ZHCSDL8A December   2014  – February 2015 TPD6F002-Q1

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
  4. 简化电路原理图
  5. 修订历史记录
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 AEC-Q101 Qualified
      2. 8.3.2 Six-Channel EMI Filtering
      3. 8.3.3 Pi-Style Filter Configuration
      4. 8.3.4 Robust ESD Protection
      5. 8.3.5 Low Leakage Current
      6. 8.3.6 Space-Saving SON Package
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Signal Range on All Protected Lines
        2. 9.2.2.2 Operating Frequency
        3. 9.2.2.3 Crosstalk Response
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 商标
    2. 12.2 静电放电警告
    3. 12.3 术语表
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

8 Detailed Description

8.1 Overview

The TPD6F002-Q1 is a highly integrated device that provides a six channel EMI filter and a TVS based ESD protection diode array. The low-pass filter array suppresses EMI/RFI emissions for data ports subject to electromagnetic interference. The TPD6F002-Q1 is rated to dissipate ESD strikes above the maximum level specified in the IEC 61000-4-2 international standard. The high level of integration, combined with its small easy-to-route DSV package, makes this device ideal for protecting interfaces like LCD displays, memory interfaces, and FPD-Link.

8.2 Functional Block Diagram

TPD6F002-Q1 schem_lls876.gif

8.3 Feature Description

The TPD6F002-Q1 is a highly integrated device that provides a six channel EMI filter and a TVS based ESD protection diode array. The low-pass filter array suppresses EMI/RFI emissions for data ports subject to electromagnetic interference. The TVS diode array is rated to dissipate ESD strikes above the maximum level specified in the IEC 61000-4-2 international standard. The high level of integration, combined with its small easy-to-route DSV package, allows this device to provide great circuit protection for LCD displays, memory interfaces, GPIO lines, and FPD-Link.

8.3.1 AEC-Q101 Qualified

This device is qualified to AEC-Q101 standards. It passes HBM H3B (±8 kV) and CDM C5 (±1 kV) ESD ratings and is qualified to operate from –40°C to 125°C.

8.3.2 Six-Channel EMI Filtering

This device provides six channels for EMI filtering of data lines with the following parameters:

  • –47 dB Crosstalk Attenuation at 100 MHz
  • –30 dB Insertion Loss at 800 MHz
  • –3 dB Bandwidth: 100 MHz

8.3.3 Pi-Style Filter Configuration

This device has a pi-style filtering configuration composed of a series resistor and two capacitors in parallel with the I/O pins. The typical resistor value is 100 Ω and the typical capacitor values are 17 pF each.

8.3.4 Robust ESD Protection

The ESD protection on all pins exceeds the IEC 61000-4-2 level 4 standard. Contact ESD is rated at ±20 kV and Air-gap ESD is rated at ±30 kV.

8.3.5 Low Leakage Current

The I/O pins feature an ultra-low leakage current of 20-nA (max) with a bias of 3.3 V

8.3.6 Space-Saving SON Package

The layout of this device makes it easy to add protection to existing layouts. The packages offer flow-through routing which requires minimal changes to existing layout for addition of these devices. Additionally, the device offers a small space-saving package that takes a minimal footprint on the board.

8.4 Device Functional Modes

The TPD6F002-Q1 is a passive integrated circuit that passively filters EMI and triggers when voltages are above VBR or below the lower diode voltage (–0.6 V). During ESD events, voltages as high as ±30 kV (air) can be directed to ground via the internal diode network. Once the voltages on the protected line fall below the trigger levels, the device reverts to passive.