ZHCSAD1D October   2012  – June 2017 TPD5S115

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Electrical Characteristics - I/O Capacitances
    7. 6.7  Switching Characteristics - VCCA = 1.2 V
    8. 6.8  Switching Characteristics - VCCA = 1.5 V
    9. 6.9  Switching Characteristics - VCCA = 1.8 V
    10. 6.10 Switching Characteristics - VCCA = 2.5 V
    11. 6.11 Switching Characteristics - VCCA = 3.3 V
    12. 6.12 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Rise-Time Accelerators
      2. 7.3.2 Hot Plug Detect
      3. 7.3.3 CEC Level Shift Operation
      4. 7.3.4 Pullup Resistor
      5. 7.3.5 Undervoltage Lockout
      6. 7.3.6 Soft Start
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power-Save Mode
      2. 7.4.2 Enable
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 DDC or CEC Level Shifter
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 DDC or CEC Level Shifter Operational Notes for VCCA = 1.8 V
          2. 8.2.1.2.2 Input Capacitor
          3. 8.2.1.2.3 Output Capacitor
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Other Application Circuits
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 文档支持
      1. 11.1.1 相关文档
    2. 11.2 接收文档更新通知
    3. 11.3 社区资源
    4. 11.4 商标
    5. 11.5 静电放电警告
    6. 11.6 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Supply voltage VCCA 4 V
VBAT –0.3 6 V
Input voltage, VI(2) SCL_A, SDA_A, CEC_A –0.3 4 V
SCL_B, SDA_B, CEC_B, HPD_B –0.3 6
EN, LS_OE –0.3 4
Voltage applied to any output in the high-impedance or power‑off state, VO(2) SCL_A, SDA_A, CEC_A –0.3 4 V
SCL_B, SDA_B, CEC_B –0.3 6
Voltage applied to any output in the high or low state, VO(2) SCL_A, SDA_A, CEC_A –0.3 VCCA + 0.3 V
SCL_B, SDA_B, CEC_B –0.3 5VOUT + 0.3
Input clamp current (IV < 0) –50 mA
Output clamp current (VO < 0) –50 mA
Continuous current through 5VOUT, or GND ±100 mA
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) All pins except pins 4A, B3, C3, C4, D3, and D4 500 V
Pins 4A, B3, C3, C4, D3, and D4 2000
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) 1000
IEC 61000-4-2 Contact Discharge Pins A1, A3, B1, B2, and C1 ±14000
IEC 61000-4-2 Air-gap Discharge Pins A1, A3, B1, B2, and C1 ±16000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VCCA Supply voltage, VCCA 1.2 3.6 V
VBAT Supply voltage, VBAT 2.3 5.5 V
VIH High-level input voltage VCCA = 1.2 V to 3.6 V SCL_A, SDA_A 0.7 × VCCA VCCA V
CEC_A 0.7 × VCCA VCCA
EN, LS_OE 1 VCCA
5VOUT = 5 V SCL_B, SDA_B 0.7 × 5VOUT 5VOUT
CEC_B 0.7 × 3.3 V (internal)(1) 3.3 V (internal)(1)
HPD_B 2
VIL Low-Level input voltage VCCA = 1.2 V to 3.6 V SCL_A, SDA_A –0.5 0.082 × VCCA V
CEC_A –0.5 0.082 × VCCA
EN, LS_OE –0.5 0.4
5VOUT = 5 V SCL_B, SDA_B –0.5 0.3 × 5VOUT
CEC_B –0.5 0.3 × 3.3 (internal)(1)
HPD_B 0 0.8
VILC Low-level input voltage –0.5 0.065 × VCCA V
VOL – VILC Delta between VOL and VILC (VIO = 2.5 V) 0.1 × VCCA V
TA Operating free-air temperature –40 85 °C
(1) 3.3 V (internal) is an internally generated voltage node for the CEC_B output buffer supply reference. An LDO generates this 3.3 V from 5VOUT when LS_OE and EN are HIGH.

6.4 Thermal Information

THERMAL METRIC(1) TPD5S115 UNIT
YFF (DSBGA)
16 PINS
RθJA Junction-to-ambient thermal resistance 78.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 0.6 °C/W
RθJB Junction-to-board thermal resistance 13.2 °C/W
ψJT Junction-to-top characterization parameter 2.5 °C/W
ψJB Junction-to-board characterization parameter 13 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

