ZHCSAT5F January   2013  – January 2015 TPD4S214

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用范围
  3. 3 说明
  4. 4 简化电路原理图
  5. 5 修订历史记录
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Thermal Shutdown
    6. 7.6  Electrical Characteristics for EN, FLT, DET, D+, D-, VBUS, ID Pins
    7. 7.7  Electrical characteristics for UVLO / OVLO
    8. 7.8  Electrical Characteristics for DET Circuits
    9. 7.9  Electrical Characteristics for OTG Switch
    10. 7.10 Electrical Characteristics for Current Limit and Short Circuit Protection
    11. 7.11 Supply Current Consumption
    12. 7.12 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Input Voltage Protection at VBUS from -7 V to 30 V
      2. 8.3.2  IEC 61000-4-2 Level 4 ESD Protection
      3. 8.3.3  Low RDS(ON) N-CH FET Switch for High Efficiency
      4. 8.3.4  Compliant with USB2.0 and USB3.0 OTG spec
      5. 8.3.5  User Adjustable Current Limit From 250 mA to Beyond 1.2 A
      6. 8.3.6  Built-in Soft-start
      7. 8.3.7  Reverse Current Blocking
      8. 8.3.8  Over Voltage Lock Out for VBUS
      9. 8.3.9  Under Voltage Lock Out for VOTG_IN
      10. 8.3.10 Thermal Shutdown and Short Circuit Protection
      11. 8.3.11 Auto Retry on any Fault; no Latching off States
      12. 8.3.12 Integrated VBUS Detection Circuit
      13. 8.3.13 Low Capacitance TVS ESD Clamp for USB2.0 High Speed Data Rate
      14. 8.3.14 Internal 16ms Startup Delay
      15. 8.3.15 Space Saving WCSP (12-YFF) Package
      16. 8.3.16 Inrush Current Protection
      17. 8.3.17 Input Capacitor (Optional)
      18. 8.3.18 Output Capacitor (Optional)
      19. 8.3.19 Current Limit
      20. 8.3.20 Thermal Shutdown
      21. 8.3.21 VBUS Detection
      22. 8.3.22 Test Configuration
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 USB 2.0 Without Using On-chip VBUS Detect
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 USB 2.0 Using On-chip VBUS Detect
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curves
      3. 9.2.3 USB 3.0 Without Using On-chip VBUS Detect
        1. 9.2.3.1 Design Requirements
        2. 9.2.3.2 Detailed Design Procedure
        3. 9.2.3.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 文档支持
      1. 12.1.1 相关文档　
    2. 12.2 商标
    3. 12.3 静电放电警告
    4. 12.4 术语表
  13. 13机械封装和可订购信息

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • YFF|12
散热焊盘机械数据 (封装 | 引脚)
订购信息

5 修订历史记录

Changes from E Revision (January 2015) to F Revision

  • Added UL 和 CB 认证。 Go

Changes from D Revision (October 2014) to E Revision

  • Added RLOAD TEST CONDITIONS to IOCP in the Electrical Characteristics for Current Limit and Short Circuit Protection table. Go

Changes from C Revision (August 2013) to D Revision

  • 处理额定值表，特性描述部分，器件功能模式，应用和实施部分，电源相关建议部分，布局部分，器件和文档支持部分以及机械、封装和可订购信息部分。 Go

Changes from * Revision (January 2013) to A Revision

  • 已更改米6体育平台手机版_好二三四预览数据表Go

Changes from A Revision (February 2013) to B Revision

  • 已将器件状态从：米6体育平台手机版_好二三四预览更改为：量产数据Go

Changes from B Revision (February 2013) to C Revision

  • YFF PACKAGE Changed the YFF package dimensionsGo
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