ZHCSAD1D October   2012  – June 2017 TPD5S115

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Electrical Characteristics - I/O Capacitances
    7. 6.7  Switching Characteristics - VCCA = 1.2 V
    8. 6.8  Switching Characteristics - VCCA = 1.5 V
    9. 6.9  Switching Characteristics - VCCA = 1.8 V
    10. 6.10 Switching Characteristics - VCCA = 2.5 V
    11. 6.11 Switching Characteristics - VCCA = 3.3 V
    12. 6.12 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Rise-Time Accelerators
      2. 7.3.2 Hot Plug Detect
      3. 7.3.3 CEC Level Shift Operation
      4. 7.3.4 Pullup Resistor
      5. 7.3.5 Undervoltage Lockout
      6. 7.3.6 Soft Start
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power-Save Mode
      2. 7.4.2 Enable
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 DDC or CEC Level Shifter
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 DDC or CEC Level Shifter Operational Notes for VCCA = 1.8 V
          2. 8.2.1.2.2 Input Capacitor
          3. 8.2.1.2.3 Output Capacitor
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Other Application Circuits
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 文档支持
      1. 11.1.1 相关文档
    2. 11.2 接收文档更新通知
    3. 11.3 社区资源
    4. 11.4 商标
    5. 11.5 静电放电警告
    6. 11.6 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

8 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality.

8.1 Application Information

The TPD5S115 is an integrated solution for HDMI 2.0, 1.3, and 1.4 interfaces. The device has a boost converter on the power supply, signal conditioning circuits on CEC, SCL, SDA, and HPD lines, and ESD protection on all the connector-facing lines.

8.2 Typical Applications

8.2.1 DDC or CEC Level Shifter

The TPD5S115 enables DDC translation from VCCA (system side) voltage levels to 5-V (HDMI cable side) voltage levels without degradation of system performance. The TPD5S115 contains 2 bidirectional, open-drain buffers specifically designed to support up and down-translation between the low voltage, VCCA side DDC-bus and the 5-V DDC-bus. The port B I/Os are overvoltage tolerant to 5.5 V, even when the device is shutdown. After power up and with the LS_OE and EN pins HIGH, a LOW level on port A (below VILC = 0.08 × VCCA) turns the corresponding port B driver (either SDA or SCL) on and drives port B down to VOLB. When port A rises above approximately 0.10 × VCCA, the port B pulldown driver is turned off and the internal pullup resistor pulls the pin HIGH. When port B falls first and goes below 0.3 × VOUT, a CMOS hysteresis input buffer detects the falling edge, turns on the port A driver, and pulls port A down to approximately VOLA = 0.16 × VCCA. The port B pulldown is not enabled unless the port A voltage goes below VILC. If the port A low voltage goes below VILC, the port B pulldown driver is enabled until port A rises above (VILC + ΔVT-HYSTA), then port B, if not externally driven LOW, continues to rise being pulled up by the internal pullup resistor.

TPD5S115 app01_lvsbl2.gif Figure 13. DDC or CEC Level Shifter Block Diagram

8.2.1.1 Design Requirements

For this design example, use the parameters listed in Table 1 as the input parameters.

Table 1. Design Parameters

PARAMETER VALUE
5VOUT DC current 55 mA
CEC_A, HPD_A, SCL_A, SDA_A voltage level VCCA
HDMI 2.0 data rate per TMDS signal pair 6 Gbps
Required IEC 61000-4-2 ESD Protection ±8-kV contact

8.2.1.2 Detailed Design Procedure

8.2.1.2.1 DDC or CEC Level Shifter Operational Notes for VCCA = 1.8 V

  • The threshold of CMP1 is approximately 150 mV ± the 40 mV of total hysteresis
  • The comparator trips for a falling waveform at approximately 130 mV
  • The comparator trips for a rising waveform at approximately 170 mV
  • To be recognized as a zero, the level at port A must first go below 130 mV (VILC in spec) and then stay below 170 mV (VILA in spec)
  • To be recognized as a one, the level at A must first go above 170 mV and then stay above 130 mV
  • VILC is specified as 110 mV in Electrical Characteristics to give some margin to the 130 mV
  • VILA is specified as 140 mV in Electrical Characteristics to give some margin to the 170 mV
  • VIHA is specified as 70% of VCCA to be consistent with standard CMOS levels

8.2.1.2.2 Input Capacitor

Due to the nature of the boost converter having a pulsating input current, a low-ESR input capacitor is required to prevent large voltage transients that can cause poor performance of the device or interference with other circuits in the system. TI recommends a 1.2-µF (minimum) input capacitor to improve transient behavior of the regulator and EMI behavior of the total power-supply circuit. TI recommends placing a ceramic capacitor (4.7 µF) as close as possible to the VIN and GND pins to improve the input noise filtering.

