ZHCSE79C March   2011  – September 2015

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Operating Characteristics
    7. 6.7 Timing Requirements
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Voltage Divider Mode
      3. 7.4.3 Rheostat Mode
    5. 7.5 Programming with I2C
      1. 7.5.1 I2C General Operation
        1. 7.5.1.1 I2C Interface
        2. 7.5.1.2 START and STOP Conditions
        3. 7.5.1.3 Data Validity and Byte Formation
        4. 7.5.1.4 Acknowledge (ACK) and Not Acknowledge (NACK)
      2. 7.5.2 I2C Write and Read Operation
        1. 7.5.2.1 Auto Increment Function
        2. 7.5.2.2 Write Operation
        3. 7.5.2.3 Repeated Start
        4. 7.5.2.4 Read Operation
    6. 7.6 Register Maps
      1. 7.6.1 Slave Address
      2. 7.6.2 TPL0102 Register Map
      3. 7.6.3 IVRA (Initial Value Register for Potentiometer A)
      4. 7.6.4 WRA (Wiper Resistance Register for Potentiometer A)
      5. 7.6.5 IVRB (Initial Value Register for Potentiometer B)
      6. 7.6.6 WRB (Wiper Resistance Register for Potentiometer B)
      7. 7.6.7 ACR (Access Control Register)
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Adjustable Gain Non-Inverting Amplifier
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Digital to Analog Converter (DAC)
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
      3. 8.2.3 Variable Current Sink
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
          1. 8.2.3.2.1 Compensation Components
        3. 8.2.3.3 Application Curves
  9. 9 Power Supply Recommendations
    1. 9.1 Power Sequence
    2. 9.2 Wiper Position Upon Power Up
    3. 9.3 Dual-Supply vs Single-Supply
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 社区资源
    2. 11.2 商标
    3. 11.3 静电放电警告
    4. 11.4 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 修订历史记录

Changes from B Revision (August 2011) to C Revision

  • 已添加 ESD 额定值表，特性 描述部分，器件功能模式，应用和实施部分，电源相关建议部分，布局部分，器件和文档支持部分以及机械、封装和可订购信息部分 Go

Changes from A Revision (March 2011) to B Revision

  • Added Recommended Operating Conditions table.Go
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