SLUSFA1 September   2024 TPS1214-Q1

ADVANCE INFORMATION  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Device Comparison
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
  8. Parameter Measurement Information
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Charge Pump and Gate Driver Output (VS, GATE, BST, SRC)
      2. 8.3.2 Capacitive Load Driving
        1. 8.3.2.1 Using Low Power Bypass FET (G Drive) for Load Capacitor Charging
        2. 8.3.2.2 Using Main FET (GATE drive) Gate Slew Rate Control
      3. 8.3.3 Overcurrent and Short-Circuit Protection
        1. 8.3.3.1 I2t-Based Overcurrent Protection
          1. 8.3.3.1.1 I2t-Based Overcurrent Protection With Auto-Retry
          2. 8.3.3.1.2 I2t-Based Overcurrent Protection With Latch-Off
        2. 8.3.3.2 Short-Circuit Protection
      4. 8.3.4 Analog Current Monitor Output (IMON)
      5. 8.3.5 NTC based Temperature Sensing (TMP) and Analog Monitor Output (ITMPO)
      6. 8.3.6 Fault Indication and Diagnosis (FLT, SCP_TEST)
      7. 8.3.7 Reverse Polarity Protection
      8. 8.3.8 Undervoltage Protection (UVLO)
    4. 8.4 Device Functional Modes
      1. 8.4.1 State Diagram
      2. 8.4.2 State Transition Timing Diagram
      3. 8.4.3 Power Down
      4. 8.4.4 Shutdown Mode
      5. 8.4.5 Low Power Mode (LPM)
      6. 8.4.6 Active Mode (AM)
  10. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application 1: Driving Power at all times (PAAT) Loads With Automatic Load Wakeup
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Typical Application 2: Driving Power at all times (PAAT) Loads With Automatic Load Wakeup and Output Bulk Capacitor Charging
      1. 9.3.1 Design Requirements
      2. 9.3.2 External Component Selection
      3. 9.3.3 Application Curves
    4. 9.4 Power Supply Recommendations
    5. 9.5 Layout
      1. 9.5.1 Layout Guidelines
      2. 9.5.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Support
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Tape and Reel Information
    2. 12.2 Mechanical Data

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Charge Pump and Gate Driver Output (VS, GATE, BST, SRC)

TPS1214-Q1 Gate DriverFigure 8-1 Gate Driver

Figure 8-1 shows a simplified diagram of the charge pump and gate driver circuit implementation. The device houses a strong 0.5A/2A peak source/sink gate driver (GATE) for main FETs Q1 Q2, and 100μA/0.39A peak source/sink current gate driver (G) for bypass FET Q3. The strong gate drivers enable paralleling of FETs in high power system designs ensuring minimum transition time in saturation region. A 12V in active mode, 600μA charge pump is derived from VS terminal and charges the external boot-strap capacitor, CBST that is placed across the gate driver (BST and SRC).

VS is the supply pin to the controller. With VS applied and EN/UVLO pulled high, the charge pump turns ON and charges the CBST capacitor. After the voltage across CBST crosses V(BST_UVLOR), the GATE driver section is activated. The device has a 1V (typical) UVLO hysteresis to ensure chattering less performance during initial GATE turn ON. Choose CBST based on the external FET QG and allowed dip during FET turn ON. In active mode, the charge pump remains enabled until the BST to SRC voltage reaches VCP(HIGH_AM), typically, at which point the charge pump is disabled decreasing the current draw on the VS pin. The charge pump remains disabled until the BST to SRC voltage discharges to VCP(LOW_AM) typically at which point the charge pump is enabled.

The voltage between BST and SRC continue to charge and discharge between VCP(HIGH_AM) and VCP(LOW_AM) in active mode as shown in the following figure:

TPS1214-Q1 Charge Pump OperationFigure 8-2 Charge Pump Operation

Use the following equation to calculate the initial gate driver enable delay:

Equation 1. T D R V _ E N =   C B S T   ×   V ( B S T _ U V L O R ) 600   µ A

Where,

CBST is the charge pump capacitance connected across BST and SRC pins.

V(BST_UVLOR) = 7.6V (typ).

If TDRV_EN needs to be reduced then pre-bias BST terminal externally using an external VAUX or input supply through a low leakage diode D1 as shown in Figure 8-3. With this connection, TDRV_EN reduces to 350µs.

TPS1214-Q1 TPS1214x-Q1 Application
                    Circuit With External Supply to BST Figure 8-3 TPS1214x-Q1 Application Circuit With External Supply to BST
Note: VAUX can be supplied by external supply ranging between 8.1V and 15V. Input supply VS can also be connected to BST via D1 diode for reducing TDRV_EN.