ZHCS821G February   2012  – August 2024 TPD1E10B06

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings - JEDEC Specification
    3. 5.3 ESD Ratings—IEC Specification
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Thermal Information
    6. 5.6 Electrical Characteristics
    7. 5.7 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
    4. 6.4 Device Functional Modes
  8. Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. Device and Documentation Support
    1. 8.1 接收文档更新通知
    2. 8.2 支持资源
    3. 8.3 Trademarks
    4. 8.4 静电放电警告
    5. 8.5 术语表
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Tape and Reel Information
    2. 10.2 Mechanical Data

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Revision History

Changes from Revision F (October 2021) to Revision G (August 2024)

  • 更新了封装信息Go

Changes from Revision E (June 2021) to Revision F (October 2021)

  • 更新了应用原理图 Go
  • Updated the Description of Pin 1 and pin 2 in the Pin Configuration and Functions sectionGo
  • Changed HBM spec to per JS-001 in ESD Ratings - JEDEC Specification Go
  • Changed CDM spec to per JESD22-C101 Go
  • Updated the Typical Application Schematic figureGo
  • Changed the system-level ESD protection from: ±20 kV Contact/± 25 kV Air-Gap to: ±8 kV Contact/± 15 kV Air-Gap Go