ZHCS294G June   2011  – May 2024 TPA6211A1-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
    1.     Pin Functions
    2. 4.1 DAPPER
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Operating Characteristics
    7. 5.7 Dissipation Ratings
    8.     Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Advantages of Fully Differential Amplifiers
      2. 6.3.2 Fully Differential Amplifier Efficiency and Thermal Information
      3. 6.3.3 Differential Output Versus Single-Ended Output
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Typical Differential Input Application
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
          1. 7.2.1.2.1 Resistors (RI)
          2. 7.2.1.2.2 Bypass Capacitor (CBYPASS) and Start-Up Time
          3. 7.2.1.2.3 Input Capacitor (CI)
          4. 7.2.1.2.4 Band-Pass Filter (RI, CI, and CF)
            1. 7.2.1.2.4.1 Step 1: Low-Pass Filter
            2. 7.2.1.2.4.2 Step 2: High-Pass Filter
            3. 7.2.1.2.4.3 Step 3: Additional Low-Pass Filter
          5. 7.2.1.2.5 Decoupling Capacitor (CS)
          6. 7.2.1.2.6 Using Low-ESR Capacitors
        3. 7.2.1.3 Application Curves
      2. 7.2.2 Other Application Circuits
    3. 7.3 Power Supply Recommendations
      1. 7.3.1 Power Supply Decoupling Capacitor
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 支持资源
    3. 8.3 Trademarks
    4. 8.4 静电放电警告
    5. 8.5 术语表
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.5 Electrical Characteristics

TA = 25°C
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
VOSOutput offset voltage (measured differentially)VI = 0-V differential, Gain = 1 V/V, VDD = 5.5 V–90.39mV
PSRRPower supply rejection ratioVDD = 2.5 V to 5.5 V–85–60dB
VICCommon mode input rangeVDD = 2.5 V to 5.5 V0.5VDD – 0.8V
CMRRCommon mode rejection ratioVDD = 5.5 V, VIC = 0.5 V to 4.7 V–63–40dB
VDD = 2.5 V, VIC = 0.5 V to 1.7 V–63–40
Low-output swingRL = 4 Ω, VIN+ = VDD, VIN+ = 0 V,
Gain = 1 V/V, VIN– = 0 V or VIN– = VDD		VDD = 5.5 V0.45V
VDD = 3.6 V0.37
VDD = 2.5 V0.260.4
High-output swingRL = 4 Ω, VIN+ = VDD, VIN– = VDD,
Gain = 1 V/V, VIN– = 0 V or VIN+ = 0 V		VDD = 5.5 V4.95V
VDD = 3.6 V3.18
VDD = 2.5 V22.13
| IIH |High-level input current, shutdownVDD = 5.5 V, VI = 5.8 V58100µA
| IIL |Low-level input current, shutdownVDD = 5.5 V, VI = –0.3 V3100µA
IQQuiescent currentVDD = 2.5 V to 5.5 V, no load45mA
I(SD)Supply currentVSHUTDOWN ≤ 0.5 V, VDD = 2.5 V to 5.5 V, RL = 4 Ω0.011µA
GainRL = 4 ΩTPA6211A1-Q1 TPA6211A1-Q1 TPA6211A1-Q1 V/V
Resistance from shutdown to GND100kΩ
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