 等级
    3. 7.3 建议运行条件
    4. 7.4 热性能信息
    5. 7.5 电气特性
    6. 7.6 音频特性 (BTL)
    7. 7.7 音频特性 (PBTL)
    8. 7.8 Typical Characteristics, BTL Configuration, AD-mode
    9. 7.9 Typical Characteristics, PBTL Configuration, AD-mode
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagrams
    3. 9.3 Feature Description
      1. 9.3.1 Input Configuration, Gain Setting And Primary / Peripheral Operation
      2. 9.3.2 Gain Setting And Clock Synchronization
      3. 9.3.3 PWM Modulation
      4. 9.3.4 Oscillator
      5. 9.3.5 Input Impedance
      6. 9.3.6 Error Reporting
    4. 9.4 Device Functional Modes
      1. 9.4.1 Powering Up
        1. 9.4.1.1 Startup Ramp Time
      2. 9.4.2 Powering Down
        1. 9.4.2.1 Power Down Ramp Time
      3. 9.4.3 Device Reset
      4. 9.4.4 Device Soft Mute
      5. 9.4.5 Device Protection System
        1. 9.4.5.1 Overload and Short Circuit Current Protection
        2. 9.4.5.2 Signal Clipping and Pulse Injector
        3. 9.4.5.3 DC Speaker Protection
        4. 9.4.5.4 Pin-to-Pin Short Circuit Protection (PPSC)
        5. 9.4.5.5 Overtemperature Protection OTW and OTE
        6. 9.4.5.6 Undervoltage Protection (UVP), Overvoltage Protection (OVP), and Power-on Reset (POR)
        7. 9.4.5.7 Fault Handling
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Stereo BTL Application
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedures
          1. 10.2.1.2.1 Decoupling Capacitor Recommendations
          2. 10.2.1.2.2 PVDD Capacitor Recommendation
          3. 10.2.1.2.3 BST capacitors
          4. 10.2.1.2.4 PCB Material Recommendation
      2. 10.2.2 Application Curves
      3. 10.2.3 Typical Application, Differential (2N), AD-Mode PBTL (Outputs Paralleled after LC filter)
        1. 10.2.3.1 Design Requirements
    3. 10.3 Power Supply Recommendations
      1. 10.3.1 Power Supplies
        1. 10.3.1.1 VDD Supply
        2. 10.3.1.2 AVDD and GVDD Supplies
        3. 10.3.1.3 PVDD Supply
        4. 10.3.1.4 BST Supply
    4. 10.4 Layout
      1. 10.4.1 Layout Guidelines
      2. 10.4.2 Layout Examples
        1. 10.4.2.1 BTL Application Printed Circuit Board Layout Example
        2. 10.4.2.2 PBTL (Outputs Paralleled after LC filter) Application Printed Circuit Board Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 术语表
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.2 ESD 等级

值 单位
VESD 静电放电 人体放电模型 (HBM)，符合 ANSI/ESDA/JEDEC JS-001，所有引脚 (1) ±3000 V
充电器件模型（CDM），符合 JEDEC 规范 JESD22-C101，所有引脚(2) ±1500 V
(1) JEDEC 文档 JEP155 指出：500V HBM 可实现在标准 ESD 控制流程下安全生产。
(2) JEDEC 文件 JEP157 指出：250V CDM 可实现在标准 ESD 控制流程下安全生产。
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