SLOS431B March   2004  – February 2015 TPA6120A2

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Simplified Schematic
  5. 5 Revision History
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Operating Characteristics
    7. 7.7 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Current-Feedback Amplifier
      2. 9.3.2 Independent Power Supplies
    4. 9.4 Device Functional Modes
  10. 10Applications and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 High Voltage, High Fidelity DAC + Headphone Amplifier Solution
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1 Resistor Values
          2. 10.2.1.2.2 Checking For Oscillations And Instability
          3. 10.2.1.2.3 Thermal Considerations
        3. 10.2.1.3 Application Performance Plots
      2. 10.2.2 High Fidelity Smartphone Application
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedure
        3. 10.2.2.3 Application Performance Plots
  11. 11Power Supply Recommendations
    1. 11.1 Independent Power Supplies
    2. 11.2 Power Supply Decoupling
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Trademarks
    3. 13.3 Electrostatic Discharge Caution
    4. 13.4 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • RGY|14
  • DWP|20
散热焊盘机械数据 (封装 | 引脚)
订购信息

5 Revision History

Changes from A Revision (July 2014) to B Revision

  • Changed the Device Information Packages From: DWP (20) and RGY (14) To: HSOP (20) and VQFN (14) Go
  • Changed QFN to VQFN in the Pin Functions table Go
  • Added a NOTE to the Applications and Implementation sectionGo
  • Added Title: Application InformationGo
  • Deleted Title: Application CircuitGo
  • Changed the Design RequirementsGo
  • Deleted Title: Application CircuitGo
  • Moved two paragraphs following Figure 19 to proceed Figure 19Go

Changes from * Revision (March 2004) to A Revision

  • Changed Added ESD Rating table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo
  • Added the VQFN package information Go
  • Updated Pin descriptions to clarify power supply. Go
  • Lowered minimum VIC(±5Vcc) From: ±3.6 To: ±3.4 Go
  • Lowered minimum VIC(±15Vcc) From: ±13.4V To: ±13.2V Go
  • Deleted IMD (Intermodulation Distortion), ±12Vcc data, Dynamic Range (replaced with SNR, in 1V/V gain)Go
  • Changed the THD=N UNIT From: % To: dBGo
  • Changed the SNR to show the latest data from newer QFN based EVM. Go
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