ZHCSEN2A November 2015 – February 2016 TPD4E02B04
PRODUCTION DATA.
The TPD4E02B04 is a bidirectional ESD Protection Diode with ultra-low capacitance. This device can dissipate ESD strikes above the maximum level specified by the IEC 61000-4-2 International Standard. The ultra-low capacitance makes this device ideal for protecting any super high-speed signal pins.
The I/O pins can withstand ESD events up to ±12-kV contact and ±15-kV air gap. An ESD/surge clamp diverts the current to ground.
The I/O pins can withstand an electrical fast transient burst of up to 80 A (5/50 ns waveform, 4 kV with 50 Ω impedance). An ESD/surge clamp diverts the current to ground.
The I/O pins can withstand surge events up to 2 A and 17 W (8/20 µs waveform). An ESD/surge clamp diverts this current to ground.
The capacitance between each I/O pin to ground is 0.27 pF (typical) and 0.37 pF (maximum). This device supports data rates up to 10 Gbps.
The DC breakdown voltage of each I/O pin is a minimum of ±5.5 V. This ensures that sensitive equipment is protected from surges above the reverse standoff voltage of ±3.6 V.
The I/O pins feature an ultra-low leakage current of 10 nA (max) with a bias of ±2.5 V
The I/O pins feature an ESD clamp that is capable of clamping the voltage to 8.8 V (IPP = 5 A).
This device is capable of supporting high speed interfaces up to 10 Gbps, because of the extremely low IO capacitance.
This device features an industrial operating range of –40°C to 125°C.
The layout of this device makes it simple and easy to add protection to an existing layout. The packages offers flow-through routing, requiring minimal modification to an existing layout.
The TPD4E02B04 is a passive integrated circuit that triggers when voltages are above VBRF or below VBRR. During ESD events, voltages as high as ±15 kV (air) can be directed to ground via the internal diode network. When the voltages on the protected line fall below the trigger levels of TPD4E02B04 (usually within 10s of nano-seconds) the device reverts to passive.