8.2.1.2.3 Output Capacitor

TI recommends using a small ceramic capacitors placed as close as possible to the VOUT and GND pins of the IC. If the application requires the use of large capacitors which can not be placed close to the IC, TI recommends using a smaller ceramic capacitor in parallel to the large capacitor. This small capacitor must be placed as close as possible to the VOUT and GND pins of the IC. Use Equation 1 to estimate the recommended minimum output capacitance.

Equation 1. TPD5S115 appeq01_lvsbl2.gif

where

  • f is the switching frequency
  • ΔV is the maximum allowed ripple

If a ripple voltage of 10 mV is chosen, a minimum effective capacitance of 2.7 µF is needed. The total ripple is larger due to the ESR of the output capacitor. This additional component of the ripple can be calculated using Equation 2.

Equation 2. TPD5S115 appeq02_lvsbl2.gif

To maintain control loop stability, a capacitor with a value in the range of the calculated minimum must be used. There are no additional requirements regarding minimum ESR. There is no upper limit for the output capacitance value. Larger capacitors cause lower output voltage ripple as well as lower output voltage drop during load transients.

Ceramic capacitors have a DC-bias effect, which has a strong influence on the final effective capacitance needed. Therefore the appropriate capacitor value must be chosen very carefully. Package size, voltage rating, and material are responsible for differences between the rated capacitor value and the effective capacitance. The minimum effective capacitance value is 1.2 µF, but the recommended value is 4.7 µF.

Table 2. Passive Components: Recommended Effective Values

COMPONENT MIN TYP MAX UNIT
CIN 1.2 4.7 6.5 µF
COUT 1.2 4.7 10 µF
LIN 0.7 1 1.3 µH
CVCCA 0.1 µF

8.2.1.3 Application Curve

TPD5S115 app02_lvsbl2.gif Figure 14. DDC Level Shifter Operation (B to A Direction)

8.2.2 Other Application Circuits

Figure 15 and Figure 16 show application examples using the TPD5S115 devices. Customers must fully validate and test any circuit before implementing a design based on an example in this section. Unless otherwise noted, the design procedures in DDC or CEC Level Shifter are applicable.

TPD5S115 system1.gif Figure 15. Application Schematic for HDMI Controllers With One GPIO for HDMI Interface Control

Some HDMI controllers may have only one GPIO to control the HDMI interface, thus, the HDMI driver chip controls the TPD5S115 through only one control line (EN). In this mode the HPD_A to LS_OE pins are connected to each other (see Figure 15).

TPD5S115 system2.gif Figure 16. Application Schematic for HDMI Controllers With Two GPIOs for HDMI Interface Control

Some HDMI driver chips may have two GPIOs to control the HDMI interface chip. In this case a flexible power saving mode can be implemented. The LS_OE and EN are active-high enable pins. They control the TPD5S115 power-saving options according to Table 3 and Table 4.

Table 3. Device Status – Part 1

LS_OE EN VCCA VBAT 5VOUT A-SIDE PULLUPS DCC, B-SIDE PULLUPS CEC, B-SIDE PULLUPS
L L 1.8 V 5 V Off Off Off Off
L H 1.8 V 5 V On On On Off
H L 1.8 V 5 V Off Off Off Off
H H 1.8 V 5 V On On On On
X X 0 V 0 V High-Z High-Z High-Z High-Z
X X 1.8 V 0 V Low Low High-Z High-Z
X X 0 V 5 V High-Z High-Z High-Z High-Z

Table 4. Device Status – Part 2

LS_OE EN CEC LDO DC-DC AND HPD DDC OR CEC VLTS ICCA TYP ICC VBAT TYP COMMENT
L L Off Off OFF and High-Z 1 µA 1 µA Fully disabled
L H Off On OFF and High-Z 1 µA 30 µA DC-DC (30 µA) ON
H L Off Off OFF and High-Z 1 µA 1 µA Not valid state
H H On On ON 13 µA 225 µA Fully ON
X X Off Off High-Z 0 µA 0 µA Power down
X X Off Off High-Z 0 µA 0 µA Power down
X X Off Off High-Z 0 µA 0 µA Power down
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