ZHCS354D June   2011  – July 2016 TPD12S015A

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: ICC
    6. 6.6  Electrical Characteristics: High-Speed ESD Lines: Dx, CLK
    7. 6.7  Electrical Characteristics: DC-DC Converter
    8. 6.8  Electrical Characteristics: Passive Components
    9. 6.9  Electrical Characteristics: Voltage Level Shifter: SCL, SDA Lines (x_A/x_B Ports)
    10. 6.10 Electrical Characteristics: Voltage Level Shifter: CEC Lines (x_A/x_B Ports)
    11. 6.11 Electrical Characteristics: Voltage Level Shifter: HPD Line (x_A/x_B Ports)
    12. 6.12 Electrical Characteristics: LS_OE, CT_CP_HPD
    13. 6.13 Electrical Characteristics: I/O Capacitance
    14. 6.14 Switching Characteristics
    15. 6.15 Switching Characteristics: Voltage Level Shifter: SCL, SDA Lines (x_A & x_B ports); VCCA = 1.2 V
    16. 6.16 Switching Characteristics: Voltage Level Shifter: CEC Line (x_A & x_B ports); VCCA = 1.2 V
    17. 6.17 Switching Characteristics: Voltage Level Shifter: HPD Line (x_A & x_B ports); VCCA = 1.2 V
    18. 6.18 Switching Characteristics: Voltage Level Shifter: SCL, SDA Lines (x_A & x_B ports); VCCA = 1.5 V
    19. 6.19 Switching Characteristics: Voltage Level Shifter: CEC Line (x_A & x_B ports); VCCA = 1.5 V
    20. 6.20 Switching Characteristics: Voltage Level Shifter: HPD Line (x_A & x_B ports); VCCA = 1.5 V
    21. 6.21 Switching Characteristics: Voltage Level Shifter: SCL, SDA Lines (x_A & x_B ports); VCCA = 1.8 V
    22. 6.22 Switching Characteristics: Voltage Level Shifter: CEC Line (x_A & x_B ports); VCCA = 1.8 V
    23. 6.23 Switching Characteristics: Voltage Level Shifter: HPD Line (x_A & x_B ports); VCCA = 1.8 V
    24. 6.24 Switching Characteristics: Voltage Level Shifter: SCL, SDA Lines (x_A & x_B ports); VCCA = 2.5 V
    25. 6.25 Switching Characteristics: Voltage Level Shifter: CEC Line (x_A & x_B ports); VCCA = 2.5 V
    26. 6.26 Switching Characteristics: Voltage Level Shifter: HPD Line (x_A & x_B ports); VCCA = 2.5 V
    27. 6.27 Switching Characteristics: Voltage Level Shifter: SCL, SDA Lines (x_A & x_B ports); VCCA = 3.3 V
    28. 6.28 Switching Characteristics: Voltage Level Shifter: CEC Line (x_A & x_B ports); VCCA = 3.3 V
    29. 6.29 Switching Characteristics: Voltage Level Shifter: HPD Line (x_A & x_B ports); VCCA = 3.3 V
    30. 6.30 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Rise-Time Accelerators
      2. 8.3.2 Internal Pullup Resistor
      3. 8.3.3 Undervoltage Lockout
      4. 8.3.4 Soft Start
      5. 8.3.5 DDC/CEC Level Shifting Function
      6. 8.3.6 DDC/CEC Level Shifting Function When VCCA = 1.8 V
      7. 8.3.7 CEC Level Shifting Function
    4. 8.4 Device Functional Modes
      1. 8.4.1 Enable
      2. 8.4.2 Power Save Mode
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Inductor Selection
        2. 9.2.2.2 Input Capacitor
        3. 9.2.2.3 Output Capacitor
        4. 9.2.2.4 CEC, HPD, SCL, SDA Level Shifting Function
        5. 9.2.2.5 ESD
        6. 9.2.2.6 Ground Offset Consideration
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 文档支持
      1. 12.1.1 相关文档
    2. 12.2 接收文档更新通知
    3. 12.3 社区资源
    4. 12.4 商标
    5. 12.5 静电放电警告
    6. 12.6 Glossary
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

11 Layout

11.1 Layout Guidelines

For proper operation, follow these layout and design guidelines.

  • Place the TPD12S015A as close to the connector as possible. This allows it to remove the energy associated with ESD strike before it reaches the internal circuitry of the system board.
  • Place power line capacitors and inductors close to the pins with wide traces to allow enough current to flow through with less trace parasitics.
  • Ensure that there is enough metallization for the GND pad. A sufficient current path enables safe discharge of all the energy associated with the ESD strike.
  • The critical routing paths for HDMI interface are the high-speed TMDS lines. Make sure to match the lengths of the differential pair. Maintain constant trace width after to avoid impedance mismatches in the transmission lines. Maximize differential pair-to-pair spacing when possible.

11.2 Layout Example

TPD12S015A boardlayout_lls74.gif Figure 23. Board Layout (DC-DC Components) (Top View)

List of components:

  • LIN = MURATA LQM21PN1R0MC0 (1 µH, 800 mA, 0805, Shielded)
  • CIN = COUT = MURATA LLL31MR70J475MA01 (4.7 µF, Low ESL type, 6.3 V, 0306, X7R)
  • CVCCA = MURATA GRM155R60J475ME87D (0.1 µF, 6.3 V, 0402, X5R)

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