SLUSFA1 September 2024 TPS1214-Q1
ADVANCE INFORMATION
Figure 8-1 shows a simplified diagram of the charge pump and gate driver circuit implementation. The device houses a strong 0.5A/2A peak source/sink gate driver (GATE) for main FETs Q1 Q2, and 100μA/0.39A peak source/sink current gate driver (G) for bypass FET Q3. The strong gate drivers enable paralleling of FETs in high power system designs ensuring minimum transition time in saturation region. A 12V in active mode, 600μA charge pump is derived from VS terminal and charges the external boot-strap capacitor, CBST that is placed across the gate driver (BST and SRC).
VS is the supply pin to the controller. With VS applied and EN/UVLO pulled high, the charge pump turns ON and charges the CBST capacitor. After the voltage across CBST crosses V(BST_UVLOR), the GATE driver section is activated. The device has a 1V (typical) UVLO hysteresis to ensure chattering less performance during initial GATE turn ON. Choose CBST based on the external FET QG and allowed dip during FET turn ON. In active mode, the charge pump remains enabled until the BST to SRC voltage reaches VCP(HIGH_AM), typically, at which point the charge pump is disabled decreasing the current draw on the VS pin. The charge pump remains disabled until the BST to SRC voltage discharges to VCP(LOW_AM) typically at which point the charge pump is enabled.
The voltage between BST and SRC continue to charge and discharge between VCP(HIGH_AM) and VCP(LOW_AM) in active mode as shown in the following figure:
Use the following equation to calculate the initial gate driver enable delay:
Where,
CBST is the charge pump capacitance connected across BST and SRC pins.
V(BST_UVLOR) = 7.6V (typ).
If TDRV_EN needs to be reduced then pre-bias BST terminal externally using an external VAUX or input supply through a low leakage diode D1 as shown in Figure 8-3. With this connection, TDRV_EN reduces to 350µs.