6.5 Electrical Characteristics

TA = –40°C to 85°C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VOHA IOH = –10 µA, VI = VIH, VCCA = 1.2 V to 3.6 V VCCA × 0.8 V
VOLA IOL = 10 µA, VI = VIL, VCCA = 1.2 V to 3.6 V VCCA × 0.16 V
VOHB IOH = –10 µA, VI = VIH V
VOLB IOL = 3 mA, VI = VIL 0.4 V
RPU Internal pullup SCL_A, SDA_A Pullup connected to VCCA rail 10 kΩ
SCL_B, SDA_B Pullup connected to 5-V rail 1.75
IPULLUPAC Transient boosted pullup current
(rise-time accelerator)		 SCL_B, SDA_B Pullup connected to 5-V rail 15 mA
IOFF Leakage current A port VCCA = 0 V, VI or VO = 0 to 3.6 V, VCCA = 0 V ±5 µA
B port 5VOUT = 0 V, VI or VO = 0 to 5.5 V, VCCA = 0 V to 3.6 V ±5
IOZ A port VO = VCCO or GND, VCCA = 1.2 V to 3.6 V ±5
B port VI = VCCI or GND, VCCA = 1.2 V to 3.6 V ±5
CL Bus load capacitance A port 15 pF
B port 750
SUPPLY CURRENT
ICCA VCCA supply current Standby I/Os = HIGH 2 µA
Active I/Os = HIGH 15 µA
ICCB VBAT supply current Standby EN = LOW, LS_OE = LOW 0.5 µA
DC-DC and
HPD active		 EN = HIGH, LS_OE = LOW 30 50 µA
DC-DC, HPD, DDC, CEC Active EN = HIGH, LS_OE = LOW, I/Os = HIGH 225 300 µA
DC-DC CONVERTER
VBAT Input voltage 2.3 5.5 V
VOUT Total DC output voltage(1) 4.9 5 5.13 V
TOVA Total output voltage accuracy(2) 4.8 5 5.3 V
VIO_Ripple Output voltage ripple, loaded IO = 65 mA 50.6 mVPP
IO = 150 mA 16
fCLK Internal operating frequency VBAT = 2.3 V to 5.5 V 3.5 MHz
tSTART Start-up time From EN input to 5-V power output 90% point 187 µs
IO Output current VBAT = 2.3 V to 5.5 V 55 mA
Reverse leakage current, VO EN = LOW, VO = 5.5 V 2.5 µA
Leakage current from battery to VO EN = LOW 5 µA
VBATUV Undervoltage lockout threshold Falling 2 V
Rising 2.1 V
Line transient response VBAT = 3.4 V, IO = 20 mA to 65 mA, A 217 Hz,
600 mVPP square wave pulse		 17.1 mVpk
Load transient response VBAT = 3.4 V, IO = 5 mA to 65 mA, 10-µs pulse,
tRISE = tFALL = 0.1 µs		 63.5 mVpk
IINRUSH Inrush current, average over tSTART VBAT = 2.3 V to 5.5 V, IOUT = 65 mA 168 mA
ISC Short-circuit current limit from output 90 mA
VOLTAGE LEVEL SHIFTER CEC LINE (x_A & x_B PORTS)
VOHA IOH = –10 µA, VI = VIH, VCCA = 1.2 V to 3.6 V VCCA × 0.8 V
VOLA IOL = 10 µA, VI = VIL, VCCA = 1.2 V to 3.6 V VCCA × 0.16 V
VOHB IOH = –20 µA, VI = VIH VCCA × 0.8 V
VOLB IOL = 3 mA, VI = VIL 0.4 V
RPU Internal pullup CEC_A Pullup connected to VCCA rail 10 kΩ
CEC_B Pullup connected to 3.3 V rail 22 26 30
RPD Internal pulldown CEC_B Pullup connected to GND 14 MΩ
IOFF A port VCCA = 0 V, VI or VO = 0 to 3.6 V, VCCA = 0 V ±5 µA
B port 5VOUT = 0 V, VI or VO = 0 to 5.5 V, VCCA = 0 V to 3.6 V ±1.8
IOZ A port VO = VCCO or GND, VCCA = 1.2 V to 3.6 V ±5
B port VI = VCCI or GND, VCCA = 1.2 V to 3.6 V ±5
VOLTAGE LEVEL SHIFTER - HPD LINE (X_A & x_B)
VOHA IOH = –3 mA, VI = VIH, VCCA = 1.2 V to 3.6 V VCCA × 0.7 V
VOLA IOL = 3 mA, VI = VIL, VCCA = 1.2 V to 3.6 V 0.4 V
RPD Internal pulldown HPD_B Pullup connected to GND 100 kΩ
IOZ A port VI = VCCI or GND, VCCA = 3.6 V ±5 µA
LS_OE, EN
II VI = VCCA or GND, VCCA = 1.2 V to 3.6 V ±12
(1) Includes voltage references, DC load and line regulations, process and temperature.
(2) Includes voltage references, DC load and line regulations, transient load and line regulations, ripple, process, and temperature.

