ZHCSGA2A May   2017  – May 2018 TPL7407LA

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
    1.     Device Images
      1.      简化应用原理图
  4. 修订历史记录
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Inductive Load Drive
      2. 7.4.2 Resistive Load Drive
      3. 7.4.3 ON State Input Current
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Unipolar Stepper Motor Driver
      2. 8.1.2 Multi-Purpose Sink Driver
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 TTL and other Logic Inputs
        2. 8.2.2.2 Input RC Snubber
        3. 8.2.2.3 High-Impedance Input Drivers
        4. 8.2.2.4 Drive Current
        5. 8.2.2.5 Output Low Voltage
      3. 8.2.3 Application Curve
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
      1. 10.3.1 Improving Package Thermal Performance
  11. 11器件和文档支持
    1. 11.1 接收文档更新通知
    2. 11.2 社区资源
    3. 11.3 商标
    4. 11.4 静电放电警告
    5. 11.5 术语表
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Layout Guidelines

Thin traces can be used on the input due to the low current logic that is typically used to drive the TPL7407LA. Care must be taken to separate the input channels as much as possible, so as to eliminate cross-talk. Thick traces are recommended for the output, in order to drive whatever high currents that may be needed. Wire thickness can be determined by the trace material's current density and desired drive current.

Since all of the channels currents return to a common ground, it is best to size that trace width to be very wide. Some applications require up to 2 A.

Since the COM pin only draws up to 30 µA, thick traces are not necessary.