ZHCSQN1 October   2023 TPS1210-Q1

ADVANCE INFORMATION  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Revision History
  6. Device Comparison
  7. Pin Configuration and Functions
  8. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Characteristics
  9. Parameter Measurement Information
  10. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Charge Pump and Gate Driver Output (VS, G1PU, G1PD, G2, BST, SRC)
      2. 9.3.2 Capacitive Load Driving Using FET Gate (G1PU, G1PD) Slew Rate Control
      3. 9.3.3 Short-Circuit Protection
        1. 9.3.3.1 Short-Circuit Protection With Auto-Retry
        2. 9.3.3.2 Short-Circuit Protection With Latch-Off
      4. 9.3.4 Undervoltage Protection (UVLO)
      5. 9.3.5 Reverse Polarity Protection
      6. 9.3.6 Short-Circuit Protection Diagnosis (SCP_TEST)
      7. 9.3.7 TPS1210x-Q1 as a Simple Gate Driver
    4. 9.4 Device Functional Modes
  11. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Application Limitations
        1. 10.1.1.1 Short-Circuit Protection Delay
        2. 10.1.1.2 Short-Circuit Protection Threshold
    2. 10.2 Typical Application: Circuit Breaker in Battery Management System (BMS) using Low Side Current Sense
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
    3. 10.3 Power Supply Recommendations
    4. 10.4 Layout
      1. 10.4.1 Layout Guidelines
      2. 10.4.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 接收文档更新通知
    2. 11.2 支持资源
    3. 11.3 Trademarks
    4. 11.4 静电放电警告
    5. 11.5 术语表
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Tape and Reel Information

封装选项

机械数据 (封装 | 引脚)
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订购信息

静电放电警告

GUID-D6F43A01-4379-4BA1-8019-E75693455CED-low.gif 静电放电 (ESD) 会损坏这个集成电路。米6体育平台手机版_好二三四 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理和安装程序,可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级,大至整个器件故障。精密的集成电路可能更容易受到损坏,这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。