6.6 Electrical Characteristics – I/O Capacitances

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Capacitance EN, LS_OE VBIAS = 1.8 V, f = 1 MHz,
30-mVPP AC signal		 VCCA = 3.6 V, VBAT = 5 V 7.1 9.5 pF
SCL_A, SDA_A, CEC_A VCCA = 3.6 V, VBAT = 5 V, EN = LOW 7 pF
HPD_A, HPD_B VCCA = 3.6 V, VBAT = 5 V, EN = LOW 4 pF
SCL_B, SDA_B VBIAS = 2.5 V, f = 100 kHz,
3.5-VPP AC signal		 VCCA = 3.6 V, VBAT = 5 V, EN = LOW, LS_OE = HIGH 10 pF
CEC_B VBIAS = 1.65 V, f = 100 kHz,
2.5-VPP AC signal		 VCCA = 3.6 V, VBAT = 5 V, EN = LOW, LS_OE = HIGH 7 pF
CEC_B VCCA = 0 V, 5V_IN = 0 V 7 pF

6.7 Switching Characteristics – VCCA = 1.2 V

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SCL and SDA LINES (x_A & x_B PORTS)
tPHL High-to-low propagation delay A to B DDC channels enabled 394 ns
B to A DDC channels enabled 347
tPLH Low-to-high propagation delay A to B DDC channels enabled 504 ns
B to A DDC channels enabled 171
tFALL Fall time A port DDC channels enabled 146 ns
B port DCC channels enabled 135
tRISE Rise time A port DCC channels enabled 190 ns
B port DCC channels enabled 93
fMAX Maximum switching frequency DCC channels enabled 400 kHz
CEC LINE (x_A & x_B PORTS)
tPHL High-to-low propagation delay A to B CEC channels enabled 550 ns
B to A CEC channels enabled 350
tPLH Low-to-high propagation delay A to B CEC channels enabled 13 µs
B to A CEC channels enabled 290 ns
tFALL Fall time A port CEC channels enabled 146 ns
B port CEC channels enabled 200
tRISE Rise time A port CEC channels enabled 190 ns
B port CEC channels enabled 16.4 µs
HPD LINE (x_A & x_B PORTS)
tPHL Propagation delay B to A CEC channels enabled 10.4 ns
tPLH Low-to-high propagation delay B to A CEC channels enabled 9.9 ns
tFALL Fall time A port CEC channels enabled 0.7 ns
tRISE Rise time A port CEC channels enabled 0.8 ns

6.8 Switching Characteristics – VCCA = 1.5 V

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SCL, SDA LINES (x_A & x_B PORTS)
tPHL High-to-low propagation delay A to B DDC channels enabled 375 ns
B to A DDC channels enabled 272
tPLH Low-to-high propagation delay A to B DDC channels enabled 488 ns
B to A DDC channels enabled 166
tFALL Fall time A port DDC channels enabled 114 ns
B port DCC channels enabled 135
tRISE Rise time A port DCC channels enabled 186 ns
B port DCC channels enabled 93
fMAX Maximum switching frequency DCC channels enabled 400 kHz
CEC Line (x_A & x_B Ports)
tPHL High-to-low propagation delay A to B CEC channels enabled 536 ns
B to A CEC channels enabled 272
tPLH Low-to-high propagation delay A to B CEC channels enabled 13 µs
B to A CEC channels enabled 285 ns
tFALL Fall time A port CEC channels enabled 113 ns
B port CEC channels enabled 201
tRISE Rise time A port CEC channels enabled 187 ns
B port CEC channels enabled 16 µs
HPD LINE (x_A & x_B PORTS)
tPHL High-to-low propagation delay B to A CEC channels enabled 10 ns
tPLH Low-to-high propagation delay B to A CEC channels enabled 10 ns
tFALL Fall time A port CEC channels enabled 0.46 ns
tRISE Rise time A port CEC channels enabled 0.5 ns

