ZHCSFE0B August   2016  – February 2022 TPD1E10B06-Q1

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2.     ESD Ratings - AEC Specification
    3. 6.2 ESD Ratings—IEC Specification
    4. 6.3 ESD Ratings—ISO Specification
    5. 6.4 Recommended Operating Conditions
    6. 6.5 Thermal Information
    7. 6.6 Electrical Characteristics
    8. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  AEC-Q101 Qualified
      2. 7.3.2  IEC 61000-4-2 ESD Protection
      3. 7.3.3  ISO 10605 ESD Protection
      4. 7.3.4  IEC 61000-4-5 Surge Protection
      5. 7.3.5  IO Capacitance
      6. 7.3.6  Dynamic Resistance
      7. 7.3.7  DC Breakdown Voltage
      8. 7.3.8  Ultra Low Leakage Current
      9. 7.3.9  Clamping Voltage
      10. 7.3.10 Industrial Temperature Range
      11. 7.3.11 Space-Saving Footprint
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 接收文档更新通知
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 术语表
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.5 Thermal Information

THERMAL METRIC(1) UNIT
DPY (X1SON) DYA (SOD523)
2 PINS 2 PINS
RθJA Junction-to-ambient thermal resistance 615.5 730.8  °C/W
RθJC(top) Junction-to-case (top) thermal resistance 404.8 413.4 °C/W
RθJB Junction-to-board thermal resistance 493.3 497.7 °C/W
ΨJT Junction-to-top characterization parameter 127.7 129.7 °C/W
ΨJB Junction-to-board characterization parameter 493.3 491.8 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 162 - °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
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