SLOS367E August   2003  – November 2015 TPA6211A1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operation Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Operating Characteristics
    7. 7.7 Dissipation Ratings
    8. 7.8 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Fully Differential Amplifier Efficiency and Thermal Information
        1. 9.3.1.1 Advantages of Fully Differential Amplifiers
        2. 9.3.1.2 Differential Output Versus Single-Ended Output
    4. 9.4 Device Functional Modes
      1. 9.4.1 Shutdown Mode
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Selecting Components
          1. 10.2.2.1.1 Resistors (RI)
          2. 10.2.2.1.2 Bypass Capacitor (CBYPASS) and Start-Up Time
          3. 10.2.2.1.3 Input Capacitor (CI)
          4. 10.2.2.1.4 Band-Pass Filter (Ra, Ca, and Ca)
            1. 10.2.2.1.4.1 Step 1: Low-Pass Filter
            2. 10.2.2.1.4.2 Step 2: High-Pass Filter
            3. 10.2.2.1.4.3 Step 3: Additional Low-Pass Filter
          5. 10.2.2.1.5 Decoupling Capacitor (CS)
          6. 10.2.2.1.6 Using Low-ESR Capacitors
      3. 10.2.3 Application Curves
    3. 10.3 System Examples
  11. 11Power Supply Recommendations
    1. 11.1 Power Supply Decoupling Capacitor
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Examples
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Development Support
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
    3. 13.3 Community Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DGN|8
  • DRB|8
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from D Revision (June 2011) to E Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section. Go

Changes from C Revision (June 2008) to D Revision

  • Deleted the Lead temperature 1,6 mm (1/16 Inch) from case for 10 seconds row from the Abs Max TableGo

Changes from B Revision (August 2004) to C Revision

  • Changed Storage temperature From: –65°C to 85°C To: –65°C to 150°CGo
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