米6体育平台手机版

ZHCSEK6A January 2015 – September 2018 TPL5010

PRODUCTION DATA.

THERMAL METRIC⁽¹⁾		TPL5010	UNIT
		DDC (SOT-23)
		6 PINS
R_θJA	Junction-to-ambient thermal resistance	163	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	26	°C/W
R_θJB	Junction-to-board thermal resistance	57	°C/W
ψ_JT	Junction-to-top characterization parameter	7.5	°C/W
ψ_JB	Junction-to-board characterization parameter	57	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report (SPRA953).