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ZHCS820E February 2012 – September 2023 TPD1E10B09

PRODUCTION DATA

1
1 特性
2 应用
3 说明
4 Revision History
5 Pin Configuration and Functions
6 Specifications
7 Detailed Description
8 Application and Implementation
9 Device and Documentation Support
10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)

DPY|2
- MPSS034D

散热焊盘机械数据 (封装 | 引脚)

订购信息

zhcs820e_oa
zhcs820e_pm

6.4 Thermal Information

THERMAL METRIC⁽¹⁾		TPD1E10B09	UNIT
		DPY (X1SON)
		2 PINS
R_θJA	Junction-to-ambient thermal resistance	615.5	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	404.8	°C/W
R_θJB	Junction-to-board thermal resistance	493.3	°C/W
ψ_JT	Junction-to-top characterization parameter	127.7	°C/W
ψ_JB	Junction-to-board characterization parameter	493.3	°C/W
P	Power Dissipation⁽²⁾	162	mW

(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

(2) Max junction temperature: 125°C; power dissipation calculated at 25°C ambient temperature using JEDEC High K board Standard. Not to be used for steady state power dissipation in the breakdown region.