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SLLSE33E August 2010 – December 2016 TPD7S019

PRODUCTION DATA.

封装选项

机械数据 (封装 | 引脚)

RSV|16
- MPQF205F
DBQ|16
- MSOI004H

散热焊盘机械数据 (封装 | 引脚)

订购信息

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)⁽¹⁾

				MIN	MAX	UNIT
Supply voltage	V_{CC_VIDEO}			–0.5	6	V
	V_{CC_DDC}			–0.5	6
	V_{CC_SYNC}			–0.5	6
IO voltage	V_IO(VIDEO)	VIDEOx pins		–0.5	V_{CC_VIDEO}	V
Input voltage	V_I(SYNC)	SYNC pins		–0.5	V_{CC_SYNC}	V
Input voltage	V_I(DDC)	DDC_INx pins		–0.5	6	V
Output voltage	V_O(DDC)	DDC_INx pins		–0.5	6	V
Input clamp current	I_IK	SYNC_INx, DDC_INx, VIDEOx	V_I < 0	–50		mA
Output clamp current	I_OK	SYNC_OUTx, DDC_OUTx	V_O< 0	–50		mA
Continuous output current	I_O	SYNC_OUTx		–24	24	mA
Continuous output current	I_O	DDC_INx to DDC_OUTx		–5	5	mA
Continuous current through supply pins		V_{CC_VIDEO}, V_{CC_SYNC}, V_{CC_DDC}		–50	50	mA
Storage temperature	T_stg			–55	125	°C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

				VALUE	UNIT
TPD7S019 in RSV Package
V_(ESD)	Electrostatic discharge	Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾	All pins except 1, 2, 3, 4, 7, 10, 12, and 14	±2000	V
			Pins 1, 2, 3, 7, 10, 12, and 14	±15000
			Pin 4	±2000
		Charged-device model (CDM), per JEDEC specification JESD22-C101⁽²⁾		±1000
		IEC 61000-4-2 contact discharge	Pins 1, 2, 3, 7, 10, 12, and 14	±8000
TPD7S019 in DBQ Package
V_(ESD)	Electrostatic discharge	Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾	All pins except 3, 4, 5, 6, 9, 12, 14, and 16	±2000	V
			Pins 3, 4, 5, 9, 12, 14, and 16	±15000
			Pin 6	±2000
		Charged-device model (CDM), per JEDEC specification JESD22-C101⁽²⁾		±1000
		IEC 61000-4-2 contact discharge	Pins 3, 4, 5, 9, 12, 14, and 16	±8000

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

			MIN	MAX	UNIT
Supply voltage	V_{CC_VIDEO}		0	5.5	V
	V_{CC_DDC}		0	5.5
	V_{CC_SYNC}		0	5.5
IO voltage	V_IO(VIDEO)	VIDEOx pins	0	V_{CC_VIDEO}	V
Input voltage	V_I(SYNC)	SYNC pins	0	V_{CC_SYNC}	V
Input voltage	V_I(DDC)	DDC_INx pins	0	5.5	V
Output voltage	V_O(DDC)	DDC_INx Pins	0	5.5	V
Operating temperature	T_A		–40	85	°C

6.4 Thermal Information

THERMAL METRIC⁽¹⁾		TPD7S019		UNIT
		DBQ (SSOP)	RSV (UQFN)
		16 PINS	16 PINS
R_θJA	Junction-to-ambient thermal resistance	115.8	124.5	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	67	52.7	°C/W
R_θJB	Junction-to-board thermal resistance	58.3	53.8	°C/W
ψ_JT	Junction-to-top characterization parameter	19.9	1.4	°C/W
ψ_JB	Junction-to-board characterization parameter	57.9	53.8	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	N/A	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

6.5 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)

PARAMETER		TEST CONDITIONS		MIN	TYP	MAX	UNIT
I_{CC_VIDEO}	V_{CC_VIDEO} supply current	V_{CC_VIDEO} = 5 V, VIDEO inputs at V_{CC_VIDEO} or GND			1	10	µA
I_{CC_DDC}	V_{CC_DDC} supply current	V_{CC_DDC} = 5 V			1	10	µA
I_{CC_SYNC}	V_{CC_SYNC} supply current	V_{CC_SYNC} = 5 V	SYNC inputs at GND or V_{CC_SYNC}, SYNC outputs unloaded		1	50	µA
I_{CC_SYNC}	V_{CC_SYNC} supply current	V_{CC_SYNC} = 5 V	SYNC inputs at 3 V; SYNC outputs unloaded			2	mA
I_{IO_VIDEO}	VIDEO input and output pins	V_{IO_VIDEO} = 3 V			0.01	1	µA
I_OFF	DDC pin power down leakage current	V_{CC_DDC} ≤ 0.4 V, V_{DDC_OUT} = 5 V			0.01	1	µA
V_D	Diode forward voltage for lower clamp of VIDEO, DDC, SYNC output pins	I_D = 8 mA, lower clamp diode		–0.6	–0.8	–0.95	V
R_{DYN_VIDEO}	Dynamic resistance (VIDEO pins)	I = 1 A			1		Ω
V_IH	High-level SYNC logic input voltage	V_{CC_SYNC} = 5 V		2			V
V_IL	Low-level SYNC logic input voltage	V_{CC_SYNC} = 5 V				0.6	V
V_OH	High-level SYNC logic output voltage	I_OH = 0 mA, V_{CC_SYNC} = 5 V		4.85			V
V_OH	High-level SYNC logic output voltage	I_OH = –24 mA, V_{CC_SYNC} = 5 V		2			V
V_OL	Low-level SYNC logic output voltage	I_OL = 0 mA, V_{CC_SYNC} = 5 V				0.15	V
V_OL	Low-level SYNC logic output voltage	I_OL = 24 mA, V_{CC_SYNC} = 5 V				0.8	V
R_T	SYNC driver output resistance	V_{CC_SYNC} = 5 V, SYNC inputs at GND or 3 V			15		Ω
C_{IO_VIDEO}	IO capacitance of VIDEO pins	V_IO = 2.5 V, test frequency is 1 MHz			2.5	4	pF
t_PLH	SYNC driver L => H propagation delay	C_L = 50 pF; V_CC = 5 V, input t_R and t_F ≤ 5ns				12	ns
t_PHL	SYNC driver H => L propagation delay	C_L = 50 pF; V_CC = 5 V, input t_R and t_F ≤ 5ns				12	ns
t_R, t_F	SYNC driver output rise & fall times	C_L = 50 pF; V_CC = 5 V, input t_R and t_F ≤ 5ns			4		ns
V_BR	VIDEO ESD diode break-down voltage	I_IO = 1 mA		9			V

6.6 Typical Characteristics

T_rf= 10 ns

Figure 1. TPD7S019-xx TLP VID1 to GND, Barth

TPD7S019 g_amplitude_time_neg_llse33.gif

Figure 3. TPD7S019-xx IEC Clamping Waveforms Negative Contact

V_{CC_DDC} = 0 V

Figure 5. I_OFF (DDC_OUTx)

Figure 2. TPD7S019-xx IEC Clamping Waveforms Positive Contact

V_{CC_VIDEO} = 5 V

Figure 4. Leakage Current through VIDEO Pins