ZHCS294G June   2011  – May 2024 TPA6211A1-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
    1.     Pin Functions
    2. 4.1 DAPPER
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Operating Characteristics
    7. 5.7 Dissipation Ratings
    8.     Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Advantages of Fully Differential Amplifiers
      2. 6.3.2 Fully Differential Amplifier Efficiency and Thermal Information
      3. 6.3.3 Differential Output Versus Single-Ended Output
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Typical Differential Input Application
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
          1. 7.2.1.2.1 Resistors (RI)
          2. 7.2.1.2.2 Bypass Capacitor (CBYPASS) and Start-Up Time
          3. 7.2.1.2.3 Input Capacitor (CI)
          4. 7.2.1.2.4 Band-Pass Filter (RI, CI, and CF)
            1. 7.2.1.2.4.1 Step 1: Low-Pass Filter
            2. 7.2.1.2.4.2 Step 2: High-Pass Filter
            3. 7.2.1.2.4.3 Step 3: Additional Low-Pass Filter
          5. 7.2.1.2.5 Decoupling Capacitor (CS)
          6. 7.2.1.2.6 Using Low-ESR Capacitors
        3. 7.2.1.3 Application Curves
      2. 7.2.2 Other Application Circuits
    3. 7.3 Power Supply Recommendations
      1. 7.3.1 Power Supply Decoupling Capacitor
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 支持资源
    3. 8.3 Trademarks
    4. 8.4 静电放电警告
    5. 8.5 术语表
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

9 Revision History

Changes from Revision F (February 2024) to Revision G (May 2024)

  • Changed the ESD Ratings for CDM to ±1000VGo

Changes from Revision E (August 2019) to Revision F (February 2024)

  • 更改了“特性”中以下部分下的器件 HBM ESD 分类等级：符合汽车应用要求Go
  • Changed the ESD Ratings for HBM to ±2000VGo

Changes from Revision D (August 2019) to Revision E (August 2019)

  • 将封装更改为 HVSSOPGo
  • Changed packaging to HVSSOPGo
  • Changed packaging to HVSSOPGo

Changes from Revision C (August 2016) to Revision D (August 2019)

  • 从“特性”中的以下部分下删除了 AEC-Q100：符合汽车应用要求Go
  • 删除了特性：温度等级 2Go
  • Changed the ESD Ratings tableGo

Changes from Revision B (January 2014) to Revision C (August 2016)

  • 添加了器件信息 表、ESD 等级 表、特性说明 部分、器件功能模式 部分、应用和实施 部分、电源相关建议 部分、布局 部分、器件和文档支持 部分以及机械、封装和可订购信息 部分Go
  • Added missing Max Ambient Temperature values to Table 6-1 Go
  • Changed 45.9 to 71.7, 1.27 to 1.25, and 91.7 to 60 in Equation 13 Go

Changes from Revision A (November 2013) to Revision B (January 2014)

  • Added three new equations to the DIFFERENTIAL OUTPUT VERSUS SINGLE-ENDED OUTPUT section in order to show difference between single-ended and differential outputGo

Changes from Revision * (June 2011) to Revision A (November 2013)

  • 从特性 列表中删除了设计用于无线或蜂窝手持设备和 PDA。Go
  • Deleted Ordering Information tableGo
  • Changed reference from "equation 6" to Equation 26 in the High-Pass Filter sectionGo
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