SLLSE19F December   2009  – July 2016 TPD12S015

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: ICC
    6. 6.6  Electrical Characteristics: High-Speed ESD Lines: Dx, CLK
    7. 6.7  Electrical Characteristics: DC-DC Converter
    8. 6.8  Electrical Characteristics: Passive Components
    9. 6.9  Electrical Characteristics: Voltage Level Shifter: SCL, SDA Lines (x_A/x_B Ports)
    10. 6.10 Electrical Characteristics: Voltage Level Shifter: CEC Lines (x_A/x_B Ports)
    11. 6.11 Electrical Characteristics: Voltage Level Shifter: HPD Line (x_A/x_B Ports)
    12. 6.12 Electrical Characteristics: LS_OE, CT_CP_HPD
    13. 6.13 Electrical Characteristics: I/O Capacitance
    14. 6.14 Switching Characteristics
    15. 6.15 Switching Characteristics: Voltage Level Shifter: SCL, SDA Lines (x_A & x_B ports); VCCA = 1.2 V
    16. 6.16 Switching Characteristics: Voltage Level Shifter: CEC Line (x_A & x_B ports); VCCA = 1.2 V
    17. 6.17 Switching Characteristics: Voltage Level Shifter: HPD Line (x_A & x_B ports); VCCA = 1.2 V
    18. 6.18 Switching Characteristics: Voltage Level Shifter: SCL, SDA Lines (x_A & x_B ports); VCCA = 1.5 V
    19. 6.19 Switching Characteristics: Voltage Level Shifter: CEC Line (x_A & x_B ports); VCCA = 1.5 V
    20. 6.20 Switching Characteristics: Voltage Level Shifter: HPD Line (x_A & x_B ports); VCCA = 1.5 V
    21. 6.21 Switching Characteristics: Voltage Level Shifter: SCL, SDA Lines (x_A & x_B ports); VCCA = 1.8 V
    22. 6.22 Switching Characteristics: Voltage Level Shifter: CEC Line (x_A & x_B ports); VCCA = 1.8 V
    23. 6.23 Switching Characteristics: Voltage Level Shifter: HPD Line (x_A & x_B ports); VCCA = 1.8 V
    24. 6.24 Switching Characteristics: Voltage Level Shifter: SCL, SDA Lines (x_A & x_B ports); VCCA = 2.5 V
    25. 6.25 Switching Characteristics: Voltage Level Shifter: CEC Line (x_A & x_B ports); VCCA = 2.5 V
    26. 6.26 Switching Characteristics: Voltage Level Shifter: HPD Line (x_A & x_B ports); VCCA = 2.5 V
    27. 6.27 Switching Characteristics: Voltage Level Shifter: SCL, SDA Lines (x_A & x_B ports); VCCA = 3.3 V
    28. 6.28 Switching Characteristics: Voltage Level Shifter: CEC Line (x_A & x_B ports); VCCA = 3.3 V
    29. 6.29 Switching Characteristics: Voltage Level Shifter: HPD Line (x_A & x_B ports); VCCA = 3.3 V
    30. 6.30 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1 Rise-Time Accelerators
      2. 8.3.2 Internal Pullup Resistor
      3. 8.3.3 Undervoltage Lockout
      4. 8.3.4 Soft Start
      5. 8.3.5 DDC and CEC Level-Shifting Circuit Operation
      6. 8.3.6 DDC and CEC Level Shifting Operation When VCCA = 1.8 V
      7. 8.3.7 CEC Level-Shifting Operation
    4. 8.4 Device Functional Modes
      1. 8.4.1 Enable
      2. 8.4.2 Power Save Mode
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 TPD12S015 Controlled by Two GPIOs from Controller
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Inductor Selection
          2. 9.2.1.2.2 Input Capacitor
          3. 9.2.1.2.3 Output Capacitor
          4. 9.2.1.2.4 CEC, HPD, SCL, and SDA Level-Shifting Function
          5. 9.2.1.2.5 ESD
          6. 9.2.1.2.6 Ground Offset Consideration
        3. 9.2.1.3 Application Curves
      2. 9.2.2 TPD12S015 Controlled by One GPIO from Controller
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resource
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

11 Layout

11.1 Layout Guidelines

For proper operation, follow these layout and design guidelines:

  • Place the TPD12S015 as close to the connector as possible. This allows it to remove the energy associated with ESD strike before it reaches the internal circuitry of the system board.
  • Place power line capacitors and inductors close to the pins with wide traces to allow enough current to flow through with less trace parasitics.
  • Ensure that there is enough metallization for the GND pad. A sufficient current path enables safe discharge of all the energy associated with the ESD strike.
  • The critical routing paths for HDMI interface are the high-speed TMDS lines. Make sure to match the lengths of the differential pair. Maintain constant trace width after to avoid impedance mismatches in the transmission lines. Maximize differential pair-to-pair spacing when possible.

For more layout information, see TPD12S015 PCB Layout Guidelines.

11.2 Layout Example

TPD12S015 boardlayout_llse19.gif Figure 25. Board Layout (DC-DC Components) (Top View)

List of components:

  • LIN = MURATA LQM21PN1R0MC0 or LIN = Toko MDT2010-CN1R0
  • CIN = MURATA GRM188R60J225ME19 (2.2 µF, 6.3 V, 0603, X5R) or MURATA GRM188R60J475ME19 (4.7 µF, 6.3 V, 0603, X5R)
  • COUT = MURATA GRM188R60J475ME19 (4.7 µF, 6.3 V, 0603, X5R)
  • CVCCA = MURATA GRM155R60J104MA01 (0.1 µF, 6.3 V, 0402, X5R)