Proper routing and placement maintains signal integrity for high-speed signals. The following guidelines apply to the TPD3S714-Q1:

• Place the bypass capacitors as close as possible to the V_IN, V_{BUS_SYS}, and V_{BUS_CON} pins. Capacitors must be attached to a solid ground. This minimizes voltage disturbances during transient events such as short-to-battery, ESD, or overcurrent conditions.
• High speed traces (data switch path) must be routed as straight as possible and any sharp bends must be minimized.

Our standard ESD recommendations apply to the VD+, VD–, and V_{BUS_CON} pins as well:

• The optimum placement is as close to the connector as possible.
  • EMI during an ESD event can couple from the trace being struck to other nearby unprotected traces, resulting in early system failures.
  • The PCB designer must minimize the possibility of EMI coupling by keeping any unprotected traces away from the protected traces which are between the TVS and the connector.
• Route the protected traces as straight as possible.
• Eliminate any sharp corners on the protected traces between the TVS and the connector by using rounded corners with the largest radii possible.
  • Electric fields tend to build up on corners, increasing EMI coupling.