6.9 Switching Characteristics – VCCA = 1.8 V

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SCL, SDA LINES (x_A & x_B PORTS)
tPHL High-to-low propagation delay A to B DDC channels enabled 370 ns
B to A DDC channels enabled 230
tPLH Low-to-high propagation delay A to B DDC channels enabled 480 ns
B to A DDC channels enabled 163
tFALL Fall time A port DDC channels enabled 100 ns
B port DCC channels enabled 135
tRISE Rise time A port DCC channels enabled 180 ns
B port DCC channels enabled 93
fMAX Maximum switching frequency DCC channels enabled 400 kHz
CEC LINE (x_A & x_B PORTS)
tPHL High-to-low propagation delay A to B CEC channels enabled 530 ns
B to A CEC channels enabled 230
tPLH Low-to-high propagation delay A to B CEC channels enabled 13 µs
B to A CEC channels enabled 280 ns
tFALL Fall time A port CEC channels enabled 98 ns
B port CEC channels enabled 200
tRISE Rise time A port CEC channels enabled 180 ns
B port CEC channels enabled 16 µs
HPD LINE (x_A & x_B PORTS)
tPHL High-to-low propagation delay B to A CEC channels enabled 10 ns
tPLH Low-to-high propagation delay B to A CEC channels enabled 10 ns
tFALL Fall time A port CEC channels enabled 0.41 ns
tRISE Rise time A port CEC channels enabled 0.41 ns

6.10 Switching Characteristics – VCCA = 2.5 V

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SCL, SDA LINES (x_A & x_B PORTS)
tPHL High-to-low propagation delay A to B DDC channels enabled 370 ns
B to A DDC channels enabled 185
tPLH Low-to-high propagation delay A to B DDC channels enabled 467 ns
B to A DDC channels enabled 160
tFALL Fall time A port DDC channels enabled 80 ns
B port DCC channels enabled 135
tRISE Rise time A port DCC channels enabled 179 ns
B port DCC channels enabled 93
fMAX Maximum switching frequency DCC channels enabled 400 kHz
CEC LINE (x_A & x_B PORTS)
tPHL High-to-low propagation delay A to B CEC channels enabled 530 ns
B to A CEC channels enabled 185
tPLH Low-to-high propagation delay A to B CEC channels enabled 13 µs
B to A CEC channels enabled 275 ns
tFALL Fall time A port CEC channels enabled 80 ns
B port CEC channels enabled 200
tRISE Rise time A port CEC channels enabled 180 ns
B port CEC channels enabled 16 µs
HPD LINE (x_A & x_B PORTS)
tPHL High-to-low propagation delay B to A CEC channels enabled 10 ns
tPLH Low-to-high propagation delay B to A CEC channels enabled 10 ns
tFALL Fall time A port CEC channels enabled 0.35 ns
tRISE Rise time A port CEC channels enabled 0.35 ns

6.11 Switching Characteristics – VCCA = 3.3 V

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SCL, SDA LINES (x_A & x_B PORTS)
tPHL High-to-low propagation delay A to B DDC channels enabled 370 ns
B to A DDC channels enabled 160
tPLH Low-to-high propagation delay A to B DDC channels enabled 460 ns
B to A DDC channels enabled 155
tFALL Fall time A port DDC channels enabled 75 ns
B port DCC channels enabled 135
tRISE Rise time A port DCC channels enabled 180 ns
B port DCC channels enabled 93
fMAX Maximum switching frequency DCC channels enabled 400 kHz
CEC LINE (x_A & x_B PORTS)
tPHL High-to-low propagation delay A to B CEC channels enabled 530 ns
B to A CEC channels enabled 160
tPLH Low-to-high propagation delay A to B CEC channels enabled 13 µs
B to A CEC channels enabled 275 ns
tFALL Fall time A port CEC channels enabled 73 ns
B port CEC channels enabled 200
tRISE Rise time A port CEC channels enabled 180 ns
B port CEC channels enabled 16 µs
HPD LINE (x_A & x_B PORTS)
tPHL High-to-low propagation delay B to A CEC channels enabled 10 ns
tPLH Low-to-high propagation delay B to A CEC channels enabled 10 ns
tFALL Fall time A port CEC channels enabled 0.34 ns
tRISE Rise time A port CEC channels enabled 0.36 ns

6.12 Typical Characteristics

TPD5S115 C001_SLVSBL2.gif
Figure 1. Voltage vs Time
TPD5S115 C003_SLVSBL2.png
Figure 3. Current vs Time
TPD5S115 C005_SLVSBL2.png
Figure 5. Frequency vs Output Current
TPD5S115 C007_SLVSBL2.png
Figure 7. Supply Current vs Supply Voltage
TPD5S115 C009_SLVSBL2.png
Figure 9. Output Voltage vs Output Current
TPD5S115 C011_SLVSBL2.png
Figure 11. Efficiency vs Output Current
TPD5S115 C002_SLVSBL2.gif
Figure 2. Voltage vs Time
TPD5S115 C004_SLVSBL2.png
Figure 4. Voltage vs Time
TPD5S115 C006_SLVSBL2.png
Figure 6. Output Voltage vs Input Voltage
TPD5S115 C008_SLVSBL2.png
Figure 8. Voltage and Current vs Time
TPD5S115 C010_SLVSBL2.png
Figure 10. Efficiency vs Input Voltage
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