6.1 Absolute Maximum Ratings
at 25°C free-air temperature (unless otherwise noted) (1)
|
MIN |
MAX |
UNIT |
| VOUT |
Pins OUT1-OUT7 to GND voltage |
–0.3 |
32 |
V |
| VOK |
Output clamp diode reverse voltage(2) |
–0.3 |
32 |
V |
| VCOM |
COM pin voltage(2) |
–0.3 |
32 |
V |
| VIN |
Pins IN1-IN7 to GND voltage (2) |
–0.3 |
30 |
V |
| IDS |
Continuous drain current per channel(3)(4) |
|
600 |
mA |
| IOK |
Output clamp current |
|
500 |
mA |
| IGND |
Total continuous GND-pin current |
|
–2 |
A |
| TJ |
Operating virtual junction temperature |
–40 |
150 |
°C |
| Tstg |
Storage temperature |
–65 |
150 |
°C |
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to the GND/substrate pin, unless otherwise noted.
(3) Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
(4) The package thermal impedance is calculated in accordance with JESD 